EP0163904B1 - Argentiferous material for weak current contacts - Google Patents
Argentiferous material for weak current contacts Download PDFInfo
- Publication number
- EP0163904B1 EP0163904B1 EP85104946A EP85104946A EP0163904B1 EP 0163904 B1 EP0163904 B1 EP 0163904B1 EP 85104946 A EP85104946 A EP 85104946A EP 85104946 A EP85104946 A EP 85104946A EP 0163904 B1 EP0163904 B1 EP 0163904B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- silver
- gold
- atom
- palladium
- contents
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
Definitions
- the invention relates to silver-rich materials for low-voltage contacts, in particular for plug-in connections and sliding contacts, which are applied in a thin layer over a nickel intermediate layer to a carrier made of a base metal material, consisting of 45 to 72 atom% silver, 9 to 32 atom% gold, 9 to 32 atom % Palladium, 0.01 to 1 atom% iridium and / or osmium, 0 to 10 atom% copper and / or 0 to 5 atom% lead and / or 0 to 5 atom% tin.
- So-called connectors are available to a considerable extent in electronic devices. They ensure that defective assemblies are replaced quickly when contact is made safely. With the advancing performance of electronic devices, the demands on the quality of the materials of such connectors have changed. Resistance to the formation of foreign layers on the contact surface due to environmental pollutants is particularly important. In addition, the materials must have a high wear resistance, which, despite a layer thickness of only a few microns, must ensure a sufficiently long service life without wear. The price of the material also plays an important role.
- alloys with a high gold content can naturally be met by alloys with a high gold content. Alloys of gold and silver with more than 70% by weight of gold have proven particularly useful. High-quality alloys are also known which also contain copper and / or nickel in addition to gold and silver, but even these alloys are often not sufficiently corrosion-resistant despite their high gold content.
- the equally important wear resistance is not only determined by the material properties of the contact materials, e.g. B. their hardness is shaped, but it depends just as much on the contact pairing and the construction of the connector system, in particular on the contact force. Alloying base metals can generally increase the wear resistance of the materials, but it also increases the tendency to form foreign layers. On the other hand, materials resistant to foreign layers usually show poor wear resistance.
- Contact materials have become known from EP-OS 82 647 which, in addition to palladium, contains 10 to 58% by weight of silver, 32 to 58.5% by weight of gold, small amounts of rhodium and / or iridium and up to 3% by weight of copper, Contain nickel or indium. These contact materials also do not show optimal properties in terms of foreign layer formation and wear resistance.
- These materials should be as resistant as possible to the formation of foreign layers, have the highest possible wear resistance, be easy to apply to the carrier materials and should not show any significant increase in electrical contact resistance even when stored at 125 ° C for a long time.
- This object was achieved in that the contents of silver and gold to one another in an atomic ratio of 2: 1, 3: 1, 4: 1, 5: or 6: and / or the contents of gold and palladium to one another in an atomic ratio of 1: 3, 1: 2, 2: 3, 1: 1, 3: 2, 2: 1 or 3: 1 and / or the contents of silver and palladium to one another in an atomic ratio of 2: 1, 3: 1, 4: 1. 5: 1 or 6: 1.
- two pairs of noble metals are in relation to one another in the atomic ratios mentioned, i. H. the contents of gold and palladium together with the contents of gold and silver or the contents of gold and palladium together with the contents of silver and palladium.
- silver-gold-palladium alloys in the claimed range show a substantial improvement in their properties with regard to resistance to foreign layers and wear resistance if the atomic proportions of gold, silver and palladium are in the specified ratios to one another.
- the base metal additives are particularly advantageous when both contact pieces of a contact pair are made from the same material.
- these materials are less expensive than the previously known gold-silver-palladium materials. They are easy to process and do not experience an increase in the electrical contact resistance when stored for a longer period at 125 ° C.
- the alloys were melted from the metals and processed into test specimens.
- the increase in contact resistance was determined after 21 days after the test specimens had been exposed to a gas mixture of purified air with 0.5 ppm hydrogen sulfide and 5 ppm sulfur dioxide at 75% relative humidity at 30 ° C. during this time.
- alloys 1 to 7 gold and palladium are in the preferred atomic ratio, in alloys 8 to 22 gold, palladium and silver are used simultaneously. Alloys 29 to 32 are outside the claimed atomic ratios and therefore show a significantly higher increase in contact resistance. All alloys showed high wear resistance.
