EP0090267B1 - Transducteur ultrasonore et son procédé de fabrication - Google Patents

Transducteur ultrasonore et son procédé de fabrication Download PDF

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Publication number
EP0090267B1
EP0090267B1 EP83102613A EP83102613A EP0090267B1 EP 0090267 B1 EP0090267 B1 EP 0090267B1 EP 83102613 A EP83102613 A EP 83102613A EP 83102613 A EP83102613 A EP 83102613A EP 0090267 B1 EP0090267 B1 EP 0090267B1
Authority
EP
European Patent Office
Prior art keywords
transducer elements
strip
recesses
contact
counter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP83102613A
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German (de)
English (en)
Other versions
EP0090267A1 (fr
Inventor
Viktor Zurinski
Ivan Lucic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to AT83102613T priority Critical patent/ATE25439T1/de
Publication of EP0090267A1 publication Critical patent/EP0090267A1/fr
Application granted granted Critical
Publication of EP0090267B1 publication Critical patent/EP0090267B1/fr
Expired legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface

Definitions

  • the invention relates to an ultrasound applicator according to the preamble of claim 1. It also relates to a method for producing such an ultrasound applicator.
  • EP-A-0 040 374 already discloses an ultrasound applicator and a method for producing the same, in which the transducer elements on the transducer are finely divided.
  • Several transducer elements are electrically combined into a finely divided group by the individual contact tongues of a contact sheet cut several times in parallel.
  • a total of two cut-in contact plates are present on the counter surfaces of the transducer elements of a group, one of which is attached along the left edge of the transducer element arrangement and the other along the right edge of the transducer element arrangement.
  • the two contact plates have a triangular shape and are made of foil material. Each triangular contact plate is bent in the uncut area opposite to the direction of radiation of the ultrasound head.
  • a plurality of contact plates on the right and an equal number of contact plates on the left are provided along the edges of the transducer element arrangement.
  • a common rod-shaped current conductor runs along the middle of the radiation surfaces of the transformer elements.
  • the object of the present invention is to design an ultrasound applicator of the type mentioned at the outset in such a way that an extremely precise separation of adjacent sections, which are intended to electrically group together a group of finely divided transducer elements, is achieved even without adhering to strict tolerance regulations.
  • the comb of electrical contact plates is roughly pre-structured by the width of the cutouts. This allows large tolerances when sawing the ceramic. Adjacent comb sections, which are to electrically group together a group of finely divided transducer elements, are always separated extremely precisely from one another, even in the event of tolerance fluctuations in the sawing steps. The manufacturing process is overall much easier and the reject rate is extremely low.
  • Ultrasound applicators with pre-structured comb contact plates are also known per se from US Pat. No. 3,952,387.
  • the transducers of these applicators are not finely divided with regard to the transducer elements. Group contact with the problem described above is not necessary from the start.
  • FIG. 1 shows a finely divided single-line array 1. This comprises a large number of finely divided transducer elements 2 arranged one behind the other.
  • the transducer elements are electrically combined into groups 3.
  • each group 3 comprises e.g. five finely divided transducer elements 2.
  • the total number of all groups along the Vandler array 1 is e.g. 77.
  • Each transducer element 2 consists in the usual way of a rod-shaped piezoceramic body 4 which is coated on the radiation surface 5 and on the counter surface 6.
  • the mesallayer consists e.g. made of evaporated or baked silver.
  • All finely divided transducer elements 2 arranged one behind the other are provided with a film comb 7 along the middle of their counter surfaces 6.
  • the film comb 7 consists of contact tabs 8 with recesses 9 in between. Ag, Cu or a Cu alloy.
  • the depth of cut h of the recesses 9 is less than the total height H of the contact comb 7, as is shown in more detail in FIG.
  • a strip part 10 of height B thus remains on the film edge facing the counter surfaces 6 of the transducer elements 2.
  • Saw slits 11 and 12 protrude from below into this strip part 10.
  • the saw slits 11 originate from the fine sawing of the transducer elements 2. They only partially extend from below into the strip part 10. As indicated in FIG.
  • the saw slots 72 have a greater depth T. They protrude beyond the strip part 70 into recesses 9 of the foil comb 7.
  • the longer saw slots 12 divide the foil comb 7 into the individual, electrically separated contact tabs 8.
  • the grid width R of the contact tabs 8 along the Comb 7, as is shown again in more detail in FIG. 2, is R-A. It thus corresponds in each case to the group width A of a group 3 of finely divided converter elements 2 which are to be electrically connected together.
