EP0314981B1 - Verfahren zur Herstellung von Schmelzwerkstoffen aus Kupfer, Chrom und wenigstens einer leichtverdampflichen Komponente sowie Abschmelzelektrode zur Verwendung bei einem derartigen Verfahren - Google Patents
Verfahren zur Herstellung von Schmelzwerkstoffen aus Kupfer, Chrom und wenigstens einer leichtverdampflichen Komponente sowie Abschmelzelektrode zur Verwendung bei einem derartigen Verfahren Download PDFInfo
- Publication number
- EP0314981B1 EP0314981B1 EP88117417A EP88117417A EP0314981B1 EP 0314981 B1 EP0314981 B1 EP 0314981B1 EP 88117417 A EP88117417 A EP 88117417A EP 88117417 A EP88117417 A EP 88117417A EP 0314981 B1 EP0314981 B1 EP 0314981B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper
- tellurium
- chromium
- melting
- electrode according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 title claims description 37
- 239000010949 copper Substances 0.000 title claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 22
- 229910052802 copper Inorganic materials 0.000 title claims description 22
- 239000011651 chromium Substances 0.000 title claims description 14
- 238000000034 method Methods 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 title claims description 11
- 229910052804 chromium Inorganic materials 0.000 title claims description 9
- 238000003723 Smelting Methods 0.000 title 1
- 238000002844 melting Methods 0.000 claims description 38
- 230000008018 melting Effects 0.000 claims description 37
- 229910052714 tellurium Inorganic materials 0.000 claims description 27
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 27
- 239000000843 powder Substances 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 18
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 15
- 239000011669 selenium Substances 0.000 claims description 15
- 229910052787 antimony Inorganic materials 0.000 claims description 14
- 239000007787 solid Substances 0.000 claims description 14
- 229910052711 selenium Inorganic materials 0.000 claims description 13
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 10
- GXDVEXJTVGRLNW-UHFFFAOYSA-N [Cr].[Cu] Chemical compound [Cr].[Cu] GXDVEXJTVGRLNW-UHFFFAOYSA-N 0.000 claims description 9
- 229910002531 CuTe Inorganic materials 0.000 claims description 7
- IRPLSAGFWHCJIQ-UHFFFAOYSA-N selanylidenecopper Chemical compound [Se]=[Cu] IRPLSAGFWHCJIQ-UHFFFAOYSA-N 0.000 claims description 6
- QZCHKAUWIRYEGK-UHFFFAOYSA-N tellanylidenecopper Chemical compound [Te]=[Cu] QZCHKAUWIRYEGK-UHFFFAOYSA-N 0.000 claims description 6
- 229910001245 Sb alloy Inorganic materials 0.000 claims description 5
- 239000002140 antimony alloy Substances 0.000 claims description 5
- KGHMFMDJVUVBRY-UHFFFAOYSA-N antimony copper Chemical compound [Cu].[Sb] KGHMFMDJVUVBRY-UHFFFAOYSA-N 0.000 claims description 5
- 229910000765 intermetallic Inorganic materials 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 239000007772 electrode material Substances 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 238000010891 electric arc Methods 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 125000003748 selenium group Chemical group *[Se]* 0.000 claims 1
- 239000000654 additive Substances 0.000 description 6
- 238000010309 melting process Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 238000005275 alloying Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910018030 Cu2Te Inorganic materials 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005204 segregation Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 229910001370 Se alloy Inorganic materials 0.000 description 1
- 229910001215 Te alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010314 arc-melting process Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000289 melt material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B4/00—Electrothermal treatment of ores or metallurgical products for obtaining metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/0203—Contacts characterised by the material thereof specially adapted for vacuum switches
- H01H1/0206—Contacts characterised by the material thereof specially adapted for vacuum switches containing as major components Cu and Cr
Definitions
- the invention relates to a method for producing melting materials made of copper (Cu), chromium (Cr) and at least one highly volatile component, an arc melting method being used in which the electrode material melting from a melting electrode is melted in a water-cooled mold for the purpose of cooling without Macroscopic segregation of copper and chrome is caught.
