EP0160601B1 - Kleiner Präzisionswiderstand für hohe Spannungen aus Dickschicht-Technologie - Google Patents

Kleiner Präzisionswiderstand für hohe Spannungen aus Dickschicht-Technologie Download PDF

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Publication number
EP0160601B1
EP0160601B1 EP85400662A EP85400662A EP0160601B1 EP 0160601 B1 EP0160601 B1 EP 0160601B1 EP 85400662 A EP85400662 A EP 85400662A EP 85400662 A EP85400662 A EP 85400662A EP 0160601 B1 EP0160601 B1 EP 0160601B1
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EP
European Patent Office
Prior art keywords
edge
contour
cuts
resistive film
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP85400662A
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English (en)
French (fr)
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EP0160601A1 (de
Inventor
Joel Bourolleau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bendix Electronics SA
Original Assignee
Siemens Automotive SA
Bendix Electronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Automotive SA, Bendix Electronics SA filed Critical Siemens Automotive SA
Publication of EP0160601A1 publication Critical patent/EP0160601A1/de
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Publication of EP0160601B1 publication Critical patent/EP0160601B1/de
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material

Definitions

  • the present invention relates to a resistive circuit element produced using the technology known as “thick layers by superposition of two layers, one conductive, the other resistive, in order to obtain a resistance supporting high voltages and brought to an ohmic value. precise by several laser cuts correctly distributed in the resistive layer.
  • the hybrid technology “thick layers has as main materials resistive, conductive and insulating inks.
  • These inks are in the form of pastes which contain the following elements: special powdered glasses, powdered precious metals, organic binder, diluent consisting of a mixture of solvents.
  • These ingredients which are mixed to form a thick paste are deposited on ceramic plates called substrates, generally alumina, by the screen printing process.
  • substrates generally alumina
  • the part is dried at 100-150 ° C to remove the solvents and baked in an oven at 500-1000 ° C. generally 850 ° C.
  • decomposition of the organic binder sintering of the glass particles on the surface of the substrate and vitrification of the whole.
  • the components of the circuit adhere very strongly to the ceramic.
  • a resistance made in hybrid technology "thick layers is shown in Figure 1 of the accompanying drawings. It comprises two different layers deposited on a substrate 1: the first 2a, 2b, made of a screen-printed conductive ink, dried and optionally baked, serves as a support and terminals for the resistance, the second 3, made of a resistive screen-printed ink , dried and cooked, is in itself the resistance itself. These two layers, if the manufacturing method allows, can be baked, that is to say baked together.
  • resistors can be produced in a very wide range of values (10-10 6 ⁇ ) depending on the choice of the type of resistive ink used and the variation in the geometry of the printed resistors.
  • the materials used in the composition of the conductive ink for the conductive layer are based on metals or alloys such as silver, palladium, platinum, gold, copper, aluminum.
  • the choice of these different metals is based on several criteria: weldability, resistance to aging, definition in printing, low resistivity, adhesion to the substrate, compatibility with the resistive ink used and possibility of annealing.
  • the thickness of the conductive layer is generally between 5 ⁇ m and 50 ⁇ m.
  • the most used materials used in the composition of the ink for the resistive layer are metal oxides such as ruthenium oxide or pyrochlores such as thallium ruthenate, the main parameters of which are resistivity, the coefficient of thermal variation, stability over time.
  • the thickness of the resistive layer is generally between 10 and 30 ⁇ m.
  • Such a “thick film” hybrid resistance can be adjusted by means of a medium power laser beam (0-5 Watts).
  • This laser cutting technology consists of vaporizing resistive materials by creating coherent light pulses of high intensity and very short duration. A succession of laser pulses which overlap more or less creates a groove of small width (of the order of 50 ⁇ m) which crosses the resistive layer to the substrate and thus cuts the resistance. This cut deflects the current lines which cross the structure, thereby increasing its ohmic value, and all of the voltage applied to the resistor is found on either side of the laser groove.
