EP0250958B1 - Material for electrical low-current contacts - Google Patents
Material for electrical low-current contacts Download PDFInfo
- Publication number
- EP0250958B1 EP0250958B1 EP87108367A EP87108367A EP0250958B1 EP 0250958 B1 EP0250958 B1 EP 0250958B1 EP 87108367 A EP87108367 A EP 87108367A EP 87108367 A EP87108367 A EP 87108367A EP 0250958 B1 EP0250958 B1 EP 0250958B1
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- EP
- European Patent Office
- Prior art keywords
- palladium
- gold
- silver
- zinc
- alloys
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/023—Composite material having a noble metal as the basic material
Definitions
- the invention relates to a material for electrical low-voltage contacts, in particular for plug connections and sliding contacts, consisting of a gold-silver-palladium alloy, which can contain small amounts of osmium, iridium, ruthenium and rhodium.
- Mating and sliding contacts especially if they are to be used for the smallest voltages and currents in modern electronic devices, usually consist of carriers made of base metals, which are coated with precious metals or precious metal alloys.
- Three essential requirements are placed on the noble overlay materials. First, they should be as resistant as possible to aggressive atmospheres, so that a low and stable contact resistance is achieved when they are used. Secondly, they should be subject to as little wear as possible in the friction pairing with a contact counterpart and have a low coefficient of friction, so that there is no wear through of the contact layer and the contact actuation forces can be low. Thirdly, an adaptation of the mechanical properties to the carrier materials is required for plating the support materials. In the case of the mechanical roll plating that is usually used, an approximately matching recrystallization temperature of the support and the support is particularly important for producing a high-quality composite material.
- a contact material for low-voltage contacts in particular for telecommunications, which consists of an alloy of 25-35% palladium, 35-45% silver and 25-35% gold.
- alloys for electrical contacts containing indium, tin and other base metals as minor constituents are known from DE-PS 25 40 956 (20-30 wt.% Palladium, 15-25 wt.% Silver, 2, 5-5% by weight tin, 0.05-0.5% by weight iridium, 0.05-0.5% ruthenium, 0.05-0.5% by weight copper, 0.1-2% by weight indium , Balance gold), DE-PS 26 37 807 (10-40% silver, 2-25% palladium, 1-5% nickel, 0.1-10% indium, 0.1-3% tin, balance gold) and DE-PS 29 40 772 (35-55% gold, 18-33.5% silver, 30-40% palladium and 1-6% indium or 0.5-2% indium and 0.5-2% tin) are known .
- Alloys of gold-silver-palladium-iridium and / or osmium with additions of 0.5-5% lead or 0.5-3% lead and 0.5-3% tin are known from DE-OS 33 45 162. Similar alloys based on gold-silver-palladium-iridium and / or osmium with additions of 0-5 at% lead and / or 0-5 at% tin and / or 0-10% copper are in DE-OS 34 20 231 described.
- All of these known alloys either do not have very high mechanical wear resistance (at relatively low levels of base additives) or do not have very good corrosion resistance (at relatively high levels of base additives).
- most of these alloys require soft annealing temperatures of over 750 ° C, sometimes over 900 ° C, which is why they are suitable for processing by roll cladding on typical carrier materials, e.g. CuSn8, poorly suited.
- This object is achieved in that particles of an intermetallic palladium-zinc compound are embedded in the alloy.
- This intermetallic compound can also contain a few percent of the remaining alloy components and should have particle sizes of less than 10 ⁇ m.
- the average particle size of the intermetallic compound is advantageously less than 1 ⁇ m. It is also advantageous if the intermetallic compound consists of the PdZn phase.
- Alloys have proven to be suitable which are 15 to 50% gold, 15 to 50% silver, 10 to 70% palladium, a total of 0 to 1% iridium and / or osmium and / or ruthenium and / or rhodium and 1.5 to 6 % Contain zinc, with more than 0.5% zinc must be present in the form of the intermetallic compound. Alloys with 20 to 40% gold, 25 to 50% silver, 20 to 40% palladium, 0 to 0.2% iridium, osmium, ruthenium and / or rhodium and 2 to 4% zinc are particularly suitable.