- the invention also relates to a consumable electrode for use in this method, which consists of copper (Cu) and chromium (Cr) as well as tellurium (Te) and / or selenium (Se) and / or antimony (Sb) as an easily evaporable component predetermined total composition of all components.
- EP-B-0115292 A method of the type mentioned at the outset is known from EP-B-0115292. Materials produced by such a method were initially intended for use as contact materials for vacuum medium-voltage circuit breakers with breaking currents above 10 kA. From EP-A-0172411 it is also known to provide such a material also as a contact material for vacuum contactors, the material for reducing the welding force adding at least one of the metals tellurium (Te), antimony (Sb), bismuth (Bi) and / or tin (Sn) and their alloys. The additives are introduced by subsequent alloying or diffusing into the contact pieces produced by the known method, which is comparatively lengthy and complex.
- Tellurium and / or selenium and / or antimony or bismuth in particular have proven to be suitable as additional components for copper-chromium contact materials for reducing the welding force.
- the elements mentioned are characterized by a high vapor pressure, so that additives of these elements evaporate easily when the arc is melted. Accordingly, it has been shown that the direct alloying of these additives is not possible when arc-melting copper-chromium, since the additives - especially if they are mixed in as a fine powder of the electrode - evaporate due to their high vapor pressure under the influence of the arc and lead to pore formation in the melting block .
- Tellurium or selenium or antimony form intermetallic compounds with copper, the vapor pressure and thus evaporation tendency - as measurements have shown - are reduced compared to the pure components tellurium and selenium or antimony.
- pore formation also occurs when the additives are not mixed as elemental tellurium or selenium or antimony, but as intermetallic compounds Cu2Te or Cu2Se or Cu3Sb in powder form. This is due to the gas loading of the finely divided Cu2Te or Cu2Se or Cu3Sb powder.
- a fine-particle powder has so far been considered essential for homogeneous distribution.
- tellurium has been specifically used after the arc melting and, if appropriate, after a corresponding shaping of the CuCr blanks, for example, by extrusion in a separate manufacturing step. This involves an additional process step that makes the manufacturing process more expensive.
- the object of the invention is to improve the method of the type mentioned at the outset in such a way that an easily evaporable Component can be introduced directly into the material during the melting process.
- suitable consumable electrodes should be specified that can be used in the context of an arc melting process.
- a melting electrode is used to melt the material with the easily evaporable component, which partially consists of a solid alloy of copper with the easily evaporable component, the concentration of the easily evaporable component in the alloy being higher than in Sum composition of the melting material, and that the easily evaporable component remains bound in the melting material during melting.
- the easily evaporable component is at least partially alloyed as an intermetallic compound in the copper, the copper-tellurium or copper Selenium or copper-antimony alloy is present as a solid part in the electrode structure.
- the invention enables the introduction of easily evaporable additives in arc-melted copper-chromium alloys directly during the melting process and thus the production of pore-free CuCrTe or CuCrSe or CuCrSb melting blocks, provided the correspondingly constructed melting electrodes are used.
- the introduction of tellurium in particular in the melting process all effects leading to pore formation are now avoided.
- massive rods of a CuTe alloy, such as CuTe0.6 can be introduced into a tube electrode, which are then coated with CuCr powder.
- 1 denotes a copper tube with the cross-sectional dimensions of, for example, 70 ⁇ 2 mm.
- the copper pipe 1 may, for example OFHC (o Xigen f ree h igh c onductive) - or SF (s auerstof f rei) material may be used.
- Reference numeral 2 denotes a CuCr powder mixture in low-gas quality with a predetermined particle size distribution.
- Fig. 1 three solid rods 3 to 5 with a diameter of 10 mm made of an alloy of, for example, CuTe0.6 are embedded in the powder mixture 2 made of CuCr.
- This material is known according to DIN 17666 under the material number 2.1546 with a tellurium content of 0.4 to 0.7 m%.