  • FIGS. 2A to 2E of the appended drawings show several forms of cutouts which have been the subject of experimental tests on hybrid resistors "thick layers of small bulk subjected to voltages of several. hundreds of volts. These forms of cuts proved to be unsuitable because it resulted either in the creation of hot spots in 4a, 4c, 4d, 4g, 4h, 4i, 4j, or a too strong voltage gradient between the two edges of the laser groove identified 4b , 4e, 4f, 4k, 41, likely to cause poor stability or destruction of the resistance, by appearance of an electric arc.
  • Patent DE-A-2 120 896 describes a resistor adjustment method according to which one or more regularly spaced cuts are made and parallel to the conductive terminals of the resistor, which causes a narrowing of the contact lines between these terminals. This embodiment is very close to the examples of FIGS. 2A and 2B which illustrate the drawbacks of the solutions of the prior art.
  • the invention therefore aims to provide a high-voltage resistance produced using the hybrid “thick layers” technology, the precise adjustment of which to the desired value is ensured by cutouts. formed in the thickness of the resistive layer in a configuration able to allow the resistance in tension of the resistor despite a minimal dimensioning of the latter.
  • the subject of the invention is a high-voltage precision resistance comprising a flat substrate of insulating material on which have been deposited by screen printing at least one resistive layer of substantially rectangular, square or similar shape and a conductive layer having under the shape of two parallel strips extending along two opposite edges of the resistive layer and constituting terminals electrically connected to each other by said resistive layer, the resistive layer comprising regularly spaced and rectilinear cutouts made in its thickness, up to the insulating substrate , parallel to said opposite edges from a third edge of the resistive layer, characterized in that the rectilinear cutouts have lengths the greater the closer they are to the middle of the third edge, the ends opposite to the third edge rectilinear cutouts defining from the intersections of the third edge with the terminals s a contour with a vertex in its middle part.
  • said contour is substantially symmetrical with respect to an axis parallel to the terminals and passing through the middle of the third edge.
  • the length of the rectilinear cutouts is a direct function of the distance which exists between the adjacent terminal and the cutout considered.
  • said contour has the shape of an isosceles triangle whose base coincides with the third edge and whose two equal sides extend from said intersections to said axis of symmetry.
  • one of the cutouts giving the resistance its final value has a length such that its end opposite the third edge does not necessarily coincide with said contour.
  • the hybrid resistance “thick layers shown in FIG. 3 comprises a resistive layer 3 of rectangular shape (but a square shape or an approaching polygonal shape are also suitable) deposited on an insulating substrate 1, for example made of ceramic based on alumina. Two opposite edges of the resistive layer 3 overlap a conductive layer in the form of two parallel strips 2a, 2b constituting the terminals of the resistance.
  • cuts 5a to 5f made in the thickness of the resistive layer 3 up to the insulating substrate. These cutouts are oriented parallel to terminals 2a and 2b and extend from one 6 of the other two edges of the resistive layer 3 perpendicular to terminals 2a, 2b.
  • the rectilinear cutouts or grooves 5a to 5f have progressively increasing lengths of the terminals towards the middle of the referenced edge, so that their ends opposite this edge 6 define an envelope or contour 7 extending from the intersections 8a, 8b to reference edge 6 with the layers 2a, 2b presenting an apex in its middle part.
  • the rectilinear cuts 5a to 5f are regularly spaced along the reference edge 6 and are produced by means of a laser beam as described above.
  • FIG. 4 shows an alternative embodiment in which the envelope or contour defined by the ends of the cutouts and the reference edge is triangular.
  • the lengths of the cuts are a direct function of the interval which exists between the adjacent terminal 2a or 2b and the cut considered, so as to be more or less regularly and symmetrically decreasing from an axis dividing the length of two into two equal parts. the resistive layer 3.
  • the last cut conferring the desired precision on the resistance may have a length which does not coincide with the course of the triangular contour 9.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)

