EP0208808A1 - Gedruckter Widerstand, Verfahren zur Herstellung und Anwendung - Google Patents

Gedruckter Widerstand, Verfahren zur Herstellung und Anwendung Download PDF

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Publication number
EP0208808A1
EP0208808A1 EP85110374A EP85110374A EP0208808A1 EP 0208808 A1 EP0208808 A1 EP 0208808A1 EP 85110374 A EP85110374 A EP 85110374A EP 85110374 A EP85110374 A EP 85110374A EP 0208808 A1 EP0208808 A1 EP 0208808A1
Authority
EP
European Patent Office
Prior art keywords
substrate
adhesive
conductive
layer
paint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP85110374A
Other languages
English (en)
French (fr)
Inventor
Zhu Hanxiong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN 85202831 external-priority patent/CN85202831U/zh
Priority claimed from CN 85105318 external-priority patent/CN1006518B/zh
Application filed by Individual filed Critical Individual
Publication of EP0208808A1 publication Critical patent/EP0208808A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B41/00—Circuit arrangements or apparatus for igniting or operating discharge lamps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material

Definitions

  • the present invention relates to a printed resistor, the method for making same and the application thereof, and particularly, to a resistor manufactured by printing, the method for making the resistor and the application of the resistor to electronic and electric circuits.
  • Resistors and electrodes made of carbon particles such as carbon resistors and carbon rods, have been commonly used in prior art, however, they are usually made into separated components with particular three-dimensional structures.
  • electrical-thermal energy transforming apparatus in prior art have usually been provided with a resistance wire as the energy transforming component.
  • a resistance wire as the energy transforming component.
  • the local temperature near the resistance wire is very high, resulting in that heat is emitted unevenly. Therefore, if a relatively large area is desired to be heated evenly, a complicated structure will be required. Furthermore, the price of the metal resistance wire is high.
  • the present invention to manufacture a certain resistance pattern by printing a conductive paint on an insulating substrate, in which the paint comprises conductive particles, such as carbon particles, as the main resistance material, an adequate adhesive mixed with the conductive particles, and an adequate diluent for keeping the paint in proper dilution.
  • the paint comprises conductive particles, such as carbon particles, as the main resistance material, an adequate adhesive mixed with the conductive particles, and an adequate diluent for keeping the paint in proper dilution.
  • the raw materials for manufacturing the printed resistor of the present invention comprise:
  • the method for meanufacturing the printed resistor according to the present invention includes the follwoing steps.
  • the printed resistor according to the present invention includes all the resistors manufactured by printing, spraying, soaking or other mechanical or manual methods employing the above-described steps.
  • Fig. 1A shows the printed resistor manufactured according to the method of the present invention, in which numeral 1 indicates the insulating substrate; numeral 2 indicates the resistance pattern formed by applying the conductive paint of the present invention; numeral 3 indicates the metal electrodes, and C 1 and C 2 represent two connectors of the resistor, respectively.
  • Fig. 1B is a section view taken along Line 1B-1B in Fig. lA, wherein numeral 4 indicates the packaging layer covering the printed resistor after it has been manufactured for the purposes of insulating, sealing, and/or decorating.
  • the resistance value between C 1 and C 2 of the printed resistor in Fig. 1A depends on the composition of the conductive paint, and the length, width and thickness of the resistance pattern. If the conductive paint is made up of graphite + waterglass + water, the ratio between the components is as follows:
  • the components described above are applied onto a substrate of paper board, forming thereon a resistance pattern with a length of 200 cm, a width of 4.5 cm and a thickness of 0.05 mm.
  • the printed resistor shown in Fig. 1A can be used as a separated resistor element, and several similar printed resistors can be manufactured on a single printed circuit board or connection board to replace the conventional separated resistor components used in electronic circuits or electric circuits.