- the number of rods can expediently be varied between one and ten, their number and the diameter and the tellurium or selenium or antimony content of the individual rod as a result determine the concentration of the finished material.
- the profile of the individual bar is irrelevant; the rods can, for example, as round or. Square part or be designed as a tube.
- the concentration in the CuCr powder mixture can be varied. Powder from 25 m% Cr up to pure Cr powder are possible.
- FIG. 3 a plurality of individual sections 13 of rods or profiles with a predetermined cross section made of CuTe0.6 material are approximately uniformly embedded in the copper tube 1 with CuCr powder mixture 2. If a melting electrode constructed in this way is used, the highly evaporable component in the melting material is also largely bonded.
- Fig. 4 there is an outer tube 41 with the cross-sectional dimensions 70 ⁇ 2 mm made of CuTe material.
- a CuCr powder mixture 42 is introduced into the tube 41. Even with a melting electrode constructed in this way, the tellurium remains bound during the melting process and alloys into the melting material.
- the composition of the CuCrTe or CuCrSe or CuCrSb melt material to be produced for a given rod diameter should in particular be determined by the number of rods on the one hand and by the tellurium or selenium or antimony content in the rods on the other hand: From a manufacturing point of view it is theoretically possible that rods made of copper-tellurium alloys as solid parts can have a tellurium content of up to 8.2% by mass.
- the table below shows a number of examples specifically for the production of CuCrTe melting materials using a melting electrode according to FIG. 1 or 2, such as the number of rods, their tellurium content and the composition of the copper-chromium powder mixture the concentration of the finished melting material can be influenced.
- a tube electrode with ⁇ 70 ⁇ 2 mm is assumed.
- the tellurium content of the melting material is also determined by the number and diameter of the CuTe rods or the diameter and thickness of the CuTe tube.
- two rods of CuTe0.6 with a diameter of 10 mm already have a tellurium content in the melting material of 0.1 m%.
- the arc melting with the above-described melting electrodes takes place in the manner described in EP-B-0115292 under a protective gas atmosphere; for example, 100 mb helium or argon have proven to be suitable.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Geology (AREA)
- Manufacturing & Machinery (AREA)
- High-Tension Arc-Extinguishing Switches Without Spraying Means (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Crucibles And Fluidized-Bed Furnaces (AREA)
- Discharge Heating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3737135 | 1987-11-02 | ||
DE3737135 | 1987-11-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0314981A1 EP0314981A1 (de) | 1989-05-10 |
EP0314981B1 true EP0314981B1 (de) | 1991-09-18 |
Family
ID=6339604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP88117417A Expired - Lifetime EP0314981B1 (de) | 1987-11-02 | 1988-10-19 | Verfahren zur Herstellung von Schmelzwerkstoffen aus Kupfer, Chrom und wenigstens einer leichtverdampflichen Komponente sowie Abschmelzelektrode zur Verwendung bei einem derartigen Verfahren |
Country Status (7)
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1989001231A1 (en) * | 1987-07-28 | 1989-02-09 | Siemens Aktiengesellschaft | Contact material for vacuum switches and process for manufacturing same |
DE3915155A1 (de) * | 1989-05-09 | 1990-12-20 | Siemens Ag | Verfahren zur herstellung von schmelzwerkstoffen aus kupfer, chrom und wenigstens einer sauerstoffaffinen komponente sowie abschmelzelektrode zur verwendung bei einem derartigen verfahren |
