EP0025092A1 - Transducteur ultrasonore et procédé pour sa fabrication - Google Patents

Transducteur ultrasonore et procédé pour sa fabrication Download PDF

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Publication number
EP0025092A1
EP0025092A1 EP80103708A EP80103708A EP0025092A1 EP 0025092 A1 EP0025092 A1 EP 0025092A1 EP 80103708 A EP80103708 A EP 80103708A EP 80103708 A EP80103708 A EP 80103708A EP 0025092 A1 EP0025092 A1 EP 0025092A1
Authority
EP
European Patent Office
Prior art keywords
transducer elements
transducer
ultrasonic
metal support
strips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP80103708A
Other languages
German (de)
English (en)
Other versions
EP0025092B1 (fr
Inventor
Heinrich Dr. Diepers
Bertram Sachs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to AT80103708T priority Critical patent/ATE7083T1/de
Publication of EP0025092A1 publication Critical patent/EP0025092A1/fr
Application granted granted Critical
Publication of EP0025092B1 publication Critical patent/EP0025092B1/fr
Expired legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0611—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile
    • B06B1/0614—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile for generating several frequencies

Definitions

  • the invention relates to an ultrasound transducer arrangement with a matrix of ultrasound transducers consisting of several acoustically separated and electrically jointly controlled transducer elements.
  • Such an ultrasonic transducer arrangement is known (DE-PS 28 29 570).
  • images are produced from the inside of a body to be examined with the aid of ultrasound pulses, which are emitted by a transducer element which is arranged on the surface of the body.
  • the position of an error location can be derived from the transit time of the ultrasound signal and the echo signal.
  • the ultrasonic transducer arrangement in the form of a so-called array consists of a large number of ultrasonic transducers with transducer elements made of piezo material, which are at a short distance are arranged, for example, about 50 to 70 / to adjacent **.
  • the converter elements are controlled together.
  • the entire array can consist, for example, of approximately 54 ultrasonic transducers, which are divided into several transducer elements by so-called fine division, which are electrically controlled together. This fine division shifts the transverse radiation of the transducer elements, which is also emitted, to higher frequencies, and its influence on the resolution is accordingly reduced accordingly.
  • Some transducers in the array can be grouped into an oscillator group.
  • the fine division in the longitudinal direction of the ultrasonic vibrators is generally carried out mechanically by sawing. Since the height of the transducer elements must not significantly exceed half the wavelength of the ultrasonic pulses, the height of the transducer elements is correspondingly limited in the case of ultrasonic transducer arrangements for higher frequencies, for example more than 10 MHz.
  • the width of the saw gap between the separating surfaces of the transducer elements cannot fall below a predetermined value, however, because sufficient mechanical stability of the saw blades must be ensured. As a result of this increase in the gap width in relation to the area, the cutting losses increase accordingly. The radiation per unit area is thus reduced.
  • Four linear arrays are used as ultrasound antennas for the operation of ultrasound devices for producing so-called B-images in the frequency range from approximately 2 to 8 MHz.
  • the arrangement of the transducers in the longitudinal direction of the array which is also the scanning direction of the irradiated impulses, enables electronic delay of the ultrasound impulses due to delay time. Focusing perpendicular to the scan direction is only possible with a mechanical focus, for example by attaching an acoustic cylindrical lens. A fixed frequency is assigned to the individual arrays. With a mechanical focus, however, adjustment to different depths is only possible with relatively great effort. Multiple arrays are therefore required for operation with different frequencies.
  • the invention is therefore based on the object of specifying an ultrasound transducer arrangement, the frequency of which can be freely selected in a certain range and with which better imaging conditions, in particular increased resolution, are obtained when creating images of a scanned space. Further, / is to be possible both in the longitudinal direction and in the transverse direction of the assembly with a particular embodiment of the arrangement of an electronic focusing.
  • the stated object is achieved in an ultrasonic transducer arrangement of the type mentioned at the outset with the design features according to the characterizing part of claim 1.
  • the diameter in order to suppress disturbing low-frequency transverse vibrations, preferably consist of a piezoelectric material with low quality, ie high self-damping.
  • the pulse thus has a correspondingly broad characteristic and the ultrasonic oscillator thus has approximately the same sensitivity in a relatively wide frequency range.
  • Suitable material for such broadband transducer elements is, for example, lead metanobate Pb (NbO 3 ) 2 or lead zirconate titanate Pb (Zr, Ti) 0 3 , which is generally referred to as PZT.
  • the arrangement with the additional fine division parallel to the longitudinal direction of the array is obtained, for example, by attaching a metallized transducer plate to a well-adhering base and first parallel to the longitudinal edge, i.e. in the transverse direction, divided into strips. Subsequently, a common electronic contact, for example a metal foil or metallized plastic foil, is soldered onto the upper end faces and, after the transducer elements have been fastened to a damping body, the fine division in the longitudinal direction is carried out.
  • a common electronic contact for example a metal foil or metallized plastic foil
  • the strips formed by fine division are arranged at a very short distance from one another, so that the gap formed by the separation practically ver disappears.
