EP0132719A1 - Verfahren und Anordnung zum Betreiben eines Plattierbades in einem geschlossenen Kreislauf - Google Patents

Verfahren und Anordnung zum Betreiben eines Plattierbades in einem geschlossenen Kreislauf Download PDF

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Publication number
EP0132719A1
EP0132719A1 EP19840108238 EP84108238A EP0132719A1 EP 0132719 A1 EP0132719 A1 EP 0132719A1 EP 19840108238 EP19840108238 EP 19840108238 EP 84108238 A EP84108238 A EP 84108238A EP 0132719 A1 EP0132719 A1 EP 0132719A1
Authority
EP
European Patent Office
Prior art keywords
bath
evaporation
zone
electroplating
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19840108238
Other languages
English (en)
French (fr)
Other versions
EP0132719B1 (de
Inventor
Ryszard Wasiak
Marek Kieszkowski
Dariusz Cichowski
Pawel Ciecko
Maciej Zubr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Instytut Mechaniki Precyzyjnej
Original Assignee
Instytut Mechaniki Precyzyjnej
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PL24323083A external-priority patent/PL139479B1/pl
Priority claimed from PL24440083A external-priority patent/PL139478B1/pl
Application filed by Instytut Mechaniki Precyzyjnej filed Critical Instytut Mechaniki Precyzyjnej
Publication of EP0132719A1 publication Critical patent/EP0132719A1/de
Application granted granted Critical
Publication of EP0132719B1 publication Critical patent/EP0132719B1/de
Expired legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003—Electroplating using gases, e.g. pressure influence