  • a plurality of printed resistors of different resistance values can be manufactured on the same circuit board by changing the configuration of the resistance pattern and/or by applying repeatedly the conductive paints of different composition onto the same substrate (like the chromatograph method in printing techniques).
  • Fig. 2 shows another embodiment of the present invention.
  • the design of the configuration shown in Fig. 2 can reach a relatively large resistance value in a relatively small area.
  • the printed resistor shown in Fig. 2 can be used as a fluorescent lamp ballast to replace the conventional inductive ballast or resistive-capacitive ballast.
  • Fig. 3 shows yet another embodiment of the present invention, wherein C 1 to C 6 are six metal connectors located at different positions. Different resistance values can be obtained by varying connections of the corresponding connectors, for example, the largest resistance value between C 1 and C 2 (except open circuit) can be obtained when C 3 and C 4 are short connected, and if C 1 to C 4 are short connected together as one terminal, and C s and C 6 are short connected together as the other terminal, the equivalent resistance value between the two terminals will be the smallest (except short out). It will be very convenient to get various resistor arrays by using designs of the resistance pattern and arrangements of the connectors similar to that shown in Fig. 3. Since the resistance value of the printed resistor is related to the configuration of the resistance pattern, an accurate design of the configuration and even applying of the conductive paint onto the substrate will provide an accurate ratio of the resistance values of the resistor arrays when connected by different ways.
  • the structure shown in Fig. 3 can be used conveniently as an electrical-thermal energy transforming apparatus (called as electrical-thermal apparatus hereinafter).
  • electrical-thermal apparatus As the printed resistor has a relatively large area of heat radiation, an even radiation of heat in a relatively large area can be realized by arranging adequately the resistance pattern on the insulating substrate while the heat acumulation on the resistor itself during operation is avoided. Moreover, if a thin substrate is used to form resistance patterns in staggered positions on both sides of it, there can be obtained on the whole substrate a highly even electrical-thermal energy transforming.
  • the local temperature of the substrate will not be high (below 50°C) due to little heat accumulation on the substrate even if the power rate of the electrical-thermal apparatus is relatirely large, therefore to build such an apparatus does not demand much for the part of the materials to be used.
  • a heat-resisting adhesive such as waterglass
  • heat-resisting substrate such as ceramic plate, asbestos board, plaster tablet or glassfiber board
  • the power rate of such an apparatus can be conveniently varied from time to time by varying the connections between different connectors.
  • the electrical-thermal apparatus described above can be used in different environments and for different purposes, for example, it can be used to maintain a constant working temperature for a precision instrument working in a very cold environment, to replace electric stoves for house-warming, to be made into a bake oven, baking box, drying room or to be used in a laboratory or room that has strict requirements of environmental temperatures.
  • This embodiment of the present invention can be conveniently combined into the structure of the walls of a building or with the decoration of the room during the construction of the building or reparation of the room, so as to further reduce the manufacture and installla- tion cost.
  • the apparatus Since the apparatus has the features of even surface temperature, quick heat radiation and little heat acumulation,, not only insulating and sealing of the surface can be carried out easily, but also decorating of the surface by different ways and materials with varionus colours and patterns can be realized satisfyingly. In this way, the apparatus serves as a means for house-warming as well as decorating simultaneously.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Adjustable Resistors (AREA)
EP85110374A 1985-07-11 1985-08-19 Gedruckter Widerstand, Verfahren zur Herstellung und Anwendung Withdrawn EP0208808A1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN85202831 1985-07-11
CN85105318 1985-07-11
CN 85202831 CN85202831U (zh) 1985-07-11 1985-07-11 印刷电阻
CN 85105318 CN1006518B (zh) 1985-07-11 1985-07-11 一种日光灯镇流器和制造方法

Publications (1)

Publication Number Publication Date
EP0208808A1 true EP0208808A1 (de) 1987-01-21

Family

ID=25741864

Family Applications (1)