- the composite material Since the intermetallic compound has a high hardness, the composite material also has a greatly improved friction and wear behavior compared to a gold-silver-palladium alloy.
- a microstructure with a particle size of the intermetallic compound of less than 1 ⁇ m in length or diameter and particle spacing of approximately 1 ⁇ m represents a sufficiently fine distribution to to obtain the favorable properties as cladding with a thickness of only a few ⁇ m.
- the composite material according to the invention with such a fine distribution of hardening particles recrystallizes even at temperatures of approx. 700 ° C. and annealing times suitable for production of a few minutes, i.e. a previously introduced cold working degrades and gains ductility, but on the other hand there is no harmful coarsening of the fine particle structure under these annealing conditions.
- This composite material can therefore be produced with an optimal microstructure as a compact block, and alloys can be manufactured just as easily as previously customary by roll-cladding on a carrier material, preferably a copper alloy, into a semi-finished product for contact parts.
- the processing steps can be based on the requirements of the copper alloy, so that the finished semifinished product has optimal properties with regard to the carrier and support material.
- the contact materials according to the invention can be produced by powder metallurgy or melt metallurgy, in which case a subsequent heat treatment is required.
- the formation of the intermetallic phase begins with the slow cooling in the casting and is optimized for 1 to 4 hours by temperature treatment at temperatures from about 500 ° C. to about 50 ° C. below the solidus temperature of the respective alloy.
- the following table shows some alloys according to the invention (1 to 8) and for comparison some known alloys (10 to 12) and an alloy with a zinc content outside the claimed range (alloy 9).
- the increase in contact resistance (84% value of the total frequency) was determined on sheet metal samples before and after exposure in a three-component noxious gas at 30 ° C by measurement with a gold rivet as the counter body.
- the harmful gas consisted of air with 200 ppb NO2, 100 ppb H2S and 10 ppb Cl2 at 75% relative humidity.
- the contact force during the measurement was 0.1 N.
- the friction behavior was determined in tribometer measurements as a pair of round rivets against sheet metal with a contact force of 0.75 N.
Abstract
Description
Die Erfindung betrifft einen Werkstoff für elektrische Schwachstromkontakte insbesondere für Steckverbindungen und Schleifkontakte, bestehend aus einer Gold-Silber-Palladium-Legierung, die geringe Mengen von Osmium, Iridium, Ruthenium und Rhodium enthalten kann.The invention relates to a material for electrical low-voltage contacts, in particular for plug connections and sliding contacts, consisting of a gold-silver-palladium alloy, which can contain small amounts of osmium, iridium, ruthenium and rhodium.
