EP0145924A2 - Material for low-current contacts - Google Patents

Material for low-current contacts Download PDF

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Publication number
EP0145924A2
EP0145924A2 EP84113310A EP84113310A EP0145924A2 EP 0145924 A2 EP0145924 A2 EP 0145924A2 EP 84113310 A EP84113310 A EP 84113310A EP 84113310 A EP84113310 A EP 84113310A EP 0145924 A2 EP0145924 A2 EP 0145924A2
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EP
European Patent Office
Prior art keywords
weight
gold
lead
materials
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP84113310A
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German (de)
French (fr)
Other versions
EP0145924B1 (en
EP0145924A3 (en
Inventor
Horst Dr. Dipl.-Phys. Heidsiek
Hartmut Dipl.-Ing. Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
Degussa GmbH
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Filing date
Publication date
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Publication of EP0145924A2 publication Critical patent/EP0145924A2/en
Publication of EP0145924A3 publication Critical patent/EP0145924A3/en
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Publication of EP0145924B1 publication Critical patent/EP0145924B1/en
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/929—Electrical contact feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12875—Platinum group metal-base component

Definitions

  • the invention relates to materials for low-voltage contacts, in particular for plug-in connections and sliding contacts, which are applied in a thin layer over a nickel intermediate layer to a base metal material carrier.
  • So-called connectors are available to a considerable extent in electronic devices. They ensure that defective assemblies are replaced quickly when contact is made safely. With the advancing performance of electronic devices, the demands on the quality of the materials of such connectors have changed. While only a few years ago considerable electrical loads flowed through the contacts, today only very small currents and voltages in the micro and nano range are often transmitted. In addition, the increasing miniaturization of the components and thus also the plug connector on the one hand and the increasing air pollution on the other hand have exacerbated the problem of the resistance to tarnishing of the contacts used.
  • the contact materials In addition to good resistance to the formation of foreign layers, the contact materials must also have good wear resistance. While low-voltage contacts were massively manufactured in earlier years or the corresponding materials were at least used in thick layers, the price development for precious metals forced the use of increasingly thin layers down to layer thicknesses of 1 ⁇ m and less. The material of such thin layers must therefore have special wear resistance.
  • high gold content alloys can meet high requirements with regard to resistance to foreign layers. Alloys of gold and silver with more than 70% by weight of gold have proven particularly useful. High-quality alloys are also known which contain copper and / or nickel in addition to gold and silver, but even these are alloys Despite their high gold content, they are often not sufficiently corrosion-resistant, since the copper tends to form both sulfide and oxide. In addition, given the high gold prices, the high proportion of gold is a significant economic shortage.
  • Contact materials based on gold-silver-palladium have become known from DE-OS 26 37 807 and from DE-OS 29 40 772, which are characterized by good tarnish resistance with a simultaneously reduced gold content.
  • gold-silver-palladium they also contain a few percent of base metals such as copper, nickel, indium and tin.
  • a gold content of more than 35% by weight is always required for these materials, which was previously regarded as the lowest limit for sufficient resistance of such contact materials to foreign layer formation.
  • the wear resistance of these materials is not yet optimal.
  • Low gold contact materials for low current contacts are known from DE-PS 1089491. These contain 25 to 35% by weight of gold, 35 to 45% by weight of silver and 25 to 35% by weight of palladium. However, these materials also form foreign layers in today's air pollution and are also not resistant to abrasion.
  • This object has been achieved according to the invention in that it contains 33 to 50% by weight of palladium, 18 to 48% by weight of silver, 19 to 33% by weight of gold, 0.01 to 1% by weight of iridium and / or osmium and either 0.5 contain up to 5% by weight of lead or 0.5 to 3% by weight of lead and 0.1 to 3% by weight of tin.
  • the materials preferably contain 33 to 45% by weight of palladium, 25 to 40% by weight of silver, 20 to 30% by weight of gold, 0.01 to 1% by weight of iridium and / or osmium and either 0.5 to 4% by weight.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Contacts (AREA)
  • Conductive Materials (AREA)