  • a thin plastic interlayer of a few / um thickness can preferably be used as a spacer.
  • the transducer elements can be polarized before the transducer plate is divided or after the transducer elements have been attached to the common electronic contact.
  • the transducer elements of the entire arrangement are generally connected to one another in an electrically conductive manner on one end face.
  • the transducer elements of the ultrasonic vibrators arranged next to one another in a row can be connected on the other end to a common electrical control connection.
  • all ultrasonic vibrators are each connected to a separate control connection, which can preferably be designed as a conductor track on an insulating intermediate layer. This design enables electronic focusing by delay time in both the longitudinal and transverse directions of the array.
  • FIG. 1 schematically illustrates part of an ultrasonic transducer arrangement according to the invention.
  • FIG. 2 shows a section of an areal array. A section through part of FIG. 2 is shown in FIG. 3.
  • the transducer 1 forms a matrix of 64 converter elements 2, each in eight columns 4 and eight rows 6 are arranged, an ultrasonic vibrator 21.
  • the transducer elements 2 are each provided on their lower end face with a metallization 8, which can consist, for example, of an alloy containing chromium, platinum and gold or also of chromium and gold and of chromium-nickel.
  • the ultrasonic transducers 2 are fastened with the aid of a solder layer 12 to a metal foil 14, which can be made of silver, for example, and which forms a common electrical connection conductor for all transducer elements of the entire transducer arrangement.
  • the metal layer 14 is fastened on a damping body 18 with the aid of an adhesive layer 16.
  • the electrical connection conductor 2 of the ultrasonic oscillator 21 connected to the upper end face of the transducer elements is not shown in the figure.
  • Several such oscillators, which are arranged next to one another and of which only a few unspecified transducer elements of a further oscillator 31 are indicated in the figure, can form, for example, a linear array of ultrasonic oscillators.
  • the converter arrangement according to FIG. 2 can consist, for example, of a matrix of 324 oscillators, which are in columns 19 and rows 20 are arranged and each contain a matrix of 64 transducer elements, as is indicated in the ultrasonic vibrator 21 for clarification by a grid, although the individual transducer elements are not visible in the practical embodiment of the arrangement.
  • the transducer elements of the individual ultrasonic transducers can be controlled in succession with two or more different frequencies. This allows the near-far field boundary, referred to as the natural focus, to be optimally shifted in the depth of an object to be examined by electronically selecting the size of the two-dimensional oscillating field. This is particularly advantageous if one focuses electronically because the focus point is in the Near-far field limit or shorter.
  • the ultrasonic vibrators 21 to 26 of the individual lines 20, 30, 40, 50, 60 and 70 can each be provided with a common control connection. In this embodiment, the oscillators of each line are then controlled together. In each case, the ultrasonic transducers of several adjacent lines, for example 6 lines each, can be combined to form a group which are scanned one after the other in the x direction.
  • the individual oscillators 21 to 26 of each of the rows 20 are each provided with a separate connecting conductor, which are designated 36 to 41 for the oscillators of the row 20 in the figure.
  • the individual transducers of the remaining lines are each provided with a connecting conductor, not shown in the figure.
  • this embodiment of the transducer arrangement as a matrix both electronic focusing in the x direction and electronic focusing in the y direction are possible.
  • this embodiment has the advantage that an electronic magnifying glass can be implemented. With a sufficiently large array and a sufficient line density, for example in a first step an object can be rough, i.e. at a larger spatial distance between the volume elements.
  • a detected error with increased line density in this area and reduced line density in its surroundings with a constant total number of lines can then be considered.
  • the two-dimensionally shaped focus can be fixed on this area and an additional optimization is then carried out by the choice of frequency. Since at the same time the area around the fault location is roughly scanned, the overview is always retained.
  • a flat body made of piezoelectric material is metallized on both flat sides and then releasably fastened on a base with one flat side. Then the body is in its longitudinal direction, ie by cuts parallel to the x direction 1, finely divided.
  • the columns 4 thus produced as strips are then connected to one another on the other flat side by a common metal support 14, for example with the aid of the solder layer 12.
  • This metal support 14 is then attached to the damping body 18, for example by means of the adhesive layer 16. Then the strip-like body from his original work pad, which is now on top of the matrix.
  • the fine division takes place in the transverse direction, ie parallel to the y direction, and the matrix of the transducer elements 2 is created.
  • the metallization of the piezoelectric body is also separated in each case and the metal surfaces, of which the lower ones, are formed on the end faces of the transducer elements shown in Figure 1 and designated 8.
  • the metal support 14 serving as a common electrical connection conductor for all transducer elements can preferably consist of the metallization of a plastic film, in particular of polyimide (Kapton), the thickness of which can be, for example, approximately 2 to 10 / ⁇ m.