Steckende und schleifende Kontakte, besonders wenn sie für kleinste Spannungen und Ströme in modernen elektronischen Geräten eingesetzt werden sollen, bestehen meist aus Trägern aus Unedelmetallen, die mit Edelmetallen oder Edelmetallegierungen beschichtet sind. An die edlen Auflagewerkstoffe werden dabei drei wesentliche Anforderungen gestellt. Zum Ersten sollen sie möglichst beständig gegen aggressive Atmosphären sein, so daß bei ihrem Einsatz ein niedriger und stabiler Kontaktwiderstand erzielt wird. Zum Zweiten sollen sie in der Reibpaarung mit einem Kontaktgegenstück einem möglichst geringen Verschleiß unterliegen und einen geringen Reibungskoeffizienten aufweisen, so daß kein Durchrieb der Auflageschicht erfolgt und die Kontaktbetätigungskräfte niedrig sein können. Zum Dritten ist für ein Plattieren der Auflagewerkstoffe eine Anpassung der mechanischen Eigenschaften an die Trägerwerkstoffe erforderlich. Beim üblicherweise angewendeten mechanischen Walzplattieren ist insbesondere eine etwa übereinstimmende Rekristallisierungstemperatur von Auflage und Träger zur Herstellung eines hochwertigen Werkstoffverbundes wichtig.Mating and sliding contacts, especially if they are to be used for the smallest voltages and currents in modern electronic devices, usually consist of carriers made of base metals, which are coated with precious metals or precious metal alloys. Three essential requirements are placed on the noble overlay materials. First, they should be as resistant as possible to aggressive atmospheres, so that a low and stable contact resistance is achieved when they are used. Secondly, they should be subject to as little wear as possible in the friction pairing with a contact counterpart and have a low coefficient of friction, so that there is no wear through of the contact layer and the contact actuation forces can be low. Thirdly, an adaptation of the mechanical properties to the carrier materials is required for plating the support materials. In the case of the mechanical roll plating that is usually used, an approximately matching recrystallization temperature of the support and the support is particularly important for producing a high-quality composite material.
Diese Anforderungen betreffen weitgehend gegenläufige Eigenschaften. So sind die heute gebräuchlichen Werkstoffe für schleifende und steckende Kontakte entweder sehr korrosionsbeständig oder sehr verschleißbeständig, besitzen aber nicht gleichzeitig beide Eigenschaften. Andererseits zeigen Werkstoffe mit verschleißhemmenden, härtenden Zusätzen eine Erhöhung der Rekristallisationstemperatur.These requirements largely concern opposing properties. The materials commonly used today for grinding and mating contacts are either very corrosion-resistant or very wear-resistant, but do not have both properties at the same time. On the other hand, materials with wear-inhibiting, hardening additives show an increase in the recrystallization temperature.
Dies gilt ganz allgemein für Legierungen mit hohen Goldgehalten von ca. 70 %, wie sie seit langem in Gebrauch sind, aber auch für goldsparende Legierungen -meist auf der Basis Gold-Silber-Palladium - die angesichts gestiegener Goldpreise in jüngerer Zeit entwickelt wurden.This applies in general to alloys with a high gold content of approx. 70%, as they have been in use for a long time, but also to gold-saving alloys - mostly based on gold-silver-palladium - that have been developed in recent times in view of rising gold prices.
Aus der DE-PS 10 89 491 ist ein Kontaktmaterial für Schwachstromkontakte, insbesondere für die Fernmeldetechnik, bekannt, das aus einer Legierung von 25-35 % Palladium, 35-45 % Silber und 25-35 % Gold besteht.From DE-PS 10 89 491 a contact material for low-voltage contacts, in particular for telecommunications, is known, which consists of an alloy of 25-35% palladium, 35-45% silver and 25-35% gold.
Neben Palladium, Silber und Gold als Hauptbestandteile noch Indium, Zinn und andere Unedelmetalle als Nebenbestandteile enthaltende Legierungen für elektrische Kontakte sind aus der DE-PS 25 40 956 (20-30 Gew. % Palladium, 15-25 Gew. % Silber, 2,5-5 Gew.% Zinn, 0,05-0,5 Gew. % Iridium, 0,05-0,5 Ruthenium, 0,05-0,5 Gew.% Kupfer, 0,1-2 Gew.% Indium, Rest Gold), DE-PS 26 37 807 (10-40 % Silber, 2-25 % Palladium, 1-5 % Nickel, 0,1-10 % Indium, 0,1-3 % Zinn, Rest Gold) und DE-PS 29 40 772 (35-55 % Gold, 18-33,5 % Silber, 30-40 % Palladium und 1-6 % Indium oder 0,5-2 % Indium und 0,5-2 % Zinn) bekannt.In addition to palladium, silver and gold as main constituents, alloys for electrical contacts containing indium, tin and other base metals as minor constituents are known from DE-PS 25 40 956 (20-30 wt.% Palladium, 15-25 wt.% Silver, 2, 5-5% by weight tin, 0.05-0.5% by weight iridium, 0.05-0.5% ruthenium, 0.05-0.5% by weight copper, 0.1-2% by weight indium , Balance gold), DE-PS 26 37 807 (10-40% silver, 2-25% palladium, 1-5% nickel, 0.1-10% indium, 0.1-3% tin, balance gold) and DE-PS 29 40 772 (35-55% gold, 18-33.5% silver, 30-40% palladium and 1-6% indium or 0.5-2% indium and 0.5-2% tin) are known .