  • the recess which is wider in depth (width c), allows large tolerance ranges when sawing the ceramic. In the exemplary embodiment in FIG. 2, the tolerance range corresponds e.g. the width c of the lower widest recess part.
  • the total depth of the group division cuts 12 is indicated by T in FIG.
  • the pitch width for fine division is a.
  • the saw slots for the fine division of the transducer elements in the piezo material are indicated at 13.
  • the saw slots in the transducer elements, which simultaneously divide the groups, are denoted by 14.
  • the component 15 is a carrier body for the finely divided converter elements 2.
  • the film comb 7 made of contact tabs 8 is embedded in the carrier body 15.
  • the carrier body 13 consists of a material that dampens ultrasonic waves well. E.g. it can consist of epoxy resin with oxidized tungsten powder.
  • the contact tabs 8 of the foil comb 7 serve as hot connections.
  • Two contact foils 16 and 17 are provided for the ground connection. consist of the same material as the foil comb 9 and which are soldered along the left and right lower edge of the row of transducer elements 2 to the radiation surfaces 5 of the transducer elements 2.
  • the metal foils 16 and 17, which are bent upwards in the opposite direction to the radiation direction of the ultrasound transducer elements, are also slit up to the height of the saw gaps 13 and 14 of the transducer elements 2. However, the slots 18 do not extend to the upper edge of the film; they are only partially cut into the respective film 16, 17.
  • the component 19 is an adaptation body with which the array 1 of the figure is completed on the application side.
  • This adapter body 19 is e.g. made of epoxy resin.
  • a film strip 20 is used as the base body for the film comb 7, said film strip first comprising self-contained window-shaped recesses 9.
  • a comb is then obtained with recesses 9 which are open at the top in accordance with FIG. 1.
  • FIG. 3 represents an alternative solution to that of FIG. 2, however, which is less advantageous than that of FIG. 2.
  • the only difference from the embodiment of FIG. 2 is that the cutouts 21 in the film strip 22 have a rectangular shape.
  • the width b 'of these rectangular recesses 21 is thus the same over the entire incision depth h'.
  • the tolerance range of the saw cuts for groups falling in this area is smaller with these recesses 21 than with that of FIG. 2.
  • FIG. 4 shows in detail the sawing plan for the exemplary embodiment in FIGS. 1 and 2.
  • the gap width of the saw slots 13 and 14 is in each case s.
  • FIGS. 5 to 8 show in an exploded view the manufacturing method according to the invention for an array according to FIG. 1.
  • a ceramic plate 30 with the external dimensions of the later array serves as the base body for the later finely divided converter elements 2.
  • the ceramic plastic 30 is provided on the lower surface 31 (later radiation surface of the transducer elements) and the surface 32 (later counter surface of the transducer elements) with a thin Ag layer.
  • a film strip 20 aligned in the longitudinal direction of the plate 30 with the closed recess windows 9 is soldered onto the ceramic plate 30 in the middle position. An edge 33 of the strip 20 is used for soldering.
  • FIG 6 shows the second manufacturing step.
  • the not yet slotted contact foils 16 and 17 are soldered along the right and left lower edges of the ceramic plate 30.
  • FIG. 7 also shows the fourth manufacturing step, which consists of cutting the contact strip 20 along the section line S-S. This cutting creates the actual comb shape with recesses 9 open at the top and the contact tabs 8.
  • the fifth manufacturing step consists of sawing the entire assembly. This sawing is done from the radiation side, as shown in FIG. 8.
  • the sixth and last manufacturing step consists in breaking the adaptation layer 79 on the application side. This last manufacturing step is also indicated in FIG.
  • the ceramic plate 30 can be sawn immediately. Only then is the carrier body 15 applied, or first the adaptation layer 19 and then the carrier body 15 are applied. Other swaps are also conceivable, but not necessarily appropriate.
  • FIG. 9 shows again in an enlarged manner how the foil comb 7 can be soldered or even welded onto the ceramic body 30 by means of the soldering edge 33.
  • soldering or welding without an edge 33 is also possible, as is indicated in FIG. 10 by soldering or welding seams 34.
  • the fine division grid for the converter elements 2 is e.g. 0.308 mm with a saw gap width in the range 0.07 to 0.1 mm.
  • the fine division grid for the converter elements 2 at this frequency is e.g. 0.192 mm for the same saw gap width.
  • the grid width of the contact lugs 8 of the film comb is R - 0 77 mm.
  • the exemplary embodiments described are merely exemplary in nature. There are of course any number of modifications.
  • the damping body 15 can also be applied to the ceramic body 30 in such a way that it also encompasses the edges thereof, see FIG. 11. In this arrangement, undesired radiation of ultrasonic energy at the edge is prevented.
  • the cutouts 9 between the foil flags 8 can also be cut to the edge 33.
  • the comb strip part for the saw cuts 12 (optionally also 11) is then formed by the edge 33.
  • This modified embodiment only requires very small sawing depths.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Claims (11)