Claims (5)

1. Präzisionswiderstand für hohe Spannungen, bestehend aus einem ebenen Substrat aus Isoliermaterial (1), auf dem mittels Serigraphie mindestens eine Widerstandsschicht (3) in einer etwa rechteckigen, quadratischen oder ähnlichen Form und eine leitende Schicht in Form zweier paralleler Streifen (2a, 2b) deponiert sind, die sich längs zweier Ränder gegenüber der Widerstandsschicht erstrecken und untereinander über die Widerstandsschicht elektrisch verbundene Anschlüsse bilden, wobei die Widerstandsschicht geradlinige, gleichmäßig beabstandete und in ihrer Dicke bis zum isolierenden Substrat reichende Einschnitte (5a bis 5f) aufweist, die parallel zu den genannten Rändern von einem dritten Rand (6) der Widerstandsschicht ausgehen, dadurch gekennzeichnet, daß die geradlinigen Einschnitte (5a bis 5f) Längen aufweisen, die umso größer sind je näher sie zur Mitte des dritten Randes (6) liegen, und daß die dem dritten Rand (6) entgegengesetzten Enden der geradlinigen Einschnitte ausgehend von Schnittpunkten (8a, 8b) des drit-' ten Randes (6) mit den Anschlüssen (2a, 2b) eine Kontur (7; 9) bilden, die im mittleren Abschnitt einen Scheitel aufweist.
2. Widerstand nach Anspruch 1, dadurch gekennzeichnet, daß die Kontur (7 ; 9) etwa symmetrisch zu einer Achse ist, die parallel zu den Anschlüssen (2a, 2b) und durch die Mitte des dritten Randes verläuft.
3. Widerstand nach Anspruch 2, dadurch gekennzeichnet, daß die Länge der geradlinigen Einschnitte (5a bis 5f) unmittelbar abhängig ist von dem Abstand, der zwischen dem benachbarten Anschluß (2a, 2b) und dem betrachteten Abschnitt liegt.
4. Widerstand nach Anspruch 3, dadurch gekennzeichnet, daß die Kontur (9) die Form eines gleichschenkligen Dreiecks aufweist, dessen Basis mit dem dritten Rand (6) übereinstimmt und dessen Seiten sich ausgehend von den Schnittpunkten (8a, 8b) bis zur Symmetrieachse erstrecken.
5. Widerstand nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß einer der Einschnitte eine Länge derart aufweist, daß sein den dritten Rand (6) entgegengesetztes Ende nicht mit der Kontur (9) übereinstimmt, um dem Widerstand einen bestimmten Wert zu verleihen.
EP85400662A 1984-04-10 1985-04-03 Kleiner Präzisionswiderstand für hohe Spannungen aus Dickschicht-Technologie Expired EP0160601B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8405621 1984-04-10
FR8405621A FR2562711B1 (fr) 1984-04-10 1984-04-10 Resistance haute tension de precision a faible encombrement en technologie couches epaisses

Publications (2)

Publication Number Publication Date
EP0160601A1 EP0160601A1 (de) 1985-11-06
EP0160601B1 true EP0160601B1 (de) 1988-07-06

Family

ID=9303008

Family Applications (1)

Application Number Title Priority Date Filing Date
EP85400662A Expired EP0160601B1 (de) 1984-04-10 1985-04-03 Kleiner Präzisionswiderstand für hohe Spannungen aus Dickschicht-Technologie

Country Status (4)

Country Link
US (1) US4630025A (de)
EP (1) EP0160601B1 (de)
DE (1) DE3563668D1 (de)
FR (1) FR2562711B1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3627682A1 (de) * 1986-08-14 1988-02-25 Bbc Brown Boveri & Cie Praezisionswiderstandsnetzwerk, insbesondere fuer dickschicht-hybrid-schaltungen
US5197329A (en) * 1992-05-22 1993-03-30 White Consolidated Industries, Inc. PTC water level sensor and control
US5364705A (en) * 1992-06-25 1994-11-15 Mcdonnell Douglas Helicopter Co. Hybrid resistance cards and methods for manufacturing same
US5361300A (en) * 1993-01-19 1994-11-01 Caddock Electronics, Inc. Balancing resistor and thermistor network for telephone circuits, and combination thereof with relay
US5481242A (en) * 1994-05-10 1996-01-02 Caddock Electronics, Inc. Debris-reducing telephone resistor combination and method
US5594407A (en) * 1994-07-12 1997-01-14 Caddock Electronics, Inc. Debris-reducing film-type resistor and method
JP3327311B2 (ja) * 1995-02-21 2002-09-24 株式会社村田製作所 抵抗体のトリミング方法
JPH1126204A (ja) * 1997-07-09 1999-01-29 Matsushita Electric Ind Co Ltd 抵抗器およびその製造方法
US6047463A (en) 1998-06-12 2000-04-11 Intermedics Inc. Embedded trimmable resistors
JP2000353604A (ja) * 1999-06-10 2000-12-19 Alps Electric Co Ltd 可変抵抗器
SG119230A1 (en) * 2004-07-29 2006-02-28 Micron Technology Inc Interposer including at least one passive element at least partially defined by a recess formed therein method of manufacture system including same and wafer-scale interposer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1068907A (en) * 1910-12-10 1913-07-29 Westinghouse Electric & Mfg Co Resister.
DE2120896B2 (de) * 1971-04-28 1977-02-03 Siemens AG, 1000 Berlin und 8000 München Verfahren zum abgleichen von flaechenhaften elektrischen widerstaenden
US4284970A (en) * 1979-08-09 1981-08-18 Bell Telephone Laboratories, Incorporated Fabrication of film resistor circuits
FR2529374B1 (fr) * 1982-06-25 1985-06-21 Renix Electronique Sa Element de circuit resistif et son procede de fabrication

Also Published As

Publication number Publication date
FR2562711A1 (fr) 1985-10-11
DE3563668D1 (en) 1988-08-11
FR2562711B1 (fr) 1987-01-23
EP0160601A1 (de) 1985-11-06
US4630025A (en) 1986-12-16

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