Aus der DE-OS 33 45 162 sind Legierungen von Gold-Silber-Palladium-Iridium und/oder Osmium mit Zusätzen von 0,5-5 % Blei oder 0,5-3 % Blei und 0,5-3 % Zinn bekannt. Ähnliche Legierungen auf Basis Gold-Silber-Palladium-Iridium und/oder Osmium mit Zusätzen von 0-5 at % Blei und/oder 0-5 at % Zinn und/oder 0-10 % Kupfer sind in der DE-OS 34 20 231 beschrieben.Alloys of gold-silver-palladium-iridium and / or osmium with additions of 0.5-5% lead or 0.5-3% lead and 0.5-3% tin are known from DE-OS 33 45 162. Similar alloys based on gold-silver-palladium-iridium and / or osmium with additions of 0-5 at% lead and / or 0-5 at% tin and / or 0-10% copper are in DE-OS 34 20 231 described.
Alle diese bekannten Legierungen besitzen entweder keine sehr hohe mechanische Verschleißbeständigkeit (bei relativ niedrigen Gehalten von unedlen Zusätzen) oder keine sehr gute Korrosionsbeständigkeit (bei relativ hohen Gehalten von unedlen Zusätzen). Zudem erfordern die meisten dieser Legierungen Weichglühtemperaturen von über 750° C, teilweise über 900° C, weshalb sie sich für eine Verarbeitung durch Walzplattieren auf typischen Trägerwerkstoffen, wie z.B. CuSn8, schlecht eignen.All of these known alloys either do not have very high mechanical wear resistance (at relatively low levels of base additives) or do not have very good corrosion resistance (at relatively high levels of base additives). In addition, most of these alloys require soft annealing temperatures of over 750 ° C, sometimes over 900 ° C, which is why they are suitable for processing by roll cladding on typical carrier materials, e.g. CuSn8, poorly suited.
Es war daher Aufgabe der vorliegenden Erfindung, einen Werktstoff für elektrische Schwachstromkontakte, insbesondere für Steckverbindungen und Schleifkontakte, zu finden bestehend aus einer Gold-Silber-Palladium-Legierung die geringe Mengen von Iridium, Osmium, Ruthenium und Rhodium enthalten kann, der eine sehr gute Korrosionsbeständigkeit und gleichzeitig eine sehr gute Verschleißbeständigkeit aufweist, kombiniert mit einer für Kupferlegierungen als Träger geeigneten Rekristallisationstemperatur.It was therefore an object of the present invention to find a material for electrical low-voltage contacts, in particular for plug connections and sliding contacts, consisting of a gold-silver-palladium alloy which may contain small amounts of iridium, osmium, ruthenium and rhodium, which can be very good Corrosion resistance and at the same time very good wear resistance, combined with a recrystallization temperature suitable for copper alloys as a carrier.
Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß in der Legierung Partikeln einer intermetallischen Palladium-Zinkverbindung eingelagert sind.This object is achieved in that particles of an intermetallic palladium-zinc compound are embedded in the alloy.