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- Contacts (AREA)
Description
Die Erfindung betrifft silberreiche Werkstoffe für Schwachstromkontakte, insbesondere für Steckverbindungen und Schleifkontakte, die in dünner Schicht über eine Nickelzwischenschicht auf einen Träger aus einem Unedelmetallwerkstoff aufgebracht sind, bestehend aus 45 bis 72 Atom% Silber, 9 bis 32 Atom% Gold, 9 bis 32 Atom% Palladium, 0,01 bis 1 Atom% Iridium und/oder Osmium, 0 bis 10 Atom% Kupfer und/oder 0 bis 5 Atom% Blei und/oder 0 bis 5 Atom% Zinn.The invention relates to silver-rich materials for low-voltage contacts, in particular for plug-in connections and sliding contacts, which are applied in a thin layer over a nickel intermediate layer to a carrier made of a base metal material, consisting of 45 to 72 atom% silver, 9 to 32 atom% gold, 9 to 32 atom % Palladium, 0.01 to 1 atom% iridium and / or osmium, 0 to 10 atom% copper and / or 0 to 5 atom% lead and / or 0 to 5 atom% tin.
In elektronischen Geräten sind sogenannte Steckverbinder in erheblichem Umfang vorhanden. Sie gewährleisten bei sicherer Kontaktgabe ein schnelles Auswechseln defekter Baugruppen. Mit fortschreitendem Leistungsvermögen elektronischer Geräte haben sich die Anforderungen an die Qualität der Werkstoffe derartiger Steckverbinder gewandelt. Wichtig ist vor allem die Resistenz gegenüber einer Fremdschichtbildung auf der Kontaktfläche durch Schadstoffe der Umwelt. Außerdem müssen die Werkstoffe eine hohe Verschleißbeständigkeit besitzen, die trotz einer nur wenigen µm betragenden Schichtdicke eine hinreichend große Funktionsdauer ohne Durchrieb gewährleisten muß. Auch der Preis des Werkstoffs spielt eine wichtige Rolle.So-called connectors are available to a considerable extent in electronic devices. They ensure that defective assemblies are replaced quickly when contact is made safely. With the advancing performance of electronic devices, the demands on the quality of the materials of such connectors have changed. Resistance to the formation of foreign layers on the contact surface due to environmental pollutants is particularly important. In addition, the materials must have a high wear resistance, which, despite a layer thickness of only a few microns, must ensure a sufficiently long service life without wear. The price of the material also plays an important role.
Während noch vor wenigen Jahren teilweise beträchtliche elektrische Lasten über die Kontakte flossen, werden heute oftmals nur noch geringste Ströme und Spannungen im Mikro- und Nanobereich übertragen. Darüberhinaus hat die zunehmende Miniaturisierung der Bauteile und damit auch der Steckverbinder einerseits und die steigende Luftverschmutzung andererseits, das Problem der Anlaufbeständigkeit der eingesetzten Kontakte in erheblichem Maße verschärft. Während früher eventuell auf den Kontaktstücken vorhandene Fremdschichtfilme durch die angelegten Spannungen durch sogenanntes Fritten leicht zerstört oder durch die hohen Kontaktkräfte mühelos mechanisch durchbrochen werden konnten, reichen die heute angelegten Spannungen, bzw. die durch die fortschreitende Miniaturisierung erheblich reduzierten Kontaktkräfte für eine derartige Selbstreinigung der Kontakte nicht mehr aus. Die Beständigkeit gegenüber einer oftmals optisch gar nicht sichtbaren Fremdschichtbildung ist daher zum wichtigsten Kriterium moderner Kontaktwerkstoffe für Steckverbinder geworden.While only a few years ago considerable electrical loads flowed through the contacts, today only the smallest currents and voltages in the micro and nano range are often transmitted. In addition, the increasing miniaturization of the components and thus also the connectors on the one hand and the increasing air pollution on the other hand have considerably exacerbated the problem of the resistance to tarnishing of the contacts used. Whereas in the past any foreign layer films on the contact pieces could easily be destroyed by so-called fritting due to the applied voltages or easily broken mechanically by the high contact forces, the voltages applied today or the contact forces considerably reduced by the progressing miniaturization are sufficient for such self-cleaning of the contacts no longer out. Resistance to the often invisible formation of foreign layers has therefore become the most important criterion for modern contact materials for connectors.
