EP0177759B1 - Elektronisches Bauteil, insbesondere für eine Chip-Induktivität - Google Patents

Elektronisches Bauteil, insbesondere für eine Chip-Induktivität Download PDF

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Publication number
EP0177759B1
EP0177759B1 EP85111179A EP85111179A EP0177759B1 EP 0177759 B1 EP0177759 B1 EP 0177759B1 EP 85111179 A EP85111179 A EP 85111179A EP 85111179 A EP85111179 A EP 85111179A EP 0177759 B1 EP0177759 B1 EP 0177759B1
Authority
EP
European Patent Office
Prior art keywords
cutouts
contact elements
electronic component
component according
winding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP85111179A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0177759A1 (de
Inventor
Kurt Dipl.-Phys. Marth
Gerhard Müller
Jürgen Dipl.-Ing. Pütz
Josef Schindler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0177759A1 publication Critical patent/EP0177759A1/de
Application granted granted Critical
Publication of EP0177759B1 publication Critical patent/EP0177759B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/045—Fixed inductances of the signal type  with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F2017/048—Fixed inductances of the signal type  with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H01F2027/295—Surface mounted devices with flexible terminals

Definitions

  • the invention relates to an electronic component, in particular for a chip inductance, in particular air coil and RF choke, with a solid core part with a vertical prismatic spatial shape, in particular cuboids, cubes or cylinders, consisting of ferromagnetic or electrically non-conductive material, in particular ferrite, ceramic or Plastic, with a winding space that can be wound in one or more layers and set apart from parallel ends of the core part and with cutouts arranged in the area of these ends for receiving electrical contact elements.
  • Chip inductors are smaller in comparison to conventional wired inductors, can be manufactured with less effort and are more suitable for use in the automatic assembly machines for printed circuit boards.
  • the known chip inductors are partly manufactured using layer technology and partly designed as rectangular or cylindrical, wire-wound magnetic cores, in particular ferrite cores.
  • a carrier is coated with a layer of magnetic material and a conductor track shaped into a coil is applied to this layer, the partial inductance thus produced being combined with further partial inductances to form a stack, depending on the desired inductance.
  • Numerous methods are not known for through-contacting the ends of the individual coils or partial inductors.
  • chip inductors are characterized by their space-saving design, can be soldered directly onto printed circuit boards and do not require any additional wires as connection elements.
  • the disadvantage is their complex production, which is due to the layering technique. Variations in the layer thickness of the magnetic layer that are unavoidable in production cause undesirable fluctuations in the L and Q values of the inductors. Silver or a silver-palladium alloy, for example, must be used as the material for the coil conductor tracks and a high ohmic resistance of the conductor tracks must be accepted. Since the conductor tracks are embedded in the magnetic layer, magnetic saturation occurs due to the closed magnetic circuit even at low values; the DC bias properties of the chip inductance are consequently deteriorated. In addition, the number of coil turns cannot be selected to any desired height, and therefore an inductance of any desired height cannot be set.
  • a likewise known chip inductor has a rectangular ferrite core with a rectangular or cylindrical central part as a winding support and flanges integrally formed on this support, which also have a rectangular cross section.
  • the winding ends are contacted by means of electrically conductive layers on the flanges on the end face, to which the winding ends are soldered.
  • the finished wrap is embedded in synthetic resin, which forms a cuboid together with the flanges.
  • a chip inductor equipped with a ferrite roller core has also been proposed.
  • the wound roll core is embedded in a cuboid potting, against the one end faces of which the ends of strip-shaped connecting elements rest, which are contacted at their other ends with electrically conductive solderable layers of the end faces of the roll core flanges (see DE-OS 3225782 A1).
  • a disadvantage of this embodiment is that the connection elements have to be fastened to the coil core in two processing steps. First of all, a metal plate is glued to the coil former and only then the actual connecting strip is soldered on.