Diese intermetallische Verbindung kann auch noch einige Prozente der übrigen Legierungsbestandteile enthalten und sollte Partikelgrößen von weniger als 10 µm aufweisen. Vorteilhafterweise beträgt die mittlere Partikelgröße der intermetallischen Verbindung weniger als 1 µm. Außerdem ist es von Vorteil, wenn die intermetallische Verbindung aus der Phase PdZn besteht.This intermetallic compound can also contain a few percent of the remaining alloy components and should have particle sizes of less than 10 µm. The average particle size of the intermetallic compound is advantageously less than 1 μm. It is also advantageous if the intermetallic compound consists of the PdZn phase.
Als geeignet haben sich Legierungen erwiesen, die 15 bis 50 % Gold, 15 bis 50 % Silber, 10 bis 70 % Palladium, insgesamt 0 bis 1 % Iridium und/oder Osmium und/oder Ruthenium und/oder Rhodium und 1,5 bis 6 % Zink enthalten, wobei mehr als 0,5 % Zink in Form der intermetallischen Verbindung vorliegen muß. Besonders geeignet sind Legierungen mit 20 bis 40 % Gold, 25 bis 50 % Silber, 20 bis 40 % Palladium, 0 bis 0,2 % Iridium, Osmium, Ruthenium, und/oder Rhodium und 2 bis 4 % Zink.Alloys have proven to be suitable which are 15 to 50% gold, 15 to 50% silver, 10 to 70% palladium, a total of 0 to 1% iridium and / or osmium and / or ruthenium and / or rhodium and 1.5 to 6 % Contain zinc, with more than 0.5% zinc must be present in the form of the intermetallic compound. Alloys with 20 to 40% gold, 25 to 50% silver, 20 to 40% palladium, 0 to 0.2% iridium, osmium, ruthenium and / or rhodium and 2 to 4% zinc are particularly suitable.
Überraschenderweise zeigt Zink in einer Legierung von etwa gleichen Teilen Gold, Silber und Palladium eine nur geringe Löslichkeit (kleiner 2 Gew.%), die wesentlich unter der Löslichkeit des Zinks in den jeweils einzelnen Metallen Gold, Silber und Palladium (größer 5 bis über 20 Gew. %) liegt. Deshalb kann, ohne die Korrosionsbeständigkeit der Gold-Silber-Palladium-Matrix durch Aufnahme von Zink als gelöstem Bestandteil merklich zu verschlechtern, eine Einlagerung von Partikeln einer intermetallischen Verbindung von Palladium mit Zink erreicht werden. Diese Partikel besitzen ihrerseits eine überraschend gute Korrosionsbeständigkeit, so daß der Verbundwerkstoff insgesamt sehr beständig in aggressiven Atmosphären und in Luft bei erhöhter Temperatur ist. Da die intermetallische Verbindung eine hohe Härte aufweist, ergibt sich auch für den Verbundwerkstoff ein gegenüber einer Gold-Silber-Palladium-Legierung sehr stark verbessertes Reibungs- und Verschleißverhalten. Eine Gefügeausbildung mit einer Partikelgröße der intermetallischen Verbindung unterhalb 1 µm Länge bzw. Durchmesser und Partikelabständen von ca. 1 µm stellt eine genügend feine Verteilung dar, um die günstigen Eigenschaften auch als Plattierung von nur wenigen µm Dicke zu erhalten.Surprisingly, zinc in an alloy of approximately equal parts of gold, silver and palladium shows only a low solubility (less than 2% by weight), which is significantly less than the solubility of zinc in the individual metals gold, silver and palladium (greater than 5 to over 20 % By weight). Therefore, without an appreciable deterioration in the corrosion resistance of the gold-silver-palladium matrix due to the inclusion of zinc as a dissolved component, the intercalation of particles of an intermetallic compound of palladium with zinc can be achieved. These particles in turn have a surprisingly good corrosion resistance, so that the composite material is very stable overall in aggressive atmospheres and in air at elevated temperatures. Since the intermetallic compound has a high hardness, the composite material also has a greatly improved friction and wear behavior compared to a gold-silver-palladium alloy. A microstructure with a particle size of the intermetallic compound of less than 1 µm in length or diameter and particle spacing of approximately 1 µm represents a sufficiently fine distribution to to obtain the favorable properties as cladding with a thickness of only a few µm.