  • the ultrasonic oscillators each consisting of a matrix of transducer elements 2 can also be produced in that the strips made from the metallized flat body by fine division in the longitudinal direction, ie parallel to the x direction, have the same width the length 1 of the transducer elements 2 is lined up with their separating surfaces at a very short distance and connected to one another in an electrically conductive manner on one flat side by the metal support 14 that will. Then this metal coating is fastened on the damping body 18 and then the fine division takes place in the transverse direction of the strips, ie by cuts parallel to the y-direction at a distance b of the width of the transducer elements 2.
  • the distance c is the transducer elements 2 with each other at least as large as the width of the saw blade, which for reasons of mechanical stability cannot fall below a predetermined thickness.
  • a distance c of for example, 70 / um and a width b of the elements 2 of for example approximately every 300 / um is obtained a square area of the transducer elements 2 having a length 1 of, for example, about 3 mm.
  • the distances a in the y direction that is to say the spaces between the transducer elements, parallel to the x direction according to FIG. 1, can be kept significantly smaller by the stacking technique of the strips. For example, they can only be about 5 / ⁇ m and generally will not exceed 10 / ⁇ m significantly.
  • the expansion of the oscillators 21 in the y direction according to FIG. 1 is correspondingly smaller.
  • the distances between the individual oscillators 21 to 26 and 31 to 35 can correspond to the sawing gaps of the subdivision. In the practical embodiment, these distances are preferably kept as small, for example by the stacking technique, as the distances between the individual transducer elements 2 of the ultrasonic transducers.
  • the matrix of transducer elements can also be produced in that the flat body made of piezoelectric material on both flat sides is metallized, first broken down into strips with the length 1 of the transducer elements and then these strips are separated into sections whose length is equal to the width b of the transducer elements 2. Then the columnar transducer elements 2 produced in this way are lined up with their separating surfaces both in the x- and in the y-direction at a very short distance and fastened on a metal base, which is then applied to the damping body. With this stacking technique, the spaces c between the transducer elements 2 according to FIG. 1 can also be kept very small.
  • the ultrasonic vibrators using this method, it is expedient to manufacture one of the metal supports on the end faces of the transducer elements 2 from ferromagnetic material.
  • the individual transducer elements 2 can then be transferred to the metal support 14 with the aid of magnetic forces.
  • the individual transducer elements 2 that are already finished can also be transferred, for example, with the aid of an adhesive tape.
  • the transducer elements 2 can also be strung together directly on a stretchable work surface as a matrix. The minimum distance required for decoupling is then established by stretching the work surface. Under certain circumstances, it may be expedient to choose the metal pad 14 serving as a common electrical contact or also the metallization of a plastic film as the working base.
  • the transducer elements 2 are subsequently Fig. 3 provided on one end face with a common connection conductor, for example the metal pad 14, while on the opposite end face only the transducer elements of the matrix of the ultrasound transducer 21 concerned are provided with a connection conductor, which can preferably be designed in the form of a conductor track.
  • a common cover 42 which may consist, for example, of plastic, in particular polyimide (Kapton), is provided on its lower flat side in the region of the matrix of the vibrator 21 with a metallization 44, which consist, for example, of a chromium-silver alloy can.
  • This metallization can preferably be evaporated onto the film.
  • the cover 42 is provided with an opening 46.
  • the upper flat side of the cover 42 is then provided with conductor tracks which represent the connecting conductors 36, 37 and 38. In each case one of these conductor tracks leads to one of the openings in the cover 42 and thus establishes the electrical connection with a control line (not shown in more detail).
  • the metal pad 44 can then be provided with a solder layer 52, which can preferably be vapor-deposited, and with the aid of this solder layer 52, the cover 42 with the connecting conductors 36 to 38 is fastened on the metal pads 48 of the transducer elements 2.
  • solder layer 52 for example an electrically conductive adhesive, a so-called conductive adhesive, can also be used to fasten the cover 42 with the conductor tracks on the transducer elements 2.
  • the entire upper flat side of the cover 42 can be provided with a metal coating, from which the as can then be used, for example, using photoetching technology Connection leads not required parts are removed.
  • the conductor tracks of the connecting conductors 36 to 38 can also be applied to the surface of the cover 42 using mask technology.
  • the oscillators can control several lines, for example the oscillators of six successive lines 20, 30, 40, 50, 60 and 70 can be combined into a transducer matrix.
  • This matrix can be scanned linearly in the x-direction over the entire oscillator field to build up an image line sequence.
  • electronic focusing can also be achieved in the transverse direction in both the x and y directions by delaying the delay of the echo pulses or the echo and transmit pulses.
  • connection conductors for the individual ultrasonic vibrators are then arranged between the transducer elements and the damping body 18 ′.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
EP80103708A 1979-07-20 1980-06-30 Transducteur ultrasonore et procédé pour sa fabrication Expired EP0025092B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT80103708T ATE7083T1 (de) 1979-07-20 1980-06-30 Ultraschallwandleranordnung und verfahren zu ihrer herstellung.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19792929541 DE2929541A1 (de) 1979-07-20 1979-07-20 Ultraschallwandleranordnung
DE2929541 1979-07-20