Abstract

Schwachstromkontakte mit dünner Kontaktschicht auf einem Träger sollen bei möglichst geringem Goldgehalt gute Anlaufbeständigkeit und Verschleißfestigkeit aufweisen. Solche Werkstoffe bestehen aus 33 bis 50 Gew.% Palladium, 18 bis 48 Gew.% Silber, 19 bis 33 Gew.% Gold, 0,01 bis 1 Gew.% Iridium und/oder Osmium und entweder 0,5 bis 5 Gew.% Blei oder 0.5 bis 3 Gew.% Blei und 0,1 bis 3 Gew.% Zinn.Low-current contacts with a thin contact layer on a carrier should have good tarnish resistance and wear resistance with the lowest possible gold content. Such materials consist of 33 to 50% by weight of palladium, 18 to 48% by weight of silver, 19 to 33% by weight of gold, 0.01 to 1% by weight of iridium and / or osmium and either 0.5 to 5% by weight. % Lead or 0.5 to 3% by weight of lead and 0.1 to 3% by weight of tin.

Description

Die Erfindung betrifft Werkstoffe für Schwachstromkontakte, insbesondere für Steckverbindungen und Schleifkontakte, die in dünner Schicht über eine Nickelzwischenschicht auf einen Träger aus Unedelmetallwerkstoff aufgebracht sind.The invention relates to materials for low-voltage contacts, in particular for plug-in connections and sliding contacts, which are applied in a thin layer over a nickel intermediate layer to a base metal material carrier.

In elektronischen Geräten sind sogenannte Steckverbinder in erheblichem Umfang vorhanden. Sie gewährleisten bei sicherer Kontaktgabe ein schnelles Auswechseln defekter Baugruppen. Mit fortschreitendem Leistungsvermögen elektronischer Geräte haben sich die Anforderungen an die Qualität der Werkstoffe derartiger Steckverbinder gewandelt. Während noch vor wenigen Jahren teilweise beträchtliche elektrische Lasten über die Kontakte flossen, werden heute oftmals nur noch sehr kleine Ströme und Spannungen im Mikro- und Nanobereich übertragen. Darüberhinaus hat die zunehmende Miniaturisierung der Bauteile und damit auch der Steckverbinder einerseits und die steigende Luftverschmutzung andererseits, das Problem der Anlaufbeständigkeit der eingesetzten Kontakte in erheblichem Maße verschärft. Während früher eventuell auf den Kontaktstücken vorhandene Fremdschichtfilme infolge der angelegten Spannungen durch sogenanntes Fritten leicht zerstört oder durch die hohen Kontaktkräfte mühelos mechanisch durchbrochen werden konnten, reichen die heute angelegten Spannungen bzw. die durch die fortschreitende Miniaturisierung erheblich reduzierten Kontaktkräfte für eine derartige Selbstreinigung der Kontakte nicht mehr aus. Die Beständigkeit gegenüber einer oftmals optisch gar nicht sichtbaren Fremdschichtbildung ist daher zum wichtigsten Kriterium moderner Kontaktwerkstoffe für Steckverbinder geworden.So-called connectors are available to a considerable extent in electronic devices. They ensure that defective assemblies are replaced quickly when contact is made safely. With the advancing performance of electronic devices, the demands on the quality of the materials of such connectors have changed. While only a few years ago considerable electrical loads flowed through the contacts, today only very small currents and voltages in the micro and nano range are often transmitted. In addition, the increasing miniaturization of the components and thus also the plug connector on the one hand and the increasing air pollution on the other hand have exacerbated the problem of the resistance to tarnishing of the contacts used. While previously existing foreign layer films on the contact pieces could be easily destroyed by so-called fritting due to the applied voltages or easily broken mechanically by the high contact forces could, the voltages applied today or the contact forces significantly reduced by the progressing miniaturization are no longer sufficient for such self-cleaning of the contacts. Resistance to the often invisible formation of foreign layers has therefore become the most important criterion for modern contact materials for connectors.

