EP0250958B1 - Werkstoff für elektrische Schwachstromkontakte - Google Patents
Werkstoff für elektrische Schwachstromkontakte Download PDFInfo
- Publication number
- EP0250958B1 EP0250958B1 EP87108367A EP87108367A EP0250958B1 EP 0250958 B1 EP0250958 B1 EP 0250958B1 EP 87108367 A EP87108367 A EP 87108367A EP 87108367 A EP87108367 A EP 87108367A EP 0250958 B1 EP0250958 B1 EP 0250958B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- palladium
- gold
- silver
- zinc
- alloys
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 title claims abstract description 16
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 21
- 239000000956 alloy Substances 0.000 claims abstract description 21
- 229910000765 intermetallic Inorganic materials 0.000 claims abstract description 11
- 229910001252 Pd alloy Inorganic materials 0.000 claims abstract description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 25
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 14
- 229910052737 gold Inorganic materials 0.000 claims description 14
- 239000010931 gold Substances 0.000 claims description 14
- 229910052763 palladium Inorganic materials 0.000 claims description 12
- 239000011701 zinc Substances 0.000 claims description 12
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- 229910052725 zinc Inorganic materials 0.000 claims description 11
- 229910052741 iridium Inorganic materials 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 10
- 229910052762 osmium Inorganic materials 0.000 claims description 9
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 claims description 9
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 8
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052707 ruthenium Inorganic materials 0.000 claims description 8
- 229910052703 rhodium Inorganic materials 0.000 claims description 7
- 239000010948 rhodium Substances 0.000 claims description 7
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 7
- 239000010419 fine particle Substances 0.000 abstract description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 229910052738 indium Inorganic materials 0.000 description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 239000012876 carrier material Substances 0.000 description 3
- 238000005253 cladding Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000001953 recrystallisation Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000002687 intercalation Effects 0.000 description 1
- 238000009830 intercalation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 229910000923 precious metal alloy Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/023—Composite material having a noble metal as the basic material
Definitions
- the invention relates to a material for electrical low-voltage contacts, in particular for plug connections and sliding contacts, consisting of a gold-silver-palladium alloy, which can contain small amounts of osmium, iridium, ruthenium and rhodium.
- Mating and sliding contacts especially if they are to be used for the smallest voltages and currents in modern electronic devices, usually consist of carriers made of base metals, which are coated with precious metals or precious metal alloys.
- Three essential requirements are placed on the noble overlay materials. First, they should be as resistant as possible to aggressive atmospheres, so that a low and stable contact resistance is achieved when they are used. Secondly, they should be subject to as little wear as possible in the friction pairing with a contact counterpart and have a low coefficient of friction, so that there is no wear through of the contact layer and the contact actuation forces can be low. Thirdly, an adaptation of the mechanical properties to the carrier materials is required for plating the support materials. In the case of the mechanical roll plating that is usually used, an approximately matching recrystallization temperature of the support and the support is particularly important for producing a high-quality composite material.
- a contact material for low-voltage contacts in particular for telecommunications, which consists of an alloy of 25-35% palladium, 35-45% silver and 25-35% gold.
- alloys for electrical contacts containing indium, tin and other base metals as minor constituents are known from DE-PS 25 40 956 (20-30 wt.% Palladium, 15-25 wt.% Silver, 2, 5-5% by weight tin, 0.05-0.5% by weight iridium, 0.05-0.5% ruthenium, 0.05-0.5% by weight copper, 0.1-2% by weight indium , Balance gold), DE-PS 26 37 807 (10-40% silver, 2-25% palladium, 1-5% nickel, 0.1-10% indium, 0.1-3% tin, balance gold) and DE-PS 29 40 772 (35-55% gold, 18-33.5% silver, 30-40% palladium and 1-6% indium or 0.5-2% indium and 0.5-2% tin) are known .
- Alloys of gold-silver-palladium-iridium and / or osmium with additions of 0.5-5% lead or 0.5-3% lead and 0.5-3% tin are known from DE-OS 33 45 162. Similar alloys based on gold-silver-palladium-iridium and / or osmium with additions of 0-5 at% lead and / or 0-5 at% tin and / or 0-10% copper are in DE-OS 34 20 231 described.
- All of these known alloys either do not have very high mechanical wear resistance (at relatively low levels of base additives) or do not have very good corrosion resistance (at relatively high levels of base additives).
- most of these alloys require soft annealing temperatures of over 750 ° C, sometimes over 900 ° C, which is why they are suitable for processing by roll cladding on typical carrier materials, e.g. CuSn8, poorly suited.
- This object is achieved in that particles of an intermetallic palladium-zinc compound are embedded in the alloy.
- This intermetallic compound can also contain a few percent of the remaining alloy components and should have particle sizes of less than 10 ⁇ m.
- the average particle size of the intermetallic compound is advantageously less than 1 ⁇ m. It is also advantageous if the intermetallic compound consists of the PdZn phase.
