EP0145924B1 - Material for low-current contacts - Google Patents

Material for low-current contacts Download PDF

Info

Publication number
EP0145924B1
EP0145924B1 EP84113310A EP84113310A EP0145924B1 EP 0145924 B1 EP0145924 B1 EP 0145924B1 EP 84113310 A EP84113310 A EP 84113310A EP 84113310 A EP84113310 A EP 84113310A EP 0145924 B1 EP0145924 B1 EP 0145924B1
Authority
EP
European Patent Office
Prior art keywords
weight
gold
materials
silver
palladium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP84113310A
Other languages
German (de)
French (fr)
Other versions
EP0145924A2 (en
EP0145924A3 (en
Inventor
Horst Dr. Dipl.-Phys. Heidsiek
Hartmut Dipl.-Ing. Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
Degussa GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa GmbH filed Critical Degussa GmbH
Publication of EP0145924A2 publication Critical patent/EP0145924A2/en
Publication of EP0145924A3 publication Critical patent/EP0145924A3/en
Application granted granted Critical
Publication of EP0145924B1 publication Critical patent/EP0145924B1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/929—Electrical contact feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12875—Platinum group metal-base component

Definitions

  • the invention relates to materials for low-voltage contacts, in particular for plug-in connections and sliding contacts, which are applied in a thin layer over a nickel intermediate layer to a base metal base, consisting of an alloy of palladium, gold, silver, iridium and / or osmium and base metals.
  • So-called connectors are available to a considerable extent in electronic devices. They ensure that defective assemblies are replaced quickly when contact is made safely. With the advancing performance of electronic devices, the demands on the quality of the materials of such connectors have changed. While only a few years ago considerable electrical loads flowed through the contacts, today only very small currents and voltages in the micro and nano range are often transmitted. In addition, the increasing miniaturization of the components and thus also the plug connector on the one hand and the increasing air pollution on the other hand have exacerbated the problem of the resistance to tarnishing of the contacts used.
  • the contact materials In addition to good resistance to the formation of foreign layers, the contact materials must also have good wear resistance. While in the early years low-voltage contacts were massively manufactured or the corresponding materials were at least used in thick layers, the price development for precious metals forced the use of increasingly thin layers down to layer thicknesses of 1 ⁇ m and less. The material of such thin layers must therefore have special wear resistance.
  • high gold content alloys can meet high requirements with regard to resistance to foreign layers. Alloys of gold and silver with more than 70% by weight of gold have proven particularly useful. High-quality alloys are also known which contain copper and / or nickel in addition to gold and silver, but even these alloys are often not sufficiently corrosion-resistant despite their high gold content, since the copper tends to form both sulfide and oxide. In addition, given the high gold prices, the high proportion of gold is a significant economic shortage.
  • Low gold contact materials for low current contacts are known from DE-PS 1089491. These contain 25 to 35% by weight of gold, 35 to 45% by weight of silver and 25 to 35% by weight of palladium. However, these materials also form foreign layers in today's air pollution and are also not resistant to abrasion.
  • a carrier made of a base metal material consisting of an alloy of palladium, gold, silver, iridium and / or osmium and base metals that have good tarnish resistance and good wear resistance with the lowest possible gold content.
  • This object was achieved according to the invention in that, from 33 to 50% by weight of palladium, 18 to 40% by weight of silver, 19 to 33% by weight of gold, 0.01 to 1% by weight of iridium and / or osmium and either 0, 5 to 5% by weight of lead or 0.5 to 3% by weight of lead and 0.1 to 3% by weight of tin.
  • the materials preferably consist of 33 to 45% by weight of palladium, 25 to 40% by weight of silver, 20 to 30% by weight of gold, 0.01 to 1% by weight of iridium and / or osmium and either 0.5 to 4% by weight .% Lead or 0.5 to 2% by weight of lead and 0.2 to 2% by weight of tin.
  • these materials show very good tarnish resistance, i.e. They are resistant to the formation of foreign layers, despite a gold content of less than 33% by weight, have a very high wear resistance and do not experience any increase in the electrical contact resistance when stored at 125 ° C for a long time. They can also be easily plated onto base metal substrates with a nickel intermediate layer.