1. Applicateur ultrasonique comportant une tête ultrasonique qui comprend des éléments transducteurs (2) disposés selon une répartition fine et dont plusieurs sont respectivement rassemblés du point de vue électrique pour former des groupes (3), au moyen de tôles de contact, qui sont placées sur les surfaces antagonistes (6), situées en vis-à-vis des surfaces d'émission (5), des éléments transducteurs (2), caractérisé par le fait que les tôles de contact possèdent la forme d'une bande allongée (20; 22), qui s'étend dans la zone comprise entre les extrémités des éléments transducteurs (2), perpendiculairement aux surfaces antagonistes (6), que la bande (20; 22) est réalisée sous la forme d'un peigne (17) comportant une multiplicité de languettes électriques de contact (8) et une multiplicité d'évidements successifs (9; 21), les évidements étant ouverts sur le bord de la bande située à l'opposé des surfaces antagonistes (6) des éléments transducteurs (2) et leur profondeur (h, h') en direction des surfaces antagonistes (6) des éléments transducteurs (2) étant inférieure à la hauteur totale (H) de la bande (20; 22), que la bande (20; 22) comporte, au niveau de chaque évidement (9; 21), au moins une fente (12) qui s'étend, en traversant le dos (10) de la bande, depuis l'évidement (9 ; 21) jusqu'à une fente (14) située entre deux éléments transducteurs (2) voisins et sépare de ce fait deux groupes voisins de transducteurs, et que la largeur (c) de la base de l'évidement (9; 22) est nettement supérieure à la largeur (s) de la fente (12).
2. Applicateur ultrasonique suivant la revendication 1, caractérisé par le fait que les languettes de contact (8) de la bande en forme de peigne (20; 22), dont la forme est prédéterminée en fonction de la forme des évidements (9), possèdent un pas de répartition (T) qui coïncide approximativement avec la largeur (A) d'un groupe (3) d'éléments transducteurs (2) disposés selon une répartition fine et interconnectés électriquement.
3. Applicateur ultrasonique suivant la revendication 1 ou 2, caractérisé par le fait que les évidements (21) ménagés dans la bande (22) possèdent une forme rectangulaire.
4. Applicateur ultrasonique suivant la revendication 1 ou 2, caractérisé par le fait que les évidements (9) ménagés dans la bande (20) possèdent, à leur extrémité supérieure ouverte, une largeur (b) plus faible qu'au niveau de la base.
5. Applicateur ultrasonique suivant l'une des revendications 1 à 4, caractérisé par le fait que chaque élément (10) de la bande situé entre deux fentes continues (12) comporte, respectivement dans les zones des fentes de séparation (13) entre les différents éléments transducteurs (2) disposés selon une répartition fine, des fentes (11) formées par sciage qui s'étendent à partir du bord de la bande, par lequel cette dernière est fixée sur les surfaces antagonistes (6) des éléments transducteurs, sur une hauteur n'atteignant pas la hauteur des évidements (9; 21) ménagés dans l'élément (10) de la bande.
6. Applicateur ultrasonique suivant l'une des revendications 1 à 5, caractérisé par le fait que le peigne (7) est disposé de manière à s'étendre approximativement le long de la partie médiane des surfaces antagonistes (6) des différents éléments transducteurs (2).
7. Applicateur ultrasonique suivant l'une des revendications 1 à 6, caractérisé par le fait que des tôles de contact (16,17) réalisées également sous la forme d'un peigne ou sous la forme d'une chicane continue commune ou avec une configuration mixte formée par un mélange de ces formes, sont disposées sur les surfaces d'émission (5) et alignées de telle sorte qu'elles s'étendent à la manière d'un prolongement longitudinal des éléments transducteurs, parallèlement aux surfaces d'émission ou en étant repliées vers le haut sur un certain angle en sens opposé de la direction d'émission.
8. Applicateur ultrasonique suivant l'une des revendications 1 à 7, caractérisé par le fait que le peigne (7) est soudé en etant coudé ou bien directement par son côté frontal, sur les surfaces antagonistes (6) des éléments transducteurs (2).
9. Procédé pour fabriquer un applicateur ultrasonique suivant l'une des revendications 1 à 8, caractérisé par les phases opératoires suivantes:
a) sur la surface (32) d'une plaque céramique (30), qui possède les dimensions extérieures du réseau formé ultérieurement et qui est munie d'une couche métallique mince, par exemple d'une couche de Ag, sur sa surface inférieure (31) et sur sa surface supérieure (32), on dépose la bande de contact (20; 22), qui comporte les évidements (9; 21),
b) le long du bord droit et de préférence également le long du bord gauche de la surface inférieure (31) de la plaque céramique (30), on dispose des bandes constituées par des feuilles de contact (16, 17),
c) on dispose sur la surface supérieure de la plaque céramique (30) un corps formant support (15), dans lequel la borne de contact (20; 22) est insérée partiellement,
d) on réalise une subdivision fine par sciage de l'ensemble de la structure à partir de la face inférieure de la plaque céramique (30) de telle sorte que des traits de scie à répartition fine (11, 13), qui servent à réaliser la subdivision à l'intérieur d'un groupe, s'étendent moins profondément dans la structure que les traits de scie (12, 14) de répartition fine, qui, pour la séparation des différents groupes, s'étendent jusqu'aux évidements (9; 21), et
e) sur le système muni de traits de scie, on dépose une couche d'adaptation (19) sur le côté d'application, c'est-à-dire sur les surfaces d'émission (5) des éléments transducteurs (2) disposés selon une répartition fine.
10. Procédé suivant la revendication 9, caractérisé par le fait que la borne de contact (20), qui est déposée sur la plaque céramique (30) conformément à la phase opératoire (a), possède des fenêtres tout d'abord fermées (9; 21) servant à former les-évidements, auquel les différentes languettes de contact (8), entre lesquelles sont disposés des évidements ouverts (9; 21), sont obtenues par découpage des bandes de contact (20; 22) à partir du haut, le long d'une ligne de coupe (S-S).
11. Procédé selon la revendication 9 ou 10, caractérisé par le fait que le corps de support (15) est disposé sur la plaque céramique (30) de telle sorte qu'il entoure conjointement les bords de cette plaque.
EP83102613A 1982-03-30 1983-03-16 Transducteur ultrasonore et son procédé de fabrication Expired EP0090267B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT83102613T ATE25439T1 (de) 1982-03-30 1983-03-16 Ultraschall-applikator und verfahren zur herstellung desselben.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3211734 1982-03-30
DE19823211734 DE3211734A1 (de) 1982-03-30 1982-03-30 Ultraschall-applikator und verfahren zur herstellung desselben