Publications (2)

Publication Number Publication Date
EP0025092A1 true EP0025092A1 (fr) 1981-03-18
EP0025092B1 EP0025092B1 (fr) 1984-04-11

Family

ID=6076340

Family Applications (1)

Application Number Title Priority Date Filing Date
EP80103708A Expired EP0025092B1 (fr) 1979-07-20 1980-06-30 Transducteur ultrasonore et procédé pour sa fabrication

Country Status (5)

Country Link
US (1) US4371805A (fr)
EP (1) EP0025092B1 (fr)
JP (1) JPS5620400A (fr)
AT (1) ATE7083T1 (fr)
DE (2) DE2929541A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0040374A1 (fr) * 1980-05-21 1981-11-25 Siemens Aktiengesellschaft Transducteur ultrasonique et procédé de fabrication dudit transducteur
EP0041664A1 (fr) * 1980-06-06 1981-12-16 Siemens Aktiengesellschaft Procédé de fabrication d'un agencement d'un transducteur ultrasonique
EP0043195A1 (fr) * 1980-06-26 1982-01-06 United Kingdom Atomic Energy Authority Transducteurs ultrasoniques
EP0101509A1 (fr) * 1982-02-18 1984-02-29 Univ Leland Stanford Junior Transducteurs ultrasoniques.
EP0142215A2 (fr) * 1983-05-26 1985-05-22 Advanced Technology Laboratories, Inc. Transducteur ultrasonore ayant des modes vibratoires améliorées
EP0210723A1 (fr) * 1985-05-20 1987-02-04 Matsushita Electric Industrial Co., Ltd. Transducteur ultrason
EP0294826A1 (fr) * 1987-06-12 1988-12-14 Fujitsu Limited Structure d'un transducteur ultrasonore
EP0336086A2 (fr) * 1988-03-31 1989-10-11 Deutsche Aerospace AG Générateur de son micromécanique
FR2770932A1 (fr) * 1997-11-07 1999-05-14 Thomson Csf Procede de fabrication d'une sonde acoustique