  • US Pat. No. 3,585,553 discloses a chip inductor with a solid ferrite core part with a cuboid shape, which has a winding space wound in one layer, set against the parallel ends of the core part, and cutouts arranged in the region of these ends to lead out the winding ends.
  • the cutouts are guided in the longitudinal direction of the chip inductance and the faces of the ends arranged on both sides are covered with electrically conductive layers, via which the winding ends are contacted.
  • the structure of this chip inductance is relatively simple; however, the electrically conductive contact layers have to be manufactured in a complicated manner.
  • the present invention has for its object to provide an electronic component of the type mentioned, which can be produced with little effort, is suitable for manufacturing chip inductors and meets the requirements of certain electronic devices in terms of high resonance frequencies insofar as it e.g. single layer and can be wound with high numbers of turns despite small dimensions.
  • the connection elements of this electronic component should also be such that they meet the high mechanical requirements e.g. during assembly and also the mechanical loads that may occur if the printed circuit boards bend.
  • the invention provides for an electronic component according to the preamble of the patent claim that the end faces of these stimulants have mutually parallel, mutually parallel, edge-open recesses, in which plate-shaped contact elements are held, each of which holds one over the entire narrow or broad side Have stimulating protruding part, bent out from the edge-open recesses, and intended for winding the winding ends.
  • US-A 3 735 214 does indeed have an adapter plate, over the entire side of which there are recesses which are open at the edge and which are used for Receiving platelet-shaped contact elements are suitable, however, the contact element ends on the underside of the plate, which form the contact surfaces to the printed circuit board, are not bent over, but the other end of this contact element is used for winding a winding end of a separate inductive component.
  • open-edge recesses are e.g. Grooves and slots, in particular dovetail-shaped cross section suitable.
  • the contact elements which are glued into the recesses, clamped or held in place in them, each protrude with their one ends beyond the ends and are bent in a U-shape in these parts intended for winding the winding ends.
  • the manufacture of these electronic components and their chip inductors is considerably simplified if - as is known per se - the contact elements are initially designed as detachable parts of a system carrier, the wound core parts are plugged onto these contact elements, their winding ends are wound onto the contact elements and - if required - the chip inductance manufactured in this way is encased with insulating material, which can be mixed with carbonyl iron or ferrite for certain shielding requirements.
  • the system carriers equipped with these chip inductors can be separated before or, if necessary, only after they have been coated with insulating material.
  • the figure shows a chip inductor according to the invention in a partially cut and perspective view
  • Fig. 1 is a solid core part in cuboid shape, which z. B. in the manufacture of an RF choke made of magnetic material, in particular ferrite, or, if z. B. an air coil is to be made of electrical non-conductive material, in particular ceramic or plastic.
  • the core part 1 is formed with a compared to its one parallel stimulating 2 winding space, which carries a single-layer winding 4 in the embodiment shown.
  • the end faces of the ends 2, 2 have mutually parallel recesses 3, 3 which run over the entire narrow or broad side of the end faces and have a dovetail-shaped cross section.
  • Platelet-shaped contact elements 5 are inserted into these recesses and are chamfered at one corner edge 7 to facilitate their insertion.
  • the contact elements 5 each have a part 8 projecting over the ends 2, 2 and bent in a U-shape and intended for winding the winding ends 6.
  • the contact elements 5 can be glued into the recesses 3 or can be resiliently held in the recesses by appropriate design of their parts guided in the recess.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
EP85111179A 1984-09-13 1985-09-04 Elektronisches Bauteil, insbesondere für eine Chip-Induktivität Expired - Lifetime EP0177759B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3433692 1984-09-13
DE3433692 1984-09-13