Neben einer guten Resistenz gegen Fremdschichtbildung müssen die Kontaktwerkstoffe auch eine gute Verschleißbeständigkeit aufweisen. Während in füheren Jahren Schwachstromkontakte massiv gefertigt oder die entsprechenden Werkstoffe zumindest in dicken Schichten eingesetzt wurden, erzwingt die Preisentwicklung bei den Edelmetallen den Einsatz immer dünnerer Schichten bis zu Schichtdicken von 1 um und weniger. Das Material solcher dünner Schichten muß daher eine besondere Verschleißfestigkeit aufweisen.In addition to good resistance to the formation of foreign layers, the contact materials must also have good wear resistance. While low-voltage contacts were massively manufactured in earlier years or the corresponding materials were at least used in thick layers, the price development for precious metals forced the use of increasingly thin layers down to layer thicknesses of 1 µm and less. The material of such thin layers must therefore have special wear resistance.

Durch Zulegieren von Unedelmetallen zu Edelmetallen kann man im allgemeinen zwar die Verschleißfestigkeit der Werkstoffe verbessern, erhöht aber dadurch die Neigung zu Fremdschichtenbildung. Andererseits zeigen Fremdschichtresistente Werkstoffe normalerweise schlechte Verschleißfestigkeiten.By adding base metals to precious metals, you can generally improve the wear resistance of the materials, but thereby increase the tendency to form foreign layers. On the other hand, materials that are resistant to foreign layers usually show poor wear resistance.

Hohe Anforderungen in bezug auf Fremdschichtenresistenz können naturgemäß Legierungen mit hohem Goldgehalt erfüllen. Dabei haben sich insbesondere Legierungen aus Gold und Silber mit mehr als 70 Gew.% Gold bewährt. Es sind auch hochkarätige Legierungen bekannt, die neben Gold und Silber noch Kupfer und/oder Nickel enthalten, jedoch sind selbst diese Legierungen trotz ihres hohen Goldgehaltes oftmals nicht ausreichend korrosionsbeständig, da das Kupfer sowohl zur Sulfid- als auch zur Oxidbildung neigt. Darüberhinaus ist der hohe Goldanteil angesichts der hohen Goldpreise ein erheblicher wirtschaftlicher Mangel.Naturally, high gold content alloys can meet high requirements with regard to resistance to foreign layers. Alloys of gold and silver with more than 70% by weight of gold have proven particularly useful. High-quality alloys are also known which contain copper and / or nickel in addition to gold and silver, but even these are alloys Despite their high gold content, they are often not sufficiently corrosion-resistant, since the copper tends to form both sulfide and oxide. In addition, given the high gold prices, the high proportion of gold is a significant economic shortage.

Aus der DE-OS 26 37 807 und aus der DE-OS 29 40 772 sind Kontaktwerkstoffe auf Gold-Silber-Palladium-Basis bekannt geworden, die sich durch eine gute Anlaufbeständigkeit bei gleichzeitig vermindertem Goldgehalt auszeichnen. Sie enthalten neben Gold-Silber-Palladium noch einige Prozente an Unedelmetallen, wie Kupfer, Nickel, Indium und Zinn. Dabei wird bei diesen Werkstoffen stets ein Goldanteil von mehr als 35 Gew.% benötigt, was bisher als unterste Grenze für eine ausreichende Resistenz solcher Kontaktmaterialien gegenüber Fremdschichtbildung angesehen wurde. Außerdem ist die verschleißfestigkeit dieser Werkstoffe noch nicht optimal.Contact materials based on gold-silver-palladium have become known from DE-OS 26 37 807 and from DE-OS 29 40 772, which are characterized by good tarnish resistance with a simultaneously reduced gold content. In addition to gold-silver-palladium, they also contain a few percent of base metals such as copper, nickel, indium and tin. A gold content of more than 35% by weight is always required for these materials, which was previously regarded as the lowest limit for sufficient resistance of such contact materials to foreign layer formation. In addition, the wear resistance of these materials is not yet optimal.