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Publication number Priority date Publication date Assignee Title
IT1162336B (it) * 1979-06-22 1987-03-25 Consiglio Nazionale Ricerche Procedimento per la realizzazione di trasduttori ultraacustici a cortina di linee o a matrice di punti e trasduttori ottenuti
US4519260A (en) * 1982-02-18 1985-05-28 The Board Of Trustees Of The Leland Stanford Junior University Ultrasonic transducers and applications thereof
JPS6024800A (ja) * 1983-07-21 1985-02-07 Toshiba Corp 超音波探触子
WO1990016087A2 (fr) * 1989-06-07 1990-12-27 Interspec, Inc. Dispositif piezo-electrique a entaille remplie d'air
US5065068A (en) * 1989-06-07 1991-11-12 Oakley Clyde G Ferroelectric ceramic transducer
US5099459A (en) * 1990-04-05 1992-03-24 General Electric Company Phased array ultrosonic transducer including different sized phezoelectric segments
US5091893A (en) * 1990-04-05 1992-02-25 General Electric Company Ultrasonic array with a high density of electrical connections
US5160870A (en) * 1990-06-25 1992-11-03 Carson Paul L Ultrasonic image sensing array and method
US5191796A (en) * 1990-08-10 1993-03-09 Sekisui Kaseihin Koygo Kabushiki Kaisha Acoustic-emission sensor
WO1996003777A1 (fr) * 1994-07-22 1996-02-08 Loral Infrared & Imaging Systems, Inc. Reseau pour imagerie ultrasonore
US5677491A (en) * 1994-08-08 1997-10-14 Diasonics Ultrasound, Inc. Sparse two-dimensional transducer array
US5550792A (en) * 1994-09-30 1996-08-27 Edo Western Corp. Sliced phased array doppler sonar system
US6012779A (en) * 1997-02-04 2000-01-11 Lunar Corporation Thin film acoustic array
US5977691A (en) * 1998-02-10 1999-11-02 Hewlett-Packard Company Element interconnections for multiple aperture transducers
JP3883823B2 (ja) * 2001-06-19 2007-02-21 日本電波工業株式会社 マトリクス型の超音波探触子及びその製造方法
US7567016B2 (en) * 2005-02-04 2009-07-28 Siemens Medical Solutions Usa, Inc. Multi-dimensional ultrasound transducer array
US8176787B2 (en) * 2008-12-17 2012-05-15 General Electric Company Systems and methods for operating a two-dimensional transducer array
US9142752B2 (en) * 2012-05-01 2015-09-22 Piezotech Llc Low frequency broad band ultrasonic transducers
FR3051693B1 (fr) * 2016-05-31 2018-05-11 Imasonic Reseau d'elements transducteurs ultrasonores
JP7145799B2 (ja) * 2019-03-19 2022-10-03 株式会社東芝 超音波検査装置

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US3952387A (en) * 1973-07-03 1976-04-27 Tokyo Shibaura Electric Co., Ltd. Method of manufacturing an ultrasonic probe
DE2727691B2 (de) * 1976-10-25 1978-08-03 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka (Japan) Ultraschallsonde
DE2823693A1 (de) * 1977-07-15 1979-01-18 Electric Power Res Inst Lineare wandleranordnung
DE2841694A1 (de) * 1977-10-05 1979-04-12 Philips Nv Anordnung zum abtasten und abbilden mittels ultraschallwellen
DE2829570B1 (de) * 1978-07-05 1979-04-26 Siemens Ag Ultraschallkopf
DE2829612B1 (de) * 1978-07-05 1979-04-26 Siemens Ag Verfahren zur Herstellung von Ultraschallkoepfen
DE2829561B1 (de) * 1978-07-05 1979-04-26 Siemens Ag Verfahren zur Herstellung von Ultraschallkoepfen
DE2829581B1 (de) * 1978-07-05 1979-04-26 Siemens Ag Verfahren zur Herstellung von Ultraschallkoepfen
DE2846398A1 (de) * 1977-11-03 1979-05-10 Gen Electric Verfahren zum zertrennen einer halbleiterplatte in mehrere plaettchen
DE2914099A1 (de) * 1978-04-14 1979-10-25 Oki Electric Ind Co Ltd Ultraschallsonde
DE2915761A1 (de) * 1978-04-19 1979-10-31 Commw Of Australia Vorrichtung zur ultraschall-untersuchung eines objektes