GB2344110A (en) * | 1998-11-27 | 2000-05-31 | George Mcelroy Carloss | The production of alloy granules and their use in hydrogen generation |
JP2011108380A (ja) * | 2009-11-13 | 2011-06-02 | Hitachi Ltd | 真空バルブ用電気接点およびそれを用いた真空遮断器 |
CN102286673B (zh) * | 2011-08-29 | 2013-04-17 | 上海理工大学 | 一种CuCr25Me合金铸坯的制备方法 |
CN103706783B (zh) * | 2013-10-15 | 2017-02-15 | 陕西斯瑞新材料股份有限公司 | 一种高抗熔焊性CuCr40Te触头材料及其制备方法 |
KR102172848B1 (ko) * | 2017-02-07 | 2020-11-02 | 주식회사 엘지화학 | 장수명에 적합한 이차전지용 전극의 제조방법 |
CN111593224B (zh) * | 2020-04-22 | 2021-05-07 | 陕西斯瑞新材料股份有限公司 | 一种铜铬电弧熔炼用自耗电极棒的制备方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4836071B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1968-07-30 | 1973-11-01 | ||
US3933474A (en) * | 1974-03-27 | 1976-01-20 | Norton Company | Leech alloying |
US4088475A (en) * | 1976-11-04 | 1978-05-09 | Olin Corporation | Addition of reactive elements in powder wire form to copper base alloys |
CA1202490A (en) * | 1981-08-26 | 1986-04-01 | Charles B. Adasczik | Alloy remelting process |
DE3303170A1 (de) * | 1983-01-31 | 1984-08-02 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von kupfer-chrom-schmelzlegierungen als kontaktwerkstoff fuer vakuum-leistungsschalter |
US4481030A (en) * | 1983-06-01 | 1984-11-06 | The United States Of America As Represented By The United States Department Of Energy | Tantalum-copper alloy and method for making |
DE3344684A1 (de) * | 1983-12-10 | 1985-06-20 | Leybold-Heraeus GmbH, 5000 Köln | Geschlossener lichtbogenofen fuer abschmelzelektroden |
DE3565907D1 (en) * | 1984-07-30 | 1988-12-01 | Siemens Ag | Vacuum contactor with contact pieces of cucr and process for the production of such contact pieces |
-
1988
- 1988-10-19 EP EP88117417A patent/EP0314981B1/de not_active Expired - Lifetime
- 1988-10-19 DE DE8888117417T patent/DE3864979D1/de not_active Expired - Lifetime
- 1988-10-24 IN IN874/CAL/88A patent/IN171315B/en unknown
- 1988-10-28 US US07/264,327 patent/US4906291A/en not_active Expired - Fee Related
- 1988-10-28 JP JP63274351A patent/JPH0784628B2/ja not_active Expired - Lifetime
- 1988-11-01 CN CN88107634A patent/CN1018934B/zh not_active Expired
- 1988-11-02 KR KR1019880014408A patent/KR960006449B1/ko not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1018934B (zh) | 1992-11-04 |
KR890008336A (ko) | 1989-07-10 |
KR960006449B1 (ko) | 1996-05-16 |
EP0314981A1 (de) | 1989-05-10 |
JPH0784628B2 (ja) | 1995-09-13 |
US4906291A (en) | 1990-03-06 |
CN1041975A (zh) | 1990-05-09 |
JPH01149930A (ja) | 1989-06-13 |
DE3864979D1 (de) | 1991-10-24 |
IN171315B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-09-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0115292B1 (de) | Verfahren zum Herstellen von Kupfer-Chrom-Schmelzlegierungen als Kontaktwerkstoff für Vakuum-Leistungsschalter | |
DE69433453T2 (de) | Vakuumschalter und in diesem verwendeter elektrischer Kontakt | |
DE2346179A1 (de) | Verbundmetall als kontaktwerkstoff fuer vakuumschalter | |
EP0314981B1 (de) | Verfahren zur Herstellung von Schmelzwerkstoffen aus Kupfer, Chrom und wenigstens einer leichtverdampflichen Komponente sowie Abschmelzelektrode zur Verwendung bei einem derartigen Verfahren | |
DE69506776T2 (de) | Vakuumschalter und Verfahren zur Herstellung desselben | |
DE68914905T2 (de) | Kontaktmaterial für einen Vakuumschalter. | |
DE69221398T2 (de) | Verfahren zur Herstellung von Kontaktwerkstoffen für Vakuumschalter | |
EP0586410B1 (de) | Kontaktwerkstoff auf silberbasis zur verwendung in schaltgeräten der energietechnik sowie verfahren zur herstellung von kontaktstücken aus diesem werkstoff | |
EP0172411B1 (de) | Vakuumschütz mit Kontaktstücken aus CuCr und Verfahren zur Herstellung dieser Kontaktstücke | |
DE1558666C2 (de) | Legierung für abbrandsichere elektrische Kontakte | |