Goldarme Kontaktwerkstoffe für Schwachstromkontakte sind aus der DE-PS 1089491 bekannt. Diese enthalten 25 bis 35 Gew.% Gold, 35 bis 45 Gew.% Silber und 25 bis 35 Gew.% Palladium. Diese Werkstoffe bilden aber bei den heutigen Schadstoffbelastungen in der Luft ebenfalls Fremdschichten und sind außerdem nicht abriebbeständig.Low gold contact materials for low current contacts are known from DE-PS 1089491. These contain 25 to 35% by weight of gold, 35 to 45% by weight of silver and 25 to 35% by weight of palladium. However, these materials also form foreign layers in today's air pollution and are also not resistant to abrasion.

Es war daher Aufgabe der vorliegenden Erfindung, Werkstoffe für Schwachstromkontakte zu entwickeln, insbesondere für Steckverbindungen und Schleifkontakte, die in dünner Schicht über eine Nickelzwischenschicht auf einen Träger aus einem Unedelmetallwerkstoff aufgebracht sind und die bei möglichst geringem Goldgehalt eine gute Anlaufbeständigkeit und eine gute Verschleißfestigkeit aufweisen. Außerdem sollten sie sich gut auf die Trägerwerkstoffe aufbringen lassen und auch bei längerer Auslagerung bei Temperaturen von I25° C keine Erhöhung des Kontaktwiderstandes zeigen.It was therefore an object of the present invention to develop materials for low-voltage contacts, in particular for plug-in connections and sliding contacts, which are applied in a thin layer over a nickel intermediate layer to a carrier made of a base metal material and which have as little gold as possible just have good tarnish resistance and good wear resistance. In addition, they should be easy to apply to the carrier materials and should not show any increase in contact resistance even when stored at temperatures of I25 ° C for a long time.

Diese Aufgabe wurde erfindungsgemäß dadurch gelöst, daß sie 33 bis 50 Gew.% Palladium 18 bis 48 Gew.% Silber, 19 bis 33 Gew.% Gold, 0,01 bis 1 Gew.% Iridium und/oder Osmium und entweder 0,5 bis 5 Gew.% Blei oder 0,5 bis 3 Gew.% Blei und 0,1 bis 3 Gew.% Zinn enthalten.This object has been achieved according to the invention in that it contains 33 to 50% by weight of palladium, 18 to 48% by weight of silver, 19 to 33% by weight of gold, 0.01 to 1% by weight of iridium and / or osmium and either 0.5 contain up to 5% by weight of lead or 0.5 to 3% by weight of lead and 0.1 to 3% by weight of tin.

Vorzugsweise enthalten die Werkstoffe 33 bis 45 Gew.% Palladium, 25 bis 40 Gew.% Silber, 20 bis 30 Gew.% Gold, 0,01 bis 1 Gew.% Iridium und/oder Osmium und entweder 0,5 bis 4 Gew.% Blei oder 0,5 bis 2 Gew.% Blei und 0,2 bis 2 Gew.% Zinn.The materials preferably contain 33 to 45% by weight of palladium, 25 to 40% by weight of silver, 20 to 30% by weight of gold, 0.01 to 1% by weight of iridium and / or osmium and either 0.5 to 4% by weight. % Lead or 0.5 to 2% by weight of lead and 0.2 to 2% by weight of tin.

Diese Werkstoffe zeigen überraschenderweise eine sehr gute Anlaufbeständigkeit, d.h. sie sind resistent gegen Fremdschichtenbildung, trotz eines Goldgehaltes unter 33 Gew.%, besitzen eine sehr hohe Verschleißbeständigkeit und erfahren keine Erhöhung des elektrischen Übergangswiderstandes bei längerer Auslagerung bei 1250 C. Außerdem lassen sie sich leicht auf Unedelmetallträger mit einer Nickelzwischenschicht aufplattieren.These materials exhibit surprisingly excellent stain resistance, they that are resistant to foreign stratification, despite a gold content of less than 33 wt.%, Have a very high wear resistance and do not experience any increase in electrical contact resistance after prolonged aging at 125 0 C. In addition, they can be easily plate on base metal base with a nickel intermediate layer.