- Alloys have proven to be suitable which are 15 to 50% gold, 15 to 50% silver, 10 to 70% palladium, a total of 0 to 1% iridium and / or osmium and / or ruthenium and / or rhodium and 1.5 to 6 % Contain zinc, with more than 0.5% zinc must be present in the form of the intermetallic compound. Alloys with 20 to 40% gold, 25 to 50% silver, 20 to 40% palladium, 0 to 0.2% iridium, osmium, ruthenium and / or rhodium and 2 to 4% zinc are particularly suitable.
- the composite material Since the intermetallic compound has a high hardness, the composite material also has a greatly improved friction and wear behavior compared to a gold-silver-palladium alloy.
- a microstructure with a particle size of the intermetallic compound of less than 1 ⁇ m in length or diameter and particle spacing of approximately 1 ⁇ m represents a sufficiently fine distribution to to obtain the favorable properties as cladding with a thickness of only a few ⁇ m.
- the composite material according to the invention with such a fine distribution of hardening particles recrystallizes even at temperatures of approx. 700 ° C. and annealing times suitable for production of a few minutes, i.e. a previously introduced cold working degrades and gains ductility, but on the other hand there is no harmful coarsening of the fine particle structure under these annealing conditions.
- This composite material can therefore be produced with an optimal microstructure as a compact block, and alloys can be manufactured just as easily as previously customary by roll-cladding on a carrier material, preferably a copper alloy, into a semi-finished product for contact parts.
- the processing steps can be based on the requirements of the copper alloy, so that the finished semifinished product has optimal properties with regard to the carrier and support material.
- the contact materials according to the invention can be produced by powder metallurgy or melt metallurgy, in which case a subsequent heat treatment is required.
- the formation of the intermetallic phase begins with the slow cooling in the casting and is optimized for 1 to 4 hours by temperature treatment at temperatures from about 500 ° C. to about 50 ° C. below the solidus temperature of the respective alloy.
- the following table shows some alloys according to the invention (1 to 8) and for comparison some known alloys (10 to 12) and an alloy with a zinc content outside the claimed range (alloy 9).
- the increase in contact resistance (84% value of the total frequency) was determined on sheet metal samples before and after exposure in a three-component noxious gas at 30 ° C by measurement with a gold rivet as the counter body.
- the harmful gas consisted of air with 200 ppb NO2, 100 ppb H2S and 10 ppb Cl2 at 75% relative humidity.
- the contact force during the measurement was 0.1 N.
- the friction behavior was determined in tribometer measurements as a pair of round rivets against sheet metal with a contact force of 0.75 N.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Contacts (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT87108367T ATE67894T1 (de) | 1986-06-28 | 1987-06-10 | Werkstoff fuer elektrische schwachstromkontakte. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19863621779 DE3621779A1 (de) | 1986-06-28 | 1986-06-28 | Werkstoff fuer elektrische schwachstromkontakte |
DE3621779 | 1986-06-28 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0250958A2 EP0250958A2 (de) | 1988-01-07 |
EP0250958A3 EP0250958A3 (en) | 1989-09-06 |
EP0250958B1 true EP0250958B1 (de) | 1991-09-25 |
Family
ID=6303968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP87108367A Expired - Lifetime EP0250958B1 (de) | 1986-06-28 | 1987-06-10 | Werkstoff für elektrische Schwachstromkontakte |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0250958B1 (enrdf_load_stackoverflow) |
JP (1) | JPS6311632A (enrdf_load_stackoverflow) |
AT (1) | ATE67894T1 (enrdf_load_stackoverflow) |
DE (2) | DE3621779A1 (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4467635B1 (ja) * | 2009-05-28 | 2010-05-26 | Tanakaホールディングス株式会社 | 摺動接点材料 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1089491B (de) * | 1957-12-06 | 1960-09-22 | Degussa | Kontaktmaterial fuer Schwachstrom-kontakte |
JPS5138439B1 (enrdf_load_stackoverflow) * | 1971-04-15 | 1976-10-21 | ||
DE2540956C3 (de) * | 1975-09-13 | 1978-06-08 | W.C. Heraeus Gmbh, 6450 Hanau | Goldlegierung als Werkstoff für elektrische Kontakte |
DE2637807C3 (de) * | 1976-08-21 | 1981-11-19 | W.C. Heraeus Gmbh, 6450 Hanau | Verwendung einer Gold-Legierung für Schwachstrom-Kontakte |
DE2940772C2 (de) * | 1979-10-08 | 1982-09-09 | W.C. Heraeus Gmbh, 6450 Hanau | Elektrischer Schwachstromkontakt |
DE3345162C1 (de) * | 1983-12-14 | 1984-11-15 | Degussa Ag, 6000 Frankfurt | Werkstoffe für Schwachstromkontakte |
-
1986
- 1986-06-28 DE DE19863621779 patent/DE3621779A1/de active Granted
-
1987
- 1987-06-10 EP EP87108367A patent/EP0250958B1/de not_active Expired - Lifetime
- 1987-06-10 DE DE8787108367T patent/DE3773274D1/de not_active Expired - Lifetime