Diese Anforderungen können naturgemäß durch Legierungen mit hohem Goldgehalt erfüllt werden. Dabei haben sich insbesondere Legierungen aus Gold und Silber mit mehr als 70 Gew.% Gold bewährt. Es sind auch hochkarätige Legierungen bekannt, die neben Gold und Silber auch noch Kupfer und/oder Nickel enthalten, jedoch sind selbst diese Legierungen trotz ihres hohen Goldgehaltes oftmals nicht ausreichend korrosionsbeständig.These requirements can naturally be met by alloys with a high gold content. Alloys of gold and silver with more than 70% by weight of gold have proven particularly useful. High-quality alloys are also known which also contain copper and / or nickel in addition to gold and silver, but even these alloys are often not sufficiently corrosion-resistant despite their high gold content.
Die ebenfalls wichtige Verschließbeständigkeit wird nicht nur von den Materialeigenschaften der Kontaktwerkstoffe, wie z. B. deren Härte geprägt, sondern sie hängt ebenso stark von der Kontaktpaarung und der Konstruktion des Steckverbindersystems ab, insbesondere von der Kontaktgebungskraft. Durch Zulegieren von Unedelmetallen kann man generell zwar die Verschleißfestigkeit der Werkstoffe steigern, man erhöht dadurch aber auch die Neigung zu Fremdschichtenbildung. Andererseits zeigen fremdschichtresistente Werkstoffe normalerweise eine schlechte Verschleißbeständigkeit.The equally important wear resistance is not only determined by the material properties of the contact materials, e.g. B. their hardness is shaped, but it depends just as much on the contact pairing and the construction of the connector system, in particular on the contact force. Alloying base metals can generally increase the wear resistance of the materials, but it also increases the tendency to form foreign layers. On the other hand, materials resistant to foreign layers usually show poor wear resistance.
Angesichts der hohen Edelmetallpreise, insbesondere des hohen Goldpreises, kommt den Werkstoffkosten zunehmende Bedeutung zu. Man ist daher bestrebt, den Goldgehalt in diesen Werkstoffen möglichst niedrig zu halten.In view of the high precious metal prices, especially the high gold price, material costs are becoming increasingly important. It is therefore endeavored to keep the gold content in these materials as low as possible.
Es sind daher aus der DE-OS 26 37 807 und aus der DE-OS 29 40 772 Kontaktwerkstoffe auf Gold-Silber-Palladium-Basis bekannt geworden, die sich durch eine gute Anlaufbeständigkeit bei gleichzeitig vermindertem Goldgehalt auszeichnen. Sie enthalten aber neben mindestens 35 Gew.% Gold noch einige Prozente an Unedelmetallen, wie Indium, Zinn oder Nickel. Diese Unedelmetallbestandteile beeinträchtigen jedoch die optimale Anlaufbeständigkeit der reinen Edelmetallegierung und erhöhen die Rekristallisationstemperatur des Kontaktwerkstoffs, was bei der Weiterverarbeitung zu Schwierigkeiten führen kann. Außerdem ist die Verschleißbeständigkeit dieser Werkstoffe nicht ausreichend.It is therefore known from DE-OS 26 37 807 and DE-OS 29 40 772 contact materials based on gold-silver-palladium, which are characterized by good tarnish resistance with a reduced gold content. In addition to at least 35% by weight of gold, however, they also contain a few percent of base metals such as indium, tin or nickel. However, these base metal components impair the optimal tarnish resistance of the pure noble metal alloy and increase the recrystallization temperature of the contact material, which can lead to difficulties in further processing. In addition, the wear resistance of these materials is not sufficient.
Aus der EP-OS 82 647 sind Kontaktwerkstoffe bekanntgeworden, die neben Palladium als Rest 10 bis 58 Gew.% Silber, 32 bis 58,5 Gew.% Gold, geringe Anteile Rhodium und/oder Iridium und bis zu 3 Gew.% Kupfer, Nickel oder Indium enthalten. Auch diese Kontaktwerkstoffe zeigen in Bezug auf Fremdschichtenbildung und Verschleißbeständigkeit keine optimalen Eigenschaften.Contact materials have become known from EP-OS 82 647 which, in addition to palladium, contains 10 to 58% by weight of silver, 32 to 58.5% by weight of gold, small amounts of rhodium and / or iridium and up to 3% by weight of copper, Contain nickel or indium. These contact materials also do not show optimal properties in terms of foreign layer formation and wear resistance.