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US2844809A (en) * 1955-01-05 1958-07-22 Raytheon Mfg Co Compressional wave transducers
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JPS5419151B2 (fr) * 1974-06-06 1979-07-12
US3979711A (en) * 1974-06-17 1976-09-07 The Board Of Trustees Of Leland Stanford Junior University Ultrasonic transducer array and imaging system
JPS5257847A (en) * 1975-11-07 1977-05-12 Oki Electric Ind Co Ltd Ultrasonic transmitter and receiver array
US4122725A (en) * 1976-06-16 1978-10-31 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Length mode piezoelectric ultrasonic transducer for inspection of solid objects
US4211948A (en) * 1978-11-08 1980-07-08 General Electric Company Front surface matched piezoelectric ultrasonic transducer array with wide field of view

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3952387A (en) * 1973-07-03 1976-04-27 Tokyo Shibaura Electric Co., Ltd. Method of manufacturing an ultrasonic probe
DE2727691B2 (de) * 1976-10-25 1978-08-03 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka (Japan) Ultraschallsonde
DE2823693A1 (de) * 1977-07-15 1979-01-18 Electric Power Res Inst Lineare wandleranordnung
DE2841694A1 (de) * 1977-10-05 1979-04-12 Philips Nv Anordnung zum abtasten und abbilden mittels ultraschallwellen
DE2846398A1 (de) * 1977-11-03 1979-05-10 Gen Electric Verfahren zum zertrennen einer halbleiterplatte in mehrere plaettchen
DE2914099A1 (de) * 1978-04-14 1979-10-25 Oki Electric Ind Co Ltd Ultraschallsonde
DE2915761A1 (de) * 1978-04-19 1979-10-31 Commw Of Australia Vorrichtung zur ultraschall-untersuchung eines objektes
DE2829570B1 (de) * 1978-07-05 1979-04-26 Siemens Ag Ultraschallkopf
DE2829612B1 (de) * 1978-07-05 1979-04-26 Siemens Ag Verfahren zur Herstellung von Ultraschallkoepfen
DE2829561B1 (de) * 1978-07-05 1979-04-26 Siemens Ag Verfahren zur Herstellung von Ultraschallkoepfen
DE2829581B1 (de) * 1978-07-05 1979-04-26 Siemens Ag Verfahren zur Herstellung von Ultraschallkoepfen

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0040374A1 (fr) * 1980-05-21 1981-11-25 Siemens Aktiengesellschaft Transducteur ultrasonique et procédé de fabrication dudit transducteur
EP0041664A1 (fr) * 1980-06-06 1981-12-16 Siemens Aktiengesellschaft Procédé de fabrication d'un agencement d'un transducteur ultrasonique
EP0043195A1 (fr) * 1980-06-26 1982-01-06 United Kingdom Atomic Energy Authority Transducteurs ultrasoniques
EP0101509A1 (fr) * 1982-02-18 1984-02-29 Univ Leland Stanford Junior Transducteurs ultrasoniques.
EP0101509A4 (fr) * 1982-02-18 1985-12-19 Univ Leland Stanford Junior Transducteurs ultrasoniques.
EP0142215A2 (fr) * 1983-05-26 1985-05-22 Advanced Technology Laboratories, Inc. Transducteur ultrasonore ayant des modes vibratoires améliorées
EP0142215A3 (fr) * 1983-05-26 1987-03-11 Advanced Technology Laboratories, Inc. Transducteur ultrasonore ayant des modes vibratoires améliorées
EP0379229A2 (fr) * 1985-05-20 1990-07-25 Matsushita Electric Industrial Co., Ltd. Sonde ultrasonore
EP0210723A1 (fr) * 1985-05-20 1987-02-04 Matsushita Electric Industrial Co., Ltd. Transducteur ultrason
EP0379229A3 (en) * 1985-05-20 1990-08-22 Matsushita Electric Industrial Co., Ltd. Ultrasonic probe
EP0294826A1 (fr) * 1987-06-12 1988-12-14 Fujitsu Limited Structure d'un transducteur ultrasonore
EP0336086A2 (fr) * 1988-03-31 1989-10-11 Deutsche Aerospace AG Générateur de son micromécanique
EP0336086A3 (fr) * 1988-03-31 1991-08-07 Deutsche Aerospace AG Générateur de son micromécanique
FR2770932A1 (fr) * 1997-11-07 1999-05-14 Thomson Csf Procede de fabrication d'une sonde acoustique
WO1999024175A1 (fr) * 1997-11-07 1999-05