Publications (2)

Publication Number Publication Date
EP0090267A1 EP0090267A1 (fr) 1983-10-05
EP0090267B1 true EP0090267B1 (fr) 1987-02-04

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ID=6159736

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EP83102613A Expired EP0090267B1 (fr) 1982-03-30 1983-03-16 Transducteur ultrasonore et son procédé de fabrication

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EP (1) EP0090267B1 (fr)
AT (1) ATE25439T1 (fr)
DE (2) DE3211734A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9401470B2 (en) 2011-04-11 2016-07-26 Halliburton Energy Services, Inc. Electrical contacts to a ring transducer

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5592730A (en) * 1994-07-29 1997-01-14 Hewlett-Packard Company Method for fabricating a Z-axis conductive backing layer for acoustic transducers using etched leadframes

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5512254B2 (fr) * 1973-07-03 1980-03-31
JPS586132B2 (ja) * 1978-04-25 1983-02-03 株式会社東芝 超音波探触子
DE2829570C2 (de) * 1978-07-05 1979-12-20 Siemens Ag, 1000 Berlin Und 8000 Muenchen Ultraschallkopf
EP0040374A1 (fr) * 1980-05-21 1981-11-25 Siemens Aktiengesellschaft Transducteur ultrasonique et procédé de fabrication dudit transducteur

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9401470B2 (en) 2011-04-11 2016-07-26 Halliburton Energy Services, Inc. Electrical contacts to a ring transducer

Also Published As

Publication number Publication date
DE3211734A1 (de) 1983-10-06
DE3369758D1 (en) 1987-03-12
EP0090267A1 (fr) 1983-10-05
ATE25439T1 (de) 1987-02-15

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