Description

Die Erfindung betrifft Werkstoffe für Schwachstromkontakte, insbesondere für Steckverbindungen und Schleifkontakte, die in dünner Schicht über eine Nickelzwischenschicht auf einen Träger aus Unedelmetallwerkstoff aufgebracht sind, bestehend aus einer Legierung aus Palladium, Gold, Silber, Iridium und/oder Osmium und Unedelmetallen.The invention relates to materials for low-voltage contacts, in particular for plug-in connections and sliding contacts, which are applied in a thin layer over a nickel intermediate layer to a base metal base, consisting of an alloy of palladium, gold, silver, iridium and / or osmium and base metals.

In elektronischen Geräten sind sogenannte Steckverbinder in erheblichem Umfang vorhanden. Sie gewährleisten bei sicherer Kontaktgabe ein schnelles Auswechseln defekter Baugruppen. Mit fortschreitendem Leistungsvermögen elektronischer Geräte haben sich die Anforderungen an die Qualität der Werkstoffe derartiger Steckverbinder gewandelt. Während noch vor wenigen Jahren teilweise beträchtliche elektrische Lasten über die Kontakte flossen, werden heute oftmals nur noch sehr kleine Ströme und Spannungen im Mikro-und Nanobereich übertragen. Darüberhinaus hat die zunehmende Miniaturisierung der Bauteile und damit auch der Steckverbinder einerseits und die steigende Luftverschmutzung andererseits, das Problem der Anlaufbeständigkeit der eingesetzten Kontakte in erheblichem Maße verschärft. Während früher eventuell auf den Kontaktstücken vorhandene Fremdschichtfilme infolge der angelegten Spannungen durch sogenanntes Fritten leicht zerstört oder durch die hohen Kontaktkräfte mühelos mechanisch durchbrochen werden konnten, reichen die heute angelegten Spannungen bzw. die durch die fortschreitende Miniaturisierung erheblich reduzierten Kontaktkräfte für eine derartige Selbstreinigung der Kontakte nicht mehr aus. Die Beständigkeit gegenüber einer oftmals optisch gar nicht sichtbaren Fremdschichtbildung ist daher zum wichtigsten Kriterium moderner Kontaktwerkstoffe für Steckverbinder geworden.So-called connectors are available to a considerable extent in electronic devices. They ensure that defective assemblies are replaced quickly when contact is made safely. With the advancing performance of electronic devices, the demands on the quality of the materials of such connectors have changed. While only a few years ago considerable electrical loads flowed through the contacts, today only very small currents and voltages in the micro and nano range are often transmitted. In addition, the increasing miniaturization of the components and thus also the plug connector on the one hand and the increasing air pollution on the other hand have exacerbated the problem of the resistance to tarnishing of the contacts used. While previously existing foreign layer films on the contact pieces could be easily destroyed by so-called fritting due to the applied voltages or easily broken mechanically by the high contact forces, the voltages applied today or the contact forces considerably reduced by the progressing miniaturization are not sufficient for such self-cleaning of the contacts more out. Resistance to the often invisible formation of foreign layers has therefore become the most important criterion for modern contact materials for connectors.

Neben einer guten Resistenz gegen Fremdschichtbildung müssen die Kontaktwerkstoffe auch eine gute Verschleißbeständigkeit aufweisen. Während in füheren Jahren Schwachstromkontakte massiv gefertigt oder die entsprechenden Werkstoffe zumindest in dicken Schichten eingesetzt wurden, erzwingt die Preisentwicklung bei den Edelmetallen den Einsatz immer dünnerer Schichten bis zu Schichtdicken von 1 µm und weniger. Das Material solcher dünner Schichten muß daher eine besondere Verschleißfestigkeit aufweisen.In addition to good resistance to the formation of foreign layers, the contact materials must also have good wear resistance. While in the early years low-voltage contacts were massively manufactured or the corresponding materials were at least used in thick layers, the price development for precious metals forced the use of increasingly thin layers down to layer thicknesses of 1 µm and less. The material of such thin layers must therefore have special wear resistance.

Durch Zulegieren von Unedelmetallen zu Edelmetallen kann man im allgemeinen zwar die Verschleißfestigkeit der Werkstoffe verbessern, erhöht aber dadurch die Neigung zu Fremdschichtenbildung. Andererseits zeigen Fremdschichtresistente Werkstoffe normalerweise schlechte Verschleißfestigkeiten.By adding base metals to precious metals, you can generally improve the wear resistance of the materials, but thereby increase the tendency to form foreign layers. On the other hand, materials that are resistant to foreign layers usually show poor wear resistance.

