EP0193854B1 - Elektrischer Widerstand mit negativem Temperaturkoeffizienten des Widerstandswertes und Verfahren zu seiner Herstellung - Google Patents

Elektrischer Widerstand mit negativem Temperaturkoeffizienten des Widerstandswertes und Verfahren zu seiner Herstellung Download PDF

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Publication number
EP0193854B1
EP0193854B1 EP86102471A EP86102471A EP0193854B1 EP 0193854 B1 EP0193854 B1 EP 0193854B1 EP 86102471 A EP86102471 A EP 86102471A EP 86102471 A EP86102471 A EP 86102471A EP 0193854 B1 EP0193854 B1 EP 0193854B1
Authority
EP
European Patent Office
Prior art keywords
solder
coatings
loop
current supply
supply elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP86102471A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0193854A1 (de
Inventor
Gerald Kloiber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Bauelemente OHG
Siemens AG
Original Assignee
Siemens Bauelemente OHG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Bauelemente OHG, Siemens AG filed Critical Siemens Bauelemente OHG
Priority to AT86102471T priority Critical patent/ATE35343T1/de
Publication of EP0193854A1 publication Critical patent/EP0193854A1/de
Application granted granted Critical
Publication of EP0193854B1 publication Critical patent/EP0193854B1/de
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1413—Terminals or electrodes formed on resistive elements having negative temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/144—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being welded or soldered
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals

Definitions

  • the invention relates to an electrical resistor with a negative temperature coefficient of its resistance value, generally referred to as a thermistor, NTC resistor or NTC thermistor, made of a disk made of densely sintered metal oxide ceramic with a small diameter, in particular 1.5 mm to 5 mm and a small thickness, in particular 0, 6 mm to 2.5 mm and with attached, firmly adhering and solderable coatings on the end faces of the pane and current supply elements fastened to them with solder.
  • a thermistor, NTC resistor or NTC thermistor made of a disk made of densely sintered metal oxide ceramic with a small diameter, in particular 1.5 mm to 5 mm and a small thickness, in particular 0, 6 mm to 2.5 mm and with attached, firmly adhering and solderable coatings on the end faces of the pane and current supply elements fastened to them with solder.
  • the invention further relates to a method for producing such an NTC resistor, in which current supply elements are applied to the sintered and coated disc and fastened by means of solder.
  • Disk heaters for temperatures from -60 ° C to + 300 ° C, preferably from -30 ° C to + 150 ° C are e.g. Made from the oxides of the transition metals manganese, iron, cobalt, copper, nickel and zinc by pressing under high pressure and then sintering (see SIEMENS Heissleiter delivery program 1984/85 from July 1984, page 2). The resulting ceramic body initially does not allow any soldered connections.
  • the coverings often consist of two or more layers of different metals, of which the first layer attached to the ceramic consists of a metal which forms a firm, ohmic contact with the ceramic material, provided such a contact is required, while the outer layer consists of a solderable, noble metal.
  • Thermocouples made of preferably small, disc-shaped NTC resistance elements with solderable coatings and with connection wires soldered to them and carrying the resistance element are produced in many variations, since one advantage of these designs is that they are simple, cheap and can be produced in large quantities in an automatic process can be.
  • the resistance drift of hot conductor disks with soldered power supply elements is sometimes up to 100% of the initial resistance after repeated thermal shock loads.
  • the present invention is based on the object of specifying a small, disk-shaped NTC resistor with current supply elements soldered to solderable metallic coatings, the connection resistance of which, when subjected to a temperature shock load of 100 times, between -60 ° C and + 300 ° C, preferably -30 ° C to + 130 ° C has a drift of less than 1% and in which a stable mounting of the ceramic disc is ensured by the current supply elements carrying it, furthermore it is an object of the invention to provide a method for producing such an NTC resistor.
  • the NTC resistor of the type specified at the outset is characterized in that the power supply elements are annular at one end as a largely closed eyelet, the outer diameter of which is at most 60% of the diameter of the coating on the disk, the annular eyelet of each power supply element is soldered to the center of the coating, the solder encloses the eyelet, the extent of the solder is limited to the area of the eyelet and the edge areas of the coating are not covered by the solder.
  • the power supply elements consist of a solderable wire, the end of which is shaped into a largely closed, annular eyelet.
  • This wire can be, for example, a silver wire, a silver-plated copper wire or a tinned copper wire, the wire cross-section being between 0.2 mm and 0.8 mm, depending on the size of the hot conductor disc.
  • the power supply elements are molded parts which are stamped from the sheet of a solderable metal, the material thickness of which is between 0.2 mm and 0.8 mm and in which the difference between the outside diameter and inside diameter of the eyelet located at one end is approximately twice the sheet thickness.
  • each power supply element By forming one end of each power supply element as a largely closed, ring-shaped eyelet with a smaller outer diameter than the disk diameter, it is possible, on the one hand, to achieve a firmly bonded connection of the ceramic disk to the power supply elements, which has a peel strength of 15 N to 25 N, in particular of 20 N having.
  • connection resistance of a disk thermistor produced in this way with soldered, supporting the ceramic disk Power supply elements have a drift of less than 1% of their initial value even with a hundredfold temperature change stress from -30 ° C to + 130 ° C.
  • the invention thus enables the production of small, with respect to thermal shock, stable disc heaters according to the preamble of claim 1, which represent an inexpensive alternative to the previously customary shock-resistant NTC thermistors in the temperature range mentioned, in which, for example, platinum wires are sintered directly into the ceramic material or small thermistor discs with metallized end faces are held in clamping contact springs, which also make electrical contact with the assignments.
  • thermistors are often additionally melted into a glass housing and are much more expensive to manufacture than comparable NTC resistors according to the invention (see p. 13 of the SIEMENS delivery program mentioned).
  • each power supply element is designed as an annular eyelet, which is centrally soldered to the metallic coatings, is also found in US Pat. No. 2,606,955, but there is a capacitor made of a ceramic disk with metallic Provide surface coverings of the Stinsreiten of power supply elements, which consist of a wire, one end of which is shaped to an incompletely closed eyelet.
  • these eyelets are attached to the coatings by dip soldering, which are therefore completely covered with solder, including in the edge area.
  • the method for producing an NTC resistor of the type mentioned at the outset is characterized in that, in order to solder each current supply element, solder is connected to the ring-shaped eyelets in such a quantity that the spread of the liquid solder essentially only to the area the eyelet remains limited.
  • a method that can be used here is described, for example, in DE-PS 2 834 348.
  • the procedure is such that a precisely specified amount of a melt of a low-melting metal is fed to a compressed air nozzle, from which it is sprayed abruptly and completely onto the connecting wire and onto a surface of a metal layer defined by a lateral seal in the vicinity of the connecting wire.
  • solder in the form of a solder wire is brought into connection with the coatings in the middle of the disk, spreads radially when the solder joint is heated, and essentially covers only the area of the eyelet resting on the coatings.
  • a disc 1 which in practice e.g. has a diameter D of 3 mm and a thickness d of 1 mm, and which consists of densely sintered metal oxide ceramic and has a negative temperature coefficient of the resistance value.
  • the disc 1 On its end faces 2, 3, the disc 1 is provided with metallic coatings 4, 5.
  • barrier layer-free and adherent coatings 4, 5 consist, for example, of a first layer of aluminum or an alloy predominantly containing aluminum, which is produced by the screen printing process, and a second, solderable layer of copper, which is applied by flame spraying.
  • the power supply elements 6, 7 consist of a silver wire with a diameter of 0.4 mm, which is formed at one end 9 into a largely closed, ring-shaped eyelet 10, the outer diameter A of which is 1.5 mm.
  • the solder 8 encloses the eyelets 10 and covers the coatings 4, 5 essentially only in the area of the eyelets 10, while the edge regions 11 of the coatings 4, 5 remain free of solder 8.
  • the solder 8 has only been shown on the end face 2 for better illustration of an eyelet 10.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Secondary Cells (AREA)
EP86102471A 1985-03-07 1986-02-26 Elektrischer Widerstand mit negativem Temperaturkoeffizienten des Widerstandswertes und Verfahren zu seiner Herstellung Expired EP0193854B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT86102471T ATE35343T1 (de) 1985-03-07 1986-02-26 Elektrischer widerstand mit negativem temperaturkoeffizienten des widerstandswertes und verfahren zu seiner herstellung.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3508163 1985-03-07
DE3508163 1985-03-07