Es war daher Aufgabe der vorliegenden Erfindung, silberreiche Werkstoffe für Schwachstromkontakte zu entwickeln, insbesondere für Steckverbindungen und Schleifkontakte, die in dünner Schicht über eine Nickelzwischenschicht auf einen Träger aus einem Unedelmetallwerkstoff aufgebracht sind, bestehend aus 45 bis 72 Atom% Silber, 9 bis 32 Atom% Gold, 9 bis 32 Atom% Palladium, 0,01 bis 1 Atom% Iridium und/oder Osmium, 0 bis 10 Atom% Kupfer und/oder 0 bis 5 Atom% Blei und/oder 0 bis 5 Atom% Zinn. Diese Werkstoffe sollten möglichst resistent gegen Fremdschichtbildung sein, eine möglichst hohe Verschleißbeständigkeit aufweisen, sich gut auf die Trägerwerkstoffe aufbringen lassen und auch bei längerer Auslagerung bei 125 °C keine wesentliche Erhöhung des elektrischen Kontaktwiderstandes zeigen.It was therefore an object of the present invention to develop silver-rich materials for low-voltage contacts, in particular for plug-in connections and sliding contacts, which are applied in a thin layer over a nickel intermediate layer to a carrier made of a base metal material, consisting of 45 to 72 atom% silver, 9 to 32 atom % Gold, 9 to 32 atom% palladium, 0.01 to 1 atom% iridium and / or osmium, 0 to 10 atom% copper and / or 0 to 5 atom% lead and / or 0 to 5 atom% tin. These materials should be as resistant as possible to the formation of foreign layers, have the highest possible wear resistance, be easy to apply to the carrier materials and should not show any significant increase in electrical contact resistance even when stored at 125 ° C for a long time.
Diese Aufgabe wurde erfindungsgemäß dadurch gelöst, daß die Gehalte an Silber und Goldzueinander im atomaren Verhältnis von 2: 1, 3 : 1, 4:1, 5 : oder 6 : und/oder die Gehalte an Gold und Palladium zueinander im atomaren Verhältnis 1 : 3, 1 : 2, 2 : 3, 1 : 1, 3 : 2, 2 : 1 oder 3 : 1 und/oder die Gehalte an Silber und Palladium zueinander im atomaren Verhältnis 2: 1, 3 : 1, 4:1. 5 : 1 oder 6 : 1 stehen.This object was achieved in that the contents of silver and gold to one another in an atomic ratio of 2: 1, 3: 1, 4: 1, 5: or 6: and / or the contents of gold and palladium to one another in an atomic ratio of 1: 3, 1: 2, 2: 3, 1: 1, 3: 2, 2: 1 or 3: 1 and / or the contents of silver and palladium to one another in an atomic ratio of 2: 1, 3: 1, 4: 1. 5: 1 or 6: 1.
Vorzugsweise stehen jeweils zwei Edelmetallpaarungen in den genannten atomaren Verhältnissen zueinander, d. h. die Gehalte an Gold und Palladium zusammen mit den Gehalten an Gold und Silber bzw. die Gehalte an Gold und Palladium zusammen mit den Gehalten an Silber und Palladium.Preferably two pairs of noble metals are in relation to one another in the atomic ratios mentioned, i. H. the contents of gold and palladium together with the contents of gold and silver or the contents of gold and palladium together with the contents of silver and palladium.
Es hat sich überraschenderweise gezeigt, daß Silber-Gold-Palladiumlegierungen im beanspruchten Bereich trotz ihres hohen Silbergehaltes eine wesentliche Verbesserung ihrer Eigenschaften in bezug auf Fremdschichtenresistenz und Verschleißbeständigkeit zeigen, wenn die atomaren Anteile an Gold, Silber und Palladium jeweils in den angegebenen Verhältnissen zueinander stehen.It has surprisingly been found that silver-gold-palladium alloys in the claimed range, despite their high silver content, show a substantial improvement in their properties with regard to resistance to foreign layers and wear resistance if the atomic proportions of gold, silver and palladium are in the specified ratios to one another.
Die Unedelmetallzusätze sind vor allem dann vorteilhaft, wenn beide Kontaktstücke eines Kontaktpaares aus dem gleichen Werkstoff gefertigt werden.The base metal additives are particularly advantageous when both contact pieces of a contact pair are made from the same material.