Hohe Anforderungen in bezug auf Fremdschichtenresistenz können naturgemäß Legierungen mit hohem Goldgehalt erfüllen. Dabei haben sich insbesondere Legierungen aus Gold und Silber mit mehr als 70 Gew.% Gold bewährt. Es sind auch hochkarätige Legierungen bekannt, die neben Gold und Silber noch Kupfer und/oder Nickel enthalten, jedoch sind selbst diese Legierungen trotz ihres hohen Goldgehaltes oftmals nicht ausreichend korrosionsbeständig, da das Kupfer sowohl zur Sulfid- als auch zur Oxidbildung neigt. Darüberhinaus ist der hohe Goldanteil angesichts der hohen Goldpreise ein erheblicher wirtschaftlicher Mangel.Naturally, high gold content alloys can meet high requirements with regard to resistance to foreign layers. Alloys of gold and silver with more than 70% by weight of gold have proven particularly useful. High-quality alloys are also known which contain copper and / or nickel in addition to gold and silver, but even these alloys are often not sufficiently corrosion-resistant despite their high gold content, since the copper tends to form both sulfide and oxide. In addition, given the high gold prices, the high proportion of gold is a significant economic shortage.

Aus der DE-OS 26 37 807, aus der DE-OS 29 40 772 und der DE-OS 25 40 956 sind Kontaktwerkstoffe auf Gold-Silber-Palladium-Basis bekannt geworden, die sich durch eine gute Anlaufbeständigkeit bei gleichzeitig vermindertem Goldgehalt auszeichnen. Sie enthalten neben Gold-Silber-Palladium noch einige Prozente an Unedelmetallen, wie Kupfer, Nickel, Indium und Zinn. Dabei wird bei diesen Werkstoffen stets ein Goldanteil von mehr als 35 Gew.% benötigt, was bisher als unterste Grenze für eine ausreichende Resistenz solcher Kontaktmaterialien gegenüber Fremdschichtbildung angesehen wurde. Außerdem ist die Verschleißfestigkeit dieser Werkstoffe noch nicht optimal.From DE-OS 26 37 807, from DE-OS 29 40 772 and DE-OS 25 40 956 contact materials based on gold-silver-palladium are known, which are characterized by good tarnish resistance with a reduced gold content. In addition to gold-silver-palladium, they also contain a few percent of base metals such as copper, nickel, indium and tin. A gold content of more than 35% by weight is always required for these materials, which was previously regarded as the lowest limit for sufficient resistance of such contact materials to foreign layer formation. In addition, the wear resistance of these materials is not yet optimal.

Goldarme Kontaktwerkstoffe für Schwachstromkontakte sind aus der DE-PS 1089491 bekannt. Diese enthalten 25 bis 35 Gew.% Gold, 35 bis 45 Gew.% Silber und 25 bis 35 Gew.% Palladium. Diese Werkstoffe bilden aber bei den heutigen Schadstoffbelastungen in der Luft ebenfalls Fremdschichten und sind außerdem nicht abriebbeständig.Low gold contact materials for low current contacts are known from DE-PS 1089491. These contain 25 to 35% by weight of gold, 35 to 45% by weight of silver and 25 to 35% by weight of palladium. However, these materials also form foreign layers in today's air pollution and are also not resistant to abrasion.

Es war daher Aufgabe der vorliegenden Erfindung, Werkstoffe für Schwachstromkontakte zu entwickeln, insbesondere für Steckverbindungen und Schleifkontakte, die in dünner Schicht über eine Nickelzwischenschicht auf einen Träger aus einem Unedelmetallwerkstoff aufgebracht sind, bestehend aus einer Legierung aus Palladium, Gold, Silber, Iridium und/oder Osmium und Unedelmetallen, die bei möglichst geringem Goldgehalt eine gute Anlaufbeständigkeit und eine gute Verschleißfestigkeit aufweisen. Außerdem sollten sie sich gut auf die Trägerwerkstoffe aufbringen lassen und auch bei längerer Auslagerung bei Temperaturen von 125°C keine Erhöhung des Kontaktwiderstandes zeigen.It was therefore an object of the present invention to develop materials for low-voltage contacts, in particular for plug-in connections and sliding contacts, which are applied in a thin layer over a nickel intermediate layer to a carrier made of a base metal material, consisting of an alloy of palladium, gold, silver, iridium and / or osmium and base metals that have good tarnish resistance and good wear resistance with the lowest possible gold content. In addition, they should be easy to apply to the carrier materials and should not show any increase in contact resistance even when stored for a long time at temperatures of 125 ° C.