- 1987-06-10 AT AT87108367T patent/ATE67894T1/de active
- 1987-06-23 JP JP62154611A patent/JPS6311632A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE3621779C2 (enrdf_load_stackoverflow) | 1988-04-07 |
EP0250958A2 (de) | 1988-01-07 |
JPS6311632A (ja) | 1988-01-19 |
DE3773274D1 (de) | 1991-10-31 |
ATE67894T1 (de) | 1991-10-15 |
EP0250958A3 (en) | 1989-09-06 |
DE3621779A1 (de) | 1988-01-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69708578T2 (de) | Kupferlegierung und Verfahren zu ihrer Herstellung | |
DE3520407C2 (de) | Verfahren zur thermomechanischen Behandlung von kobalthaltigen Kupfer-Beryllium-Legierungen | |
DE10147968B4 (de) | Kupferlegierung von hoher mechanischer Festigkeit | |
EP3529389B1 (de) | Kupfer-zink-legierung | |
EP2742161B1 (de) | Kupferzinklegierung | |
DE4139021C2 (de) | Gleitelement | |
DE69709610T2 (de) | Kupfer-Nickel-Beryllium Legierung | |
DE102013007274A1 (de) | Kupfergusslegierung für Asynchronmaschinen | |
CH669211A5 (de) | Kupfer-chrom-titan-silizium-legierung und ihre verwendung. | |
DE2218460C3 (de) | Elektrisches Kontaktmaterial | |
EP0250958B1 (de) | Werkstoff für elektrische Schwachstromkontakte | |
DE2720495A1 (de) | Legierungen mit geringem eigenwert | |
AT393697B (de) | Verbesserte metallegierung auf kupferbasis, insbesondere fuer den bau elektronischer bauteile | |
DE1260154B (de) | Ruthenium-Sinterlegierung sowie Verwendung und Herstellung derselben | |
EP3366793B1 (de) | Gleitelement aus einer kupferlegierung | |
DE202017103901U1 (de) | Sondermessinglegierung sowie Sondermessinglegierungsprodukt | |
EP0198159B1 (de) | Verwendung einer Kupfer-Titan-Kobalt-Legierung als Werkstoff für elektronische Bauteile | |
DE1914631A1 (de) | Ruthenium-Legierung | |
DE1930859A1 (de) | Pulvermetallzusammensetzungen und Verfahren zu ihrer Herstellung | |
DE2753654A1 (de) | Legierung aus palladium, kobalt und kupfer fuer elektrische kontakte | |
EP0163904B1 (de) | Silberreiche Werkstoffe für Schwachstromkontakte | |
DE3314652C2 (de) | Silber-Metalloxid-Legierung und ihre Verwendung als elektrischer Kontaktwerkstoff | |
DE3624149C1 (de) | Werkstoff fuer elektrische Steckkontakte | |
DE69429193T2 (de) | Zusammensetzung einer silberlegierung | |
DE2366062A1 (de) | Verfahren zur behandlung einer kupferlegierung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 19870610 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE CH DE ES FR GB GR IT LI LU NL |
|
DIN1 | Information on inventor provided before grant (deleted) | ||
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: KONIETZKA, UWE Owner name: BERCHTOLD, LORENZ, DR. |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: BERCHTOLD, LORENZ, DR. Inventor name: KONIETZKA, UWE |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): AT BE CH DE ES FR GB GR IT LI LU NL |
|
RAP3 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: KONIETZKA, UWE Owner name: BERCHTOLD, LORENZ, DR. |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: INOVAN GMBH & CO. KG METALLE UND BAUELEMENTE |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: BERCHTOLD,LORENZ,DR. Inventor name: KONIETZKA,UWE |
|
17Q | First examination report despatched |
Effective date: 19910313 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE CH DE ES FR GB GR IT LI LU NL |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRE;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED.SCRIBED TIME-LIMIT Effective date: 19910925 Ref country code: NL Effective date: 19910925 Ref country code: BE Effective date: 19910925 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 19910925 |
|
REF | Corresponds to: |
Ref document number: 67894 Country of ref document: AT Date of ref document: 19911015 Kind code of ref document: T |
|
REF | Corresponds to: |
Ref document number: 3773274 Country of ref document: DE Date of ref document: 19911031 |
|
GBT | Gb: translation of ep patent filed (gb section 77(6)(a)/1977) | ||
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 19920105 |
|
ET | Fr: translation filed | ||
NLV1 | Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act | ||
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AT Effective date: 19920610 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19920630 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed | ||
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 19950614 Year of fee payment: 9 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 19950616 Year of fee payment: 9 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: CH Payment date: 19950703 Year of fee payment: 9 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Effective date: 19960610 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LI Effective date: 19960630 Ref country code: CH Effective date: 19960630 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 19960610 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Effective date: 19970228 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 19980327 Year of fee payment: 12 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20000503 |