Publications (2)

Publication Number Publication Date
EP0193854A1 EP0193854A1 (de) 1986-09-10
EP0193854B1 true EP0193854B1 (de) 1988-06-22

Family

ID=6264523

Family Applications (1)

Application Number Title Priority Date Filing Date
EP86102471A Expired EP0193854B1 (de) 1985-03-07 1986-02-26 Elektrischer Widerstand mit negativem Temperaturkoeffizienten des Widerstandswertes und Verfahren zu seiner Herstellung

Country Status (5)

Country Link
US (1) US4695818A (enrdf_load_stackoverflow)
EP (1) EP0193854B1 (enrdf_load_stackoverflow)
JP (1) JPS61207001A (enrdf_load_stackoverflow)
AT (1) ATE35343T1 (enrdf_load_stackoverflow)
DE (1) DE3660341D1 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0684612A (ja) * 1992-08-31 1994-03-25 Somar Corp 小形バリスタの製造方法
US6413805B1 (en) 1993-03-12 2002-07-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device forming method
JPH10261507A (ja) * 1997-03-18 1998-09-29 Murata Mfg Co Ltd サーミスタ素子
DE102007033182B4 (de) * 2007-07-13 2012-11-29 Auto-Kabel Management Gmbh Kraftfahrzeugbatteriesensorelement sowie Verfahren zur Herstellung eines Kraftfahrzeugbatteriesensorelements

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB271098A (en) * 1926-05-12 1927-11-17 Loewe Radio G M B H Electrodes for high ohmic resistances and the like
US2606955A (en) * 1949-02-03 1952-08-12 Jeffers Electronics Inc Electrical condenser
US2674583A (en) * 1949-12-23 1954-04-06 Bell Telephone Labor Inc High temperature coefficient resistors and methods of making them
US2686244A (en) * 1951-04-19 1954-08-10 Lockheed Aircraft Corp Electrical attachnent of temperature sensing devices and the like
US3721003A (en) * 1969-10-27 1973-03-20 Matsashita Electric Ind Co Ltd Method for attaching wires to a flat article
US3676211A (en) * 1970-01-02 1972-07-11 Texas Instruments Inc Contact system for electrically conductive ceramic-like material
US3793604A (en) * 1973-04-09 1974-02-19 Gte Sylvania Inc High strength electrical lead for disk type thermistors
DE2834348C2 (de) * 1978-08-04 1982-10-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Stirnkontaktierung elektrischer Kondensatoren
DE2838508A1 (de) * 1978-09-04 1980-03-20 Siemens Ag Elektrischer widerstand mit positivem temperaturkoeffizienten des widerstandswertes

Also Published As

Publication number Publication date
ATE35343T1 (de) 1988-07-15
JPS61207001A (ja) 1986-09-13
DE3660341D1 (en) 1988-07-28
JPH0563001B2 (enrdf_load_stackoverflow) 1993-09-09
US4695818A (en) 1987-09-22
EP0193854A1 (de) 1986-09-10

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