Diese Aufgabe wurde erfindungsgemäß dadurch gelöst, daß sie aus 33 bis 50 Gew.% Palladium 18 bis 40 Gew.% Silber, 19 bis 33 Gew.% Gold, 0,01 bis 1 Gew.% Iridium und/oder Osmium und entweder 0,5 bis 5 Gew,% Blei oder 0,5 bis 3 Gew.% Blei und 0,1 bis 3 Gew.% Zinn bestehen.This object was achieved according to the invention in that, from 33 to 50% by weight of palladium, 18 to 40% by weight of silver, 19 to 33% by weight of gold, 0.01 to 1% by weight of iridium and / or osmium and either 0, 5 to 5% by weight of lead or 0.5 to 3% by weight of lead and 0.1 to 3% by weight of tin.

Vorzugsweise bestehen die Werkstoffe aus 33 bis 45 Gew.% Palladium, 25 bis 40 Gew.% Silber, 20 bis 30 Gew.% Gold, 0,01 bis 1 Gew.% Iridium und/oder Osmium und entweder 0,5 bis 4 Gew.% Blei oder 0,5 bis 2 Gew.% Blei und 0,2 bis 2 Gew.% Zinn.The materials preferably consist of 33 to 45% by weight of palladium, 25 to 40% by weight of silver, 20 to 30% by weight of gold, 0.01 to 1% by weight of iridium and / or osmium and either 0.5 to 4% by weight .% Lead or 0.5 to 2% by weight of lead and 0.2 to 2% by weight of tin.

Diese Werkstoffe zeigen überraschenderweise eine sehr gute Anlaufbeständigkeit, d.h. sie sind resistent gegen Fremdschichtenbildung, trotz eines Goldgehaltes unter 33 Gew.%, besitzen eine sehr hohe Verschleißbeständigkeit und erfahren keine Erhöhung des elektrischen Übergangswiderstandes bei längerer Auslagerung bei 125° C. Außerdem lassen sie sich leicht auf Unedelmetallträger mit einer Nickelzwischenschicht aufplattieren.Surprisingly, these materials show very good tarnish resistance, i.e. They are resistant to the formation of foreign layers, despite a gold content of less than 33% by weight, have a very high wear resistance and do not experience any increase in the electrical contact resistance when stored at 125 ° C for a long time. They can also be easily plated onto base metal substrates with a nickel intermediate layer.

Folgende beispielhafte Legierungszusammensetzungen zeigten diese günstigen Eigenschaften:

  • a) 33,7 % Pd, 44,6 % Ag, 20,0 % Au, 0,05 % Ir, 1,65 % Pb
  • b) 33,3 % Pd, 33,8 % Ag, 29,6 % Au, 0,05 % Os, 3,25 % Pb
  • c) 33,7 % Pd, 34,2 % Ag, 29,9 % Au, 0,05 % Ir, 1,65 % Pb, 0,5 % Sn
  • d) 43,1 % Pd, 33,1 % Ag, 21,1 % Au, 0,05 % Os, 1,25 % Pb, 1,4 % Sn
  • e) 39,1 % Pd, 30,6 % Ag, 28,5 % Au, 0,05 % Os, 0,8 % Pb, 0,95 % Sn
  • f) 42,8 % Pd, 27,7 % Ag, 27,0 % Au, 0,05 % Ir, 2,45 % Pb
  • g) 46,1 % Pd, 23,2 % Ag, 28,5 % Au, 0,05 % Os, 1,65 % Pb, 0,5 % Sn
The following exemplary alloy compositions showed these favorable properties:
  • a) 33.7% Pd, 44.6% Ag, 20.0% Au, 0.05% Ir, 1.65% Pb
  • b) 33.3% Pd, 33.8% Ag, 29.6% Au, 0.05% Os, 3.25% Pb
  • c) 33.7% Pd, 34.2% Ag, 29.9% Au, 0.05% Ir, 1.65% Pb, 0.5% Sn
  • d) 43.1% Pd, 33.1% Ag, 21.1% Au, 0.05% Os, 1.25% Pb, 1.4% Sn
  • e) 39.1% Pd, 30.6% Ag, 28.5% Au, 0.05% Os, 0.8% Pb, 0.95% Sn
  • f) 42.8% Pd, 27.7% Ag, 27.0% Au, 0.05% Ir, 2.45% Pb
  • g) 46.1% Pd, 23.2% Ag, 28.5% Au, 0.05% Os, 1.65% Pb, 0.5% Sn