Folgende beispielhafte Legierungszusammensetzungen zeigten diese günstigen Eigenschaften:

Figure imgb0001
Figure imgb0002
The following exemplary alloy compositions showed these favorable properties:
Figure imgb0001
Figure imgb0002

Claims (2)

1. Werkstoffe für Schwachstromkontakte, insbesondere für Steckverbindungen und Schleifkontakte, die in dünner Schicht über eine Nickelzwischenschicht auf einen Träger aus einem Unedelmetallwerkstoff aufgebracht sind,
dadurch gekennzeichnet,
daß sie 33 bis 50 Gew.% Palladium, 18 bis 48 Gew.% Silber, 19 bis 33 Gew.% Gold, 0,01 bis 1 Gew.% Iridium und/oder Osmium und entweder 0,5 bis 5 Gew.% Blei oder 0,5 bis 3 Gew.% Blei und 0,1 bis 3 Gew.% Zinn enthalten.1. Materials for low-voltage contacts, in particular for plug-in connections and sliding contacts, which are applied in a thin layer over a nickel intermediate layer to a base made of a base metal material,
characterized,
that they contain 33 to 50% by weight of palladium, 18 to 48% by weight of silver, 19 to 33% by weight of gold, 0.01 to 1% by weight of iridium and / or osmium and either 0.5 to 5% by weight of lead or 0.5 to 3% by weight of lead and 0.1 to 3% by weight of tin. 2. Werkstoffe nach Anspruch 1,
dadurch gekennzeichnet,
daß sie 33 bis 45 Gew.% Palladium, 25 bis 40 Gew.% Silber, 20 bis 30 Gew.% Gold, 0,01 bis 1 Gew.% Iridium und/oder Osmium und entweder 0,5 bis 4 Gew.% Blei oder 0,5 bis 2 Gew.% Blei und 0,2 bis 2 Gew.% Zinn enthalten.2. Materials according to claim 1,
characterized,
that they contain 33 to 45 weight percent palladium, 25 to 40 weight percent silver, 20 to 30 weight percent gold, 0.01 to 1 weight percent iridium and / or osmium and either 0.5 to 4 weight percent lead or 0.5 to 2% by weight of lead and 0.2 to 2% by weight of tin.
EP84113310A 1983-12-14 1984-11-06 Material for low-current contacts Expired EP0145924B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3345162 1983-12-14
DE3345162A DE3345162C1 (en) 1983-12-14 1983-12-14 Materials for weak current contacts

Publications (3)

Publication Number Publication Date
EP0145924A2 true EP0145924A2 (en) 1985-06-26
EP0145924A3 EP0145924A3 (en) 1985-08-07
EP0145924B1 EP0145924B1 (en) 1987-04-29

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ID=6216879

Family Applications (1)

Application Number Title Priority Date Filing Date
EP84113310A Expired EP0145924B1 (en) 1983-12-14 1984-11-06 Material for low-current contacts

Country Status (5)

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US (1) US4579787A (en)
EP (1) EP0145924B1 (en)
JP (1) JPS60146414A (en)
CA (1) CA1218881A (en)
DE (2) DE3345162C1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0250958A2 (en) * 1986-06-28 1988-01-07 INOVAN GmbH & Co. KG Metalle und Bauelemente Material for electrical low-current contacts