Application Number Title Priority Date Filing Date
EP85110374A Withdrawn EP0208808A1 (de) 1985-07-11 1985-08-19 Gedruckter Widerstand, Verfahren zur Herstellung und Anwendung

Country Status (1)

Country Link
EP (1) EP0208808A1 (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0302589A1 (de) * 1987-06-27 1989-02-08 Jeffery Boardman Verfahren zur Herstellung elektrischer Heizelemente und elektrische Heizelemente, die nach diesem Verfahren hergestellt werden
EP0441294A1 (de) * 1990-02-09 1991-08-14 Gec Alsthom Sa Widerstand für Hybridschaltkreise, insbesondere für hohe Leistung
EP0654956A1 (de) * 1993-11-24 1995-05-24 U'LAMP ENTERPRISES Co., Ltd. Verfahren zum Herstellen einer elektrische beheizte Schicht
FR2835842A1 (fr) * 2002-02-14 2003-08-15 Aldo Urtiti Systeme de protection des batiments ou objets contre les pollutions electromagnetiques
DE102011088323A1 (de) * 2011-12-12 2013-06-13 Anatoli Suprunow Elektrisch leitende Paste für die Herstellung von Heizelementen

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB690478A (en) * 1948-11-12 1953-04-22 Ward Blenkinsop & Co Ltd Improvements in or relating to electrical resistors
FR1579597A (fr) * 1967-06-08 1969-08-29 Acec Eléments chauffants
DE1765774A1 (de) * 1968-07-17 1971-08-26 Roederstein Kondensatoren Verfahren zum Aufbringen von Dickschicht-Widerstandsschichten auf ein Substrat
DE2401784A1 (de) * 1974-01-15 1975-07-24 Sibirsk Nii Energetiki Elektrisch leitender werkstoff

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB690478A (en) * 1948-11-12 1953-04-22 Ward Blenkinsop & Co Ltd Improvements in or relating to electrical resistors
FR1579597A (fr) * 1967-06-08 1969-08-29 Acec Eléments chauffants
DE1765774A1 (de) * 1968-07-17 1971-08-26 Roederstein Kondensatoren Verfahren zum Aufbringen von Dickschicht-Widerstandsschichten auf ein Substrat
DE2401784A1 (de) * 1974-01-15 1975-07-24 Sibirsk Nii Energetiki Elektrisch leitender werkstoff

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JEE, JOURNAL OF ELECTRONIC ENGINEERING, vol. 19, no. 188, August 1982, pages 88-91, Tokyo, JP; K. SOGABE: "Thick-film resistor networks: their materials, trimming and production process"okage 88 - page 89, left-hand column, paragraph 1; figure 1 *
MICROELECTRONICS JOURNAL, vol. 12, no. 2, March/April 1981, pages 32-34, Kirkcaldy, Scotland, GB; A.K. MATKARI et al.: "A novel approach for higher yield in thick-film resistors" *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0302589A1 (de) * 1987-06-27 1989-02-08 Jeffery Boardman Verfahren zur Herstellung elektrischer Heizelemente und elektrische Heizelemente, die nach diesem Verfahren hergestellt werden
EP0441294A1 (de) * 1990-02-09 1991-08-14 Gec Alsthom Sa Widerstand für Hybridschaltkreise, insbesondere für hohe Leistung
FR2658355A1 (fr) * 1990-02-09 1991-08-16 Alsthom Gec Resistance pour circuit hybride, notamment de puissance.
EP0654956A1 (de) * 1993-11-24 1995-05-24 U'LAMP ENTERPRISES Co., Ltd. Verfahren zum Herstellen einer elektrische beheizte Schicht
FR2835842A1 (fr) * 2002-02-14 2003-08-15 Aldo Urtiti Systeme de protection des batiments ou objets contre les pollutions electromagnetiques
DE102011088323A1 (de) * 2011-12-12 2013-06-13 Anatoli Suprunow Elektrisch leitende Paste für die Herstellung von Heizelementen

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