Publications (2)

Publication Number Publication Date
EP0177759A1 EP0177759A1 (de) 1986-04-16
EP0177759B1 true EP0177759B1 (de) 1990-05-16

Family

ID=6245346

Family Applications (1)

Application Number Title Priority Date Filing Date
EP85111179A Expired - Lifetime EP0177759B1 (de) 1984-09-13 1985-09-04 Elektronisches Bauteil, insbesondere für eine Chip-Induktivität

Country Status (4)

Country Link
US (1) US4704592A (US07534539-20090519-C00280.png)
EP (1) EP0177759B1 (US07534539-20090519-C00280.png)
JP (1) JPS6171609A (US07534539-20090519-C00280.png)
DE (1) DE3577771D1 (US07534539-20090519-C00280.png)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2606544A1 (fr) * 1986-11-07 1988-05-13 Thomson Csf Inductance
GB2282271A (en) * 1993-09-24 1995-03-29 Siemens Matsushita Components Chip inductor
EP0702378A2 (de) 1994-09-14 1996-03-20 SIEMENS MATSUSHITA COMPONENTS GmbH & CO. KG Chip-Induktivität
US5748065A (en) * 1994-03-30 1998-05-05 Matsushita Electric Industrial Co., Ltd. Chip inductor

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JPS63187312U (US07534539-20090519-C00280.png) * 1987-05-26 1988-11-30
JPH06325938A (ja) * 1993-05-11 1994-11-25 Murata Mfg Co Ltd 巻線型コイル
DE19547091B4 (de) * 1995-12-16 2005-04-07 Kaschke Kg (Gmbh & Co.) Antennenspule mit oberflächenmontierbarem Gehäuse und Verfahren zu deren Herstellung
US6144280A (en) * 1996-11-29 2000-11-07 Taiyo Yuden Co., Ltd. Wire wound electronic component and method of manufacturing the same
US5959587A (en) * 1997-09-12 1999-09-28 Ppg Industries Ohio, Inc. On the glass antenna system
FI105294B (fi) * 1997-12-16 2000-07-14 Nokia Networks Oy Järjestely magneettipiirin toteuttamiseksi piirilevylle
US6137390A (en) * 1999-05-03 2000-10-24 Industrial Technology Research Institute Inductors with minimized EMI effect and the method of manufacturing the same
US6437676B1 (en) * 1999-06-29 2002-08-20 Matsushita Electric Industrial Co., Ltd. Inductance element
EP1250828A4 (en) * 2000-01-13 2006-08-02 Sonion Microtronic Nederland B R.F. PACKAGING AND SHIELDING FOR T PHONIC PHONOCAPTERS
US7088211B2 (en) * 2003-07-15 2006-08-08 Astec International Limited Space saving surface-mounted inductors
US20050145408A1 (en) * 2003-12-03 2005-07-07 Scott Hess Electronic component
WO2008008538A2 (en) * 2006-07-14 2008-01-17 Pulse Engineering, Inc. Self-leaded surface mount inductors and methods
US20150137919A1 (en) * 2011-10-25 2015-05-21 Correlated Magnetics Research, Llc System and Method for Producing Magnetic Structures
US20120249107A1 (en) * 2011-04-01 2012-10-04 Cowley Nicholas P Coupled inductor to facilitate integrated power delivery
EP2530686B1 (en) * 2011-06-01 2014-08-06 ABB Research Ltd. Pressing of transformer windings during active part drying
US10136516B2 (en) 2012-03-13 2018-11-20 Intel Corporation Microelectronic device attachment on a reverse microelectronic package
WO2013137710A1 (en) 2012-03-13 2013-09-19 Intel Corporation (A Corporation Of Delaware) Microelectronic device attachment on a reverse microelectronic package
US9526175B2 (en) * 2012-04-24 2016-12-20 Intel Corporation Suspended inductor microelectronic structures
US9177714B2 (en) * 2012-12-28 2015-11-03 Power Integrations, Inc. Transverse shield wire for energy transfer element
JP2021002577A (ja) * 2019-06-21 2021-01-07 株式会社村田製作所 巻線型インダクタ部品

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US1997198A (en) * 1931-01-31 1935-04-09 Bell Telephone Labor Inc Terminal mounting for resistances
GB397536A (en) * 1932-02-19 1933-08-21 Pye Radio Ltd Improvements in or relating to electrical transformers, particularly for use as intervalve transformers in radio apparatus
US2339067A (en) * 1941-04-05 1944-01-11 Western Electric Co Coil unit
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GB1278257A (en) * 1968-08-16 1972-06-21 Bsr Ltd Improvements relating to bobbin assemblies
US3585553A (en) * 1970-04-16 1971-06-15 Us Army Microminiature leadless inductance element
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DE2148534A1 (de) * 1971-09-29 1973-04-05 Plathner Ernst Transformatoren Anschlussfahne fuer transformatoren, drosseln od. dgl
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DE2236241A1 (de) * 1972-07-24 1974-02-07 Siemens Ag Spulenkoerper
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2606544A1 (fr) * 1986-11-07 1988-05-13 Thomson Csf Inductance
EP0270417A1 (fr) * 1986-11-07 1988-06-08 Thomson-Csf Inductance
GB2282271A (en) * 1993-09-24 1995-03-29 Siemens Matsushita Components Chip inductor
US5748065A (en) * 1994-03-30 1998-05-05 Matsushita Electric Industrial Co., Ltd. Chip inductor
US5977857A (en) * 1994-03-30 1999-11-02 Matsushita Electric Industrial Co., Ltd. Chip inductor
US6118364A (en) * 1994-03-30 2000-09-12 Matsushita Electric Industrial Co., Ltd. Chip inductor
US6151770A (en) * 1994-03-30 2000-11-28 Matsushita Electric Industrial Co., Ltd. Method of forming a chip inductor
EP0702378A2 (de) 1994-09-14 1996-03-20 SIEMENS MATSUSHITA COMPONENTS GmbH & CO. KG Chip-Induktivität

Also Published As

Publication number Publication date
JPH0564845B2 (US07534539-20090519-C00280.png) 1993-09-16
DE3577771D1 (de) 1990-06-21
US4704592A (en) 1987-11-03
EP0177759A1 (de) 1986-04-16
JPS6171609A (ja) 1986-04-12

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