Überraschenderweise hat sich gezeigt, daß der erfindungsgemäße Verbundwerkstoff mit einer solchen feinen Verteilung von härtenden Partikeln schon bei Temperaturen von ca. 700°C und fertigungsgerechten Glühzeiten von wenigen Minuten rekristallisiert, d.h. eine vorher eingebrachte Kaltverformung abbaut und Duktilität gewinnt, andererseits aber eine schädliche Vergröberung der feinen Partikelstruktur bei diesen Glühbedingungen ausbleibt. Dieser Verbundwerkstoff kann deshalb mit einer optimalen Gefügeausbildung als kompakter Block hergestellt werden, und ebenso einfach wie bisher gebräuchliche Legierungen durch Walzplattieren auf einen Trägerwerkstoff, vorzugsweise eine Kupferlegierung zu einem Halbzeug für Kontaktteile gefertigt werden. Die Verarbeitungsschritte können dabei an den Erfordernissen der Kupferlegierung orientiert sein, so daß das fertige Halbzeug hinsichtlich Träger-und Auflagewerkstoff optimale Eigenschaften aufweist.Surprisingly, it has been shown that the composite material according to the invention with such a fine distribution of hardening particles recrystallizes even at temperatures of approx. 700 ° C. and annealing times suitable for production of a few minutes, i.e. a previously introduced cold working degrades and gains ductility, but on the other hand there is no harmful coarsening of the fine particle structure under these annealing conditions. This composite material can therefore be produced with an optimal microstructure as a compact block, and alloys can be manufactured just as easily as previously customary by roll-cladding on a carrier material, preferably a copper alloy, into a semi-finished product for contact parts. The processing steps can be based on the requirements of the copper alloy, so that the finished semifinished product has optimal properties with regard to the carrier and support material.
Die erfindungsgemäßen Kontaktwerkstoffe können pulvermetallurgisch oder schmelzmetallurgisch hergestellt werden, wobei im letzten Fall eine nachfolgende Wärmebehandlung erforderlich ist. Die Bildung der intermetallischen Phase setzt schon bei der langsamen Abkühlung im Gußstück ein und wird durch Temperaturbehandlung bei Temperaturen von etwa 500° C bis etwa 50° C unterhalb der Solidus-Temperatur der jeweiligen Legierung während 1 bis 4 Stunden optimiert.The contact materials according to the invention can be produced by powder metallurgy or melt metallurgy, in which case a subsequent heat treatment is required. The formation of the intermetallic phase begins with the slow cooling in the casting and is optimized for 1 to 4 hours by temperature treatment at temperatures from about 500 ° C. to about 50 ° C. below the solidus temperature of the respective alloy.
Die folgende Tabelle zeigt einige erfindungsgemäße Legierungen (1 bis 8) und zum Vergleich einige bekannte Legierungen (10 bis 12) und eine Legierung mit einem Zinkgehalt außerhalb des beanspruchten Bereichs (Legierung 9). Die Zunahme des Kontaktwiderstandes (84 %-Wert der Summenhäufigkeit) wurde an Blechproben vor und nach Auslagerung in einem Dreikomponenten-Schadgas bei 30° C durch Messung mit einem Goldniet als Gegenkörper ermittelt. Das Schadgas bestand aus Luft mit 200 ppb NO₂, 100 ppb H₂S und 10 ppb Cl₂ bei 75 % relativer Feuchte. Die Kontaktkraft bei der Messung betrug 0,1 N. Das Reibungsverhalten wurde in Tribometermessungen als Paarung Rundniet gegen Blech bei 0,75 N Auflagekraft ermittelt.