Definitions

  • the subject of the invention is a method of conducting a closed cycle of the bath for plating of coatings, especially in the process of electroplating, end devices for conducting a closed cycle of the bath for plating of costings, especially in the process of electroplating.
  • the known methods of conducting e closed cycle of the bath in the process of electroplating consist usually in conducting the evaporative process. It is most often aimed at evaporation of water used for rinsing and at obtaining a concentrated solution of the composition corresponding to the composition of electroplating beth, after which rinsing follows.
  • the known evaporative processes applied for this purpose are usually conducted at lowered pressure end indirect heating, most often at a raising film of the liquid.
  • the application of vacuum is aimed at lowering the temperature of the process and at increasing the intensity thereof. This increases, however, the degree of difficulty of conducting the process end raises the cost of the process.
  • Those skilled in the art knov. also vacuum processes with forced circulation, of still higher degree of complication and additionally increased costs of conducting the process.
  • Another method of conducting the evaporative process is direct evaporation at etmospheric pressure.
  • the feed is he p ted in an external heat exchanger, supplied upward to a column with a packing, wherein it evaporates, flowing down in the counter-current in relation to the flowing air.
  • Known devices for conducting the closed cycle of beth in the process of electroplating comprise usually an evaporator. This is most often aimed at evaporation of water used for rinsing and at obtaining a concentrated solution of the composition corresponding to the composition of electroplating bath, after which rinsing follows.
  • the known evaporators are, as a rule, vacuum devices, with an external heating chamber (indirect evaporators). Most often they are the so--called evaporators with a raising film of the liquid (of the comp p nier Pfaudler, Corning, Cosmos). The application of v p cuum is aimed at lowering the temperature of the process and at increasing the intensity thereof. This raises, however, the cost of the device.
  • vacuum circulating evaporators (of the Simex company).
  • Another group of the applied evaporators are direct evaporators, in which evaporation proceeds at atmospheric pressure (evaporators of the Lancy company).
  • the feed is heated in the external heat exchanger, supplied upward to a column with a packing, wherein while flowing down in the counter--current in relation to the flowing air it evaporates.
  • the heating. chamber is an integral part of the evaporator.
  • heating elements of the evaporator should be made of special borosilicate glass (Simax company) or of special materials, e.g. titanium, tantalum.
  • Auxiliary equipment must be of special design (e.g. pumps) etc.
  • the task of the invention is to work out a method end a device for pumping off the bath, comprising an appropriate evaporation device, so that it is possible to achieve the required evaporation of water from the system at the minimum costs.
  • the method of conducting a closed cycle of the bath for plating of coatings consists in feeding the bath from the electrolytic machining zone to the evaporation zone, and from the eveporation zone - after concentration of the bath in the evaporation zone - back to the electrolytic machining zone, and according to the essence of the invention it is characterized by that the electroplating bath is heated in the electrolytic machining zone and is introduced to the evaporation zone in which the bath is conducted in a flow in a thin layer horizontally, whereby in the whole evaporation zone or only in a part, thereof through the horizontally Conducted bath air is conducted from below upwards by barbotage, eventually, the conducted air is heated end afterwards wet air conducted through the beth is taken off outside from the circulation after previous separation of entrained particles by the inertia method, end the concentrated solution from the evaporation zone is fed back to the electrolytic machining zone, the electroplating b p th being made up in a
  • the electroplating bath is heated in the electrolytic machining zone, supplying in the s p id zone at least 25% of heat necessary for evaporation in the evaporation zone. In this case the remaining amount of necessary heat is supplied to air which passes through the bath in the evaporation zone. by barbotege.
  • the air taken off outside from the circulation, after adding water vapour thereto, is used for washing the objects after the said electrorla- _ ting bath.
  • the device for conducting a closed cycle of the beth for plating of coetings, especially in the process of electroplating, comprising an electrolytic tank, en evaporation device connected with the electrolytic tank through a device feeding the electroplating bath, prefer p bly an air lift pump, according to the essence of the invention is characterized by th p t in the electrolytic tank heating devices are comprised, end in the evaporation chamber of the evaporation device there are no heating devices, the evaporation chamber of the evaporation device is horizontal and comprises a partition whose height establishes the thickness of the layer of the liquid, the bath inlet to the evaporation chamber is at the opposite side in relation to the partition, the evaporation chamber comprises a perforated conduit or conduits and/or conduits with porous walls, through which air is supplied to the evaporated bath, eventually heated air, the evaporation chamber is from the side of the partition connected with a separator, the upper part of the separ p- tor comprises a
  • the constructional material for building the evaporation device is polyvinyl chloride.
  • the drop catcher is of a labyrinth type and comprises air-flow guide vanes.
  • the bath is evaporated, and heat necessary to heat the liquid is supplied, in principle, only to the bath in the electrolytic tank or in the vicinity thereof, with the use of the heating element being the standard equipment of the said tank, or only the air introduced to the evaporation zone is heated.
  • the heating element being the standard equipment of the said tank, or only the air introduced to the evaporation zone is heated.
  • the evaporator is assembled with the already operating electroplating equipment, we use the heating element already existing in the electrolytic machining zone. Due to this, in newly designed lines we avoid doubling the heating elements.
  • the method according to the invention reduces also the number of devices necessary for automatic control of the working parameters of the bath. If necessary for power reasons, additional heating is employed, with the supply of heat power being the complement between the heat power of the already existing equipment and the heat power necessary to conduct evaporation with the reoui- red yield.
  • evaporation is effected directly, by letting the air pass through the bath being evaporated flowing in a closed channel, being in the phase of dynamic foam.
  • Fig.l presents a schematic device together with a washer and a feeding tank
  • fig.2 presents schematically a single evaporation module applied for realisation according to the invention and marked in fig.1 with number 10.
  • the feed is supplied by a stub pipe 1, it flows by a flow pipe 2, overflows through a partition 3, and from aseparator 4 is taken off by a stub pipe 5-
  • p p- rellel to the exis of the pipe 2
  • a supply pipe 6 of air is immereed, said air, passing through the solution, causes barbot p ge and evaporation thereof.
  • the drop catcher 7 arrests particles of the solution entrained by air.
  • polyvinyl chloride pipes are usually used.
  • the device and the method are characterized by big design simplicity, essiness of execution, simple operation and failure-free work during use.
  • washings from weshere 8 are directed as a whole by a conduit 20 to an electrolytic tank 9.
  • the rate of flow of the bath through the evaporator 10 is controlled by the valve 11:
  • the device has en emergency overflow whose overflow conduit is marked in fig.2 with number 18.
  • the bath is supplied by the pump 12 to the feeding tank 13 wherefrom it flows to the tenk 9.
  • the temperature in the tank is controlled by a temperature-control system consisting of elements 14, 15, 16, 17.
  • the outlet of air from the evaporation module is marked with number 19. Total evaporation from two modules connected parallely was 10 1/hr. It enables closing the materiel circulation of the electroplating plant.
  • Fig.2 does not show ion-exchenre columns whrough which washings flow. in order to elimin p- te impurities, mainly ions Cr 3+ , F e3+ .