Claims (2)

1. Materials for weak current contacts, in particular for plug connections and sliding contacts which are applied in a thin layer over a nickel intermediate layer to a substrate composed of a base metal material, composed of an alloy of palladium, gold, silver, iridium and/or osmium and base metals, characterised in that they are composed of from 33 to 50% by weight of palladium, from 18 to 40% by weight of silver, from 19 to 33% by weight of gold, from 0.01 to 1% by weight of iridium and/or osmium and either from 0.5 to 5% by weight of lead or from 0.5 to 3% by weight of lead and from 0.1 to 3% by weight of tin.
2. Materials according to claim 1, characterised in that they are composed of from 33 to 45% by. weight of palladium, from 25 to 40% by weight of silver, from 20 to 30% by weight of gold, from 0.01 to 1% by weight of iridium and/or osmium and either from 0.5 to 4% by weight of lead or from 0.5 to 2% by weight of lead and from 0.2 to 2% by weight of tin.
EP84113310A 1983-12-14 1984-11-06 Material for low-current contacts Expired EP0145924B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3345162 1983-12-14
DE3345162A DE3345162C1 (en) 1983-12-14 1983-12-14 Materials for weak current contacts

Publications (3)

Publication Number Publication Date
EP0145924A2 EP0145924A2 (en) 1985-06-26
EP0145924A3 EP0145924A3 (en) 1985-08-07
EP0145924B1 true EP0145924B1 (en) 1987-04-29

Family

ID=6216879

Family Applications (1)

Application Number Title Priority Date Filing Date
EP84113310A Expired EP0145924B1 (en) 1983-12-14 1984-11-06 Material for low-current contacts

Country Status (5)

Country Link
US (1) US4579787A (en)
EP (1) EP0145924B1 (en)
JP (1) JPS60146414A (en)
CA (1) CA1218881A (en)
DE (2) DE3345162C1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3420231C1 (en) * 1984-05-30 1985-01-03 Degussa Ag, 6000 Frankfurt Silver-rich materials for low-voltage contacts
CA1264871A (en) * 1986-02-27 1990-01-23 Makoto Hori Positive ceramic semiconductor device with silver/palladium alloy electrode
DE3621779A1 (en) * 1986-06-28 1988-01-14 Degussa MATERIAL FOR ELECTRICAL LOW-CURRENT CONTACTS
FR2617191B1 (en) * 1987-06-26 1989-12-08 Louyot Comptoir Lyon Alemand NEW PALLADIUM-BASED ALLOYS CONTAINING AT LEAST ONE ADDITION ELEMENT SELECTED FROM THE GROUP CONSISTING OF INDIUM, ANTIMONY, BISMUTH, CADMIUM, ZINC, COPPER AND MONEY, ESPECIALLY USED IN THE INDUSTRY GLASS AND USE OF SUCH ALLOYS IN THE GLASS INDUSTRY
JPH01132072A (en) * 1987-11-18 1989-05-24 Yazaki Corp Gold plated parts of terminal, contact, and the like
US20070260282A1 (en) * 2003-09-12 2007-11-08 Taylor William J Feedthrough apparatus with noble metal-coated leads
US7966070B2 (en) * 2003-09-12 2011-06-21 Medtronic, Inc. Feedthrough apparatus with noble metal-coated leads
US20060247714A1 (en) * 2005-04-28 2006-11-02 Taylor William J Glass-to-metal feedthrough seals having improved durability particularly under AC or DC bias
US7564674B2 (en) * 2005-12-12 2009-07-21 Greatbatch Ltd. Feedthrough filter capacitor assemblies having low cost terminal pins