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3420231C1 (en) * 1984-05-30 1985-01-03 Degussa Ag, 6000 Frankfurt Silver-rich materials for low-voltage contacts
CA1264871A (en) * 1986-02-27 1990-01-23 Makoto Hori Positive ceramic semiconductor device with silver/palladium alloy electrode
FR2617191B1 (en) * 1987-06-26 1989-12-08 Louyot Comptoir Lyon Alemand NEW PALLADIUM-BASED ALLOYS CONTAINING AT LEAST ONE ADDITION ELEMENT SELECTED FROM THE GROUP CONSISTING OF INDIUM, ANTIMONY, BISMUTH, CADMIUM, ZINC, COPPER AND MONEY, ESPECIALLY USED IN THE INDUSTRY GLASS AND USE OF SUCH ALLOYS IN THE GLASS INDUSTRY
JPH01132072A (en) * 1987-11-18 1989-05-24 Yazaki Corp Gold plated parts of terminal, contact, and the like
US20070260282A1 (en) * 2003-09-12 2007-11-08 Taylor William J Feedthrough apparatus with noble metal-coated leads
US7966070B2 (en) * 2003-09-12 2011-06-21 Medtronic, Inc. Feedthrough apparatus with noble metal-coated leads
US20060247714A1 (en) * 2005-04-28 2006-11-02 Taylor William J Glass-to-metal feedthrough seals having improved durability particularly under AC or DC bias
US7564674B2 (en) * 2005-12-12 2009-07-21 Greatbatch Ltd. Feedthrough filter capacitor assemblies having low cost terminal pins

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US2241262A (en) * 1939-10-26 1941-05-06 Baker & Co Inc Electrical contact
DE1078774B (en) * 1954-03-02 1960-03-31 Western Electric Co Electric contact
DE1089491B (en) * 1957-12-06 1960-09-22 Degussa Contact material for low-voltage contacts
DE2540956A1 (en) * 1975-09-13 1977-04-07 Heraeus Gmbh W C GOLD ALLOY AS A MATERIAL FOR ELECTRICAL CONTACTS
EP0027520A1 (en) * 1979-10-08 1981-04-29 W.C. Heraeus GmbH Electrical weak-current contact

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US1248621A (en) * 1917-10-08 1917-12-04 Electro Metals Products Company Metal alloy.
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US2300286A (en) * 1941-05-08 1942-10-27 Fansteel Metallurgical Corp Electrical contact
US2418710A (en) * 1944-11-10 1947-04-08 Mallory & Co Inc P R Electric contact and brush
US3981724A (en) * 1974-11-06 1976-09-21 Consolidated Refining Company, Inc. Electrically conductive alloy
DE2637807C3 (en) * 1976-08-21 1981-11-19 W.C. Heraeus Gmbh, 6450 Hanau Use of a gold alloy for low-voltage contacts
DE3146794C2 (en) * 1981-11-26 1985-07-04 Degussa Ag, 6000 Frankfurt Precious metal alloy for firing dental porcelain

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2241262A (en) * 1939-10-26 1941-05-06 Baker & Co Inc Electrical contact
DE1078774B (en) * 1954-03-02 1960-03-31 Western Electric Co Electric contact
DE1089491B (en) * 1957-12-06 1960-09-22 Degussa Contact material for low-voltage contacts
DE2540956A1 (en) * 1975-09-13 1977-04-07 Heraeus Gmbh W C GOLD ALLOY AS A MATERIAL FOR ELECTRICAL CONTACTS
EP0027520A1 (en) * 1979-10-08 1981-04-29 W.C. Heraeus GmbH Electrical weak-current contact

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0250958A2 (en) * 1986-06-28 1988-01-07 INOVAN GmbH & Co. KG Metalle und Bauelemente Material for electrical low-current contacts
EP0250958A3 (en) * 1986-06-28 1989-09-06 Lorenz Dr. Berchtold Material for electrical low-current contacts

Also Published As

Publication number Publication date
CA1218881A (en) 1987-03-10
US4579787A (en) 1986-04-01
DE3463425D1 (en) 1987-06-04
DE3345162C1 (en) 1984-11-15
JPS60146414A (en) 1985-08-02
EP0145924B1 (en) 1987-04-29
EP0145924A3 (en) 1985-08-07

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