Wegen ihres hohen Silbergehaltes sind diese Werkstoffe preisgünstiger als die bisher bekannten Gold-Silber-Palladium-Werkstoffe. Sie lassen sich gut verarbeiten und erfahren keine Erhöhung des elektrischen Übergangswiderstandes bei längerer Auslagerung bei 125 °C.Because of their high silver content, these materials are less expensive than the previously known gold-silver-palladium materials. They are easy to process and do not experience an increase in the electrical contact resistance when stored for a longer period at 125 ° C.
Die folgende Tabelle zeigt einige beispielhafte Legierungen innerhalb des erfindungsgemäßen Bereichs.The following table shows some exemplary alloys within the range according to the invention.
Dazu wurden die Legierungen aus den Metallen erschmolzen und zu Prüfkörpern verarbeitet. Die Zunahme des Übergangswiderstandes wurde nach 21 Tagen bestimmt, nachdem die Prüfkörper während dieser Zeit einem Gasgemisch aus gereinigter Luft mit 0,5 ppm Schwefelwasserstoff und 5 ppm Schwefeldioxid bei 75 % relativer Luftfeuchtigkeit bei 30 °C ausgesetzt waren.
Bei den Legierungen 1 bis 7 stehen Gold und Palladium im bevorzugten atomaren Verhältnis, bei den Legierungen 8 bis 22 gleichzeitig Gold, Palladium und Silber. Die Legierungen 29 bis 32 liegen außerhalb der beanspruchten atomaren Verhältnisse und zeigen daher eine wesentlich höhere Zunahme des Übergangswiderstandes. Alle Legierungen zeigten eine hohe Verschleißbeständigkeit.In alloys 1 to 7, gold and palladium are in the preferred atomic ratio, in alloys 8 to 22 gold, palladium and silver are used simultaneously. Alloys 29 to 32 are outside the claimed atomic ratios and therefore show a significantly higher increase in contact resistance. All alloys showed high wear resistance.
Claims (4)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3420231A DE3420231C1 (en) | 1984-05-30 | 1984-05-30 | Silver-rich materials for low-voltage contacts |
| DE3420231 | 1984-05-30 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0163904A2 EP0163904A2 (en) | 1985-12-11 |
| EP0163904A3 EP0163904A3 (en) | 1986-12-30 |
| EP0163904B1 true EP0163904B1 (en) | 1989-02-01 |
Family
ID=6237266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP85104946A Expired EP0163904B1 (en) | 1984-05-30 | 1985-04-23 | Argentiferous material for weak current contacts |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0163904B1 (en) |
| JP (1) | JPS60257085A (en) |
| CA (1) | CA1248366A (en) |
| DE (2) | DE3420231C1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000276960A (en) * | 1999-03-29 | 2000-10-06 | Nec Corp | Combination electric contact, and relay and switch using it |
| JP2007157504A (en) * | 2005-12-05 | 2007-06-21 | Matsushita Electric Works Ltd | Micro relay |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2637807C3 (en) * | 1976-08-21 | 1981-11-19 | W.C. Heraeus Gmbh, 6450 Hanau | Use of a gold alloy for low-voltage contacts |
| DE2940772C2 (en) * | 1979-10-08 | 1982-09-09 | W.C. Heraeus Gmbh, 6450 Hanau | Low-voltage electrical contact |
| WO1983002195A1 (en) * | 1981-12-10 | 1983-06-23 | Anderton, David, James | Light duty corrosion resistant contacts |
| DE3345162C1 (en) * | 1983-12-14 | 1984-11-15 | Degussa Ag, 6000 Frankfurt | Materials for weak current contacts |
-
1984
- 1984-05-30 DE DE3420231A patent/DE3420231C1/en not_active Expired
-
1985
- 1985-04-23 DE DE8585104946T patent/DE3568103D1/en not_active Expired
- 1985-04-23 EP EP85104946A patent/EP0163904B1/en not_active Expired
- 1985-05-28 JP JP60113334A patent/JPS60257085A/en active Pending
- 1985-05-29 CA CA000482697A patent/CA1248366A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| CA1248366A (en) | 1989-01-10 |
| JPS60257085A (en) | 1985-12-18 |
| EP0163904A3 (en) | 1986-12-30 |
| EP0163904A2 (en) | 1985-12-11 |
| DE3420231C1 (en) | 1985-01-03 |
| DE3568103D1 (en) | 1989-03-09 |
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