DE2514237A1 (de) | Verfahren zur herstellung eines als elektrischer kontakt dienenden materials | |
DE69825227T2 (de) | Vakuumschalter | |
EP0725154A1 (de) | Sinterwerkstoff auf der Basis Silberzinnoxid für elektrische Kontakte und Verfahren zu dessen Herstellung | |
DE69219397T2 (de) | Metalloxidmaterial auf Silberbasis für elektrische Kontakte | |
EP0474628A1 (de) | VERFAHREN ZUR HERSTELLUNG EINES CuCr-KONTAKTWERKSTOFFES FÜR VAKUUMSCHÜTZE SOWIE ZUGEHÖRIGER KONTAKTWERKSTOFF. | |
EP0099066B2 (de) | Verfahren zum Herstellen eines Verbundwerkstoffes aus Chrom und Kupfer | |
EP1130608B1 (de) | Verfahren zum Herstellen eines Kontaktwerkstoffes für Kontaktstücke für Vakuumschaltgeräte sowie Kontaktwerkstoff und Kontaktstücke hierfür | |
EP0586411A1 (de) | Kontaktwerkstoff auf silberbasis zur verwendung in schaltgeräten der energietechnik sowie verfahren zur herstellung von kontaktstücken aus diesem werkstoff. | |
DE102009056504B4 (de) | Verfahren zur Herstellung einer einschlussfreien Nb-Legierung aus pulvermetallurgischem Vormaterial für eine implantierbare medizinische Vorrichtung | |
CH652246A5 (de) | Ueberspannungsableiter. | |
DE69614489T2 (de) | Kontaktmaterial für Vakuumschalter und Verfahren zu dessen Herstellung | |
DE3427034C2 (de) | Verwendung eines durch Bor bzw. Lithium desoxidierten sauerstofffreien Kupfers für Hohlprofile | |
DE3402091C2 (de) | Verbundwerkstoff für elektrische Kontaktstücke | |
EP0234246A1 (de) | Schaltkontaktstücke für Vakuumschaltgeräte und Verfahren zu deren Herstellung | |
DE3915155C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): BE CH DE FR GB IT LI NL SE |
|
17P | Request for examination filed |
Effective date: 19890627 |
|
17Q | First examination report despatched |
Effective date: 19901206 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): BE CH DE FR GB IT LI NL SE |
|
REF | Corresponds to: |
Ref document number: 3864979 Country of ref document: DE Date of ref document: 19911024 |
|
ET | Fr: translation filed | ||
ITF | It: translation for a ep patent filed | ||
GBT | Gb: translation of ep patent filed (gb section 77(6)(a)/1977) | ||
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: CH Payment date: 19920124 Year of fee payment: 4 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed | ||
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: SE Payment date: 19921016 Year of fee payment: 5 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LI Effective date: 19921031 Ref country code: CH Effective date: 19921031 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SE Effective date: 19931020 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: BE Payment date: 19941020 Year of fee payment: 7 |
|
EUG | Se: european patent has lapsed |
Ref document number: 88117417.1 Effective date: 19940510 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 19950918 Year of fee payment: 8 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: NL Payment date: 19951017 Year of fee payment: 8 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BE Effective date: 19951031 |
|
BERE | Be: lapsed |
Owner name: SIEMENS A.G. Effective date: 19951031 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Effective date: 19961019 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Effective date: 19970501 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 19961019 |
|
NLV4 | Nl: lapsed or anulled due to non-payment of the annual fee |
Effective date: 19970501 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 19971029 Year of fee payment: 10 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 19981217 Year of fee payment: 11 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19990630 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20000801 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED. Effective date: 20051019 |