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1248621A (en) * 1917-10-08 1917-12-04 Electro Metals Products Company Metal alloy.
BE452819A (en) * 1938-04-30
US2241262A (en) * 1939-10-26 1941-05-06 Baker & Co Inc Electrical contact
US2300286A (en) * 1941-05-08 1942-10-27 Fansteel Metallurgical Corp Electrical contact
US2418710A (en) * 1944-11-10 1947-04-08 Mallory & Co Inc P R Electric contact and brush
NL193594A (en) * 1954-03-02
DE1089491B (en) * 1957-12-06 1960-09-22 Degussa Contact material for low-voltage contacts
US3981724A (en) * 1974-11-06 1976-09-21 Consolidated Refining Company, Inc. Electrically conductive alloy
DE2540956C3 (en) * 1975-09-13 1978-06-08 W.C. Heraeus Gmbh, 6450 Hanau Gold alloy as a material for electrical contacts
DE2637807C3 (en) * 1976-08-21 1981-11-19 W.C. Heraeus Gmbh, 6450 Hanau Use of a gold alloy for low-voltage contacts
DE2940772C2 (en) * 1979-10-08 1982-09-09 W.C. Heraeus Gmbh, 6450 Hanau Low-voltage electrical contact
DE3146794C2 (en) * 1981-11-26 1985-07-04 Degussa Ag, 6000 Frankfurt Precious metal alloy for firing dental porcelain

Also Published As

Publication number Publication date
CA1218881A (en) 1987-03-10
EP0145924A2 (en) 1985-06-26
JPS60146414A (en) 1985-08-02
US4579787A (en) 1986-04-01
DE3345162C1 (en) 1984-11-15
EP0145924A3 (en) 1985-08-07
DE3463425D1 (en) 1987-06-04

Similar Documents

Publication Publication Date Title
EP0882143B1 (en) Connector pins for electronic equipment
DE2540943A1 (en) ELECTRIC CONNECTOR
EP1157820B1 (en) Metal strip with high electric conductibility and connector made from it
DE10152029A1 (en) Sliding Contact Detector
EP0525222B1 (en) Sliding contact piece for high current densities
EP1158618B1 (en) Metal strip with high electric conductibility and connector made from it
DE4443461C1 (en) Copper@ (alloy) composite strip or wire material used in electromechanical or electrooptical applications
DE1078774B (en) Electric contact
EP0145924B1 (en) Material for low-current contacts
DE2637807C3 (en) Use of a gold alloy for low-voltage contacts
EP1421651B1 (en) Electric contact
DE2419102C3 (en) Switching device with contacts
DE1232282B (en) Method for connecting an electrical contact body to a metallic contact carrier
DE2540944B2 (en) CONTACT BODY FOR AN ELECTRIC CONNECTOR
DE2914880A1 (en) METHOD FOR ELECTROLYTICALLY DEPOSITING SILVER AND SILVER ALLOY LAYERS
EP0163904B1 (en) Argentiferous material for weak current contacts
DE2419043C3 (en) Switching device with movable contacts and method for their manufacture
DE10139953A1 (en) Material for a metal band
DE102018208116A1 (en) Copper tape for making electrical contacts and method of making a copper tape and connectors
DE202019103166U1 (en) Electrical contact element
DE1173574B (en) Electrical contact piece
DE2519257B2 (en) Electrical contact that is protected against the creeping up of foreign matter, preferably noble metal composite contact rivet
DD238518A3 (en) CONTACT MATERIAL FOR LOW-VOLUME TECHNOLOGY
DD220750A1 (en) ARRANGEMENT FOR ELECTRICAL PLUG-IN CONTACT
DE4142857A1 (en) METHOD FOR PRODUCING AN ELECTRICAL CONTACT

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

17P Request for examination filed

Effective date: 19841106

AK Designated contracting states

Designated state(s): BE DE FR GB IT NL SE

AK Designated contracting states

Designated state(s): BE DE FR GB IT NL SE

17Q First examination report despatched

Effective date: 19860320

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): BE DE FR GB IT NL SE

ITF It: translation for a ep patent filed

Owner name: JACOBACCI & PERANI S.P.A.

REF Corresponds to:

Ref document number: 3463425

Country of ref document: DE

Date of ref document: 19870604

ET Fr: translation filed
PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 19871130

Year of fee payment: 4

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Effective date: 19881106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Effective date: 19881107

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Effective date: 19881130

BERE Be: lapsed

Owner name: DEGUSSA A.G.

Effective date: 19881130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Effective date: 19890601

NLV4 Nl: lapsed or anulled due to non-payment of the annual fee
GBPC Gb: european patent ceased through non-payment of renewal fee
PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19890731

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Effective date: 19890801

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

EUG Se: european patent has lapsed

Ref document number: 84113310.1

Effective date: 19890728