Claims (5)
- A material for electrical light-duty contacts, particular for plug connections and sliding contacts, comprising a gold-silver-palladium alloy which may contain small amounts of iridium, osmium, ruthenium and rhodium, characterised in that particles of an intermetallic palladium-zinc compound are incorporated in the alloy.
- A material according to claim 1 characterised in that the mean particle size of the intermetallic compound is less than 1 µm.
- A material according to claim 1 or claim 2 characterised in that the intermetallic compound comprises Pd Zn.
- A material according to claim 1 to 3 characterised in that it contains from 15 to 50% gold, from 15 to 50% silver, from 10 to 70% palladium, a total of from 0 to 1% iridium and/or osmium and/or ruthenium and/or rhodium and from 1.5 to 6% zinc, wherein are than 0.5% zinc must be in the form of the intermetallic compound.
- A material according to claim 1 to 4 characterised in that it contains from 2 to 4% zinc, from 20 to 40% gold, from 25 to 50% silver, from 20 to 40% palladium, and from 0 to 0.2% iridium, osmium, ruthenium and/or rhodium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT87108367T ATE67894T1 (en) | 1986-06-28 | 1987-06-10 | MATERIAL FOR ELECTRICAL LOW CURRENT CONTACTS. |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3621779 | 1986-06-28 | ||
| DE19863621779 DE3621779A1 (en) | 1986-06-28 | 1986-06-28 | MATERIAL FOR ELECTRICAL LOW-CURRENT CONTACTS |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0250958A2 EP0250958A2 (en) | 1988-01-07 |
| EP0250958A3 EP0250958A3 (en) | 1989-09-06 |
| EP0250958B1 true EP0250958B1 (en) | 1991-09-25 |
Family
ID=6303968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP87108367A Expired - Lifetime EP0250958B1 (en) | 1986-06-28 | 1987-06-10 | Material for electrical low-current contacts |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0250958B1 (en) |
| JP (1) | JPS6311632A (en) |
| AT (1) | ATE67894T1 (en) |
| DE (2) | DE3621779A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4467635B1 (en) * | 2009-05-28 | 2010-05-26 | Ｔａｎａｋａホールディングス株式会社 | Sliding contact material |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1089491B (en) * | 1957-12-06 | 1960-09-22 | Degussa | Contact material for low-voltage contacts |
| JPS5138439B1 (en) * | 1971-04-15 | 1976-10-21 | ||
| DE2540956C3 (en) * | 1975-09-13 | 1978-06-08 | W.C. Heraeus Gmbh, 6450 Hanau | Gold alloy as a material for electrical contacts |
| DE2637807C3 (en) * | 1976-08-21 | 1981-11-19 | W.C. Heraeus Gmbh, 6450 Hanau | Use of a gold alloy for low-voltage contacts |
| DE2940772C2 (en) * | 1979-10-08 | 1982-09-09 | W.C. Heraeus Gmbh, 6450 Hanau | Low-voltage electrical contact |
| DE3345162C1 (en) * | 1983-12-14 | 1984-11-15 | Degussa Ag, 6000 Frankfurt | Materials for weak current contacts |
-
1986
- 1986-06-28 DE DE19863621779 patent/DE3621779A1/en active Granted
-
1987
- 1987-06-10 EP EP87108367A patent/EP0250958B1/en not_active Expired - Lifetime
- 1987-06-10 AT AT87108367T patent/ATE67894T1/en active
- 1987-06-10 DE DE8787108367T patent/DE3773274D1/en not_active Expired - Lifetime
- 1987-06-23 JP JP62154611A patent/JPS6311632A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE3621779C2 (en) | 1988-04-07 |
| DE3621779A1 (en) | 1988-01-14 |
| DE3773274D1 (en) | 1991-10-31 |
| JPS6311632A (en) | 1988-01-19 |
| EP0250958A2 (en) | 1988-01-07 |
| ATE67894T1 (en) | 1991-10-15 |
| EP0250958A3 (en) | 1989-09-06 |
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