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
EP19840108238 1983-07-30 1984-07-12 Verfahren und Anordnung zum Betreiben eines Plattierbades in einem geschlossenen Kreislauf Expired EP0132719B1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
PL24323083A PL139479B1 (en) 1983-07-30 1983-07-30 Apparatus for effecting closed cycle recirculation of a bath used in electrodeposition processes
PL243230 1983-07-30
PL24440083A PL139478B1 (en) 1983-11-02 1983-11-02 Method of effecting closed cycle recirculation of a bath used in electrodepostion processes
PL244400 1983-11-02

Publications (2)

Publication Number Publication Date
EP0132719A1 true EP0132719A1 (de) 1985-02-13
EP0132719B1 EP0132719B1 (de) 1988-03-09

Family

ID=26652989

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19840108238 Expired EP0132719B1 (de) 1983-07-30 1984-07-12 Verfahren und Anordnung zum Betreiben eines Plattierbades in einem geschlossenen Kreislauf

Country Status (2)

Country Link
EP (1) EP0132719B1 (de)
DE (1) DE3469764D1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4781806A (en) * 1985-10-11 1988-11-01 Dominic Tenace Electroplating system
EP1369505A3 (de) * 2002-06-06 2006-04-05 Goema GmbH Verfahren und Vorrichtung zur Spülwasserrückführung und Reinigung eines Prozessbades

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3623962A (en) * 1968-07-31 1971-11-30 Nat Steel Corp Reducing electrolytic sludge formation
DE1962249B2 (de) * 1969-12-11 1978-08-17 Nordnero Ab, Kungaelv (Schweden) Verfahren zum Kühlen von Behandlungsbädern
DE2729270B2 (de) * 1977-06-29 1980-06-12 Stolle, Hans, Ing.(Grad.), 7129 Brackenheim Verfahren zum Ruckgewinnen von verschlepptem Elektrolyt
DE3033479A1 (de) * 1980-09-05 1982-04-15 Recon Verfahrenstechnik GmbH Fischer und Tscherwitschke, 7022 Leinfelden-Echterdingen Oberflaechenbehandlungsverfahren, insbesondere galvanisierverfahren, sowie vorrichtung zur durchfuehrung des verfahrens
EP0079987A1 (de) * 1981-11-20 1983-06-01 Kabushiki Kaisha Sanshin Seisakusho Verfahren und Vorrichtung zur Rückgewinnung einer Waschflüssigkeit und von Wärme, die im Abwasser von Verfahren zur Behandlung von Metalloberflächen enthalten ist

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3623962A (en) * 1968-07-31 1971-11-30 Nat Steel Corp Reducing electrolytic sludge formation
DE1962249B2 (de) * 1969-12-11 1978-08-17 Nordnero Ab, Kungaelv (Schweden) Verfahren zum Kühlen von Behandlungsbädern
DE2729270B2 (de) * 1977-06-29 1980-06-12 Stolle, Hans, Ing.(Grad.), 7129 Brackenheim Verfahren zum Ruckgewinnen von verschlepptem Elektrolyt
DE3033479A1 (de) * 1980-09-05 1982-04-15 Recon Verfahrenstechnik GmbH Fischer und Tscherwitschke, 7022 Leinfelden-Echterdingen Oberflaechenbehandlungsverfahren, insbesondere galvanisierverfahren, sowie vorrichtung zur durchfuehrung des verfahrens
EP0079987A1 (de) * 1981-11-20 1983-06-01 Kabushiki Kaisha Sanshin Seisakusho Verfahren und Vorrichtung zur Rückgewinnung einer Waschflüssigkeit und von Wärme, die im Abwasser von Verfahren zur Behandlung von Metalloberflächen enthalten ist

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4781806A (en) * 1985-10-11 1988-11-01 Dominic Tenace Electroplating system
EP1369505A3 (de) * 2002-06-06 2006-04-05 Goema GmbH Verfahren und Vorrichtung zur Spülwasserrückführung und Reinigung eines Prozessbades

Also Published As

Publication number Publication date
DE3469764D1 (en) 1988-04-14
EP0132719B1 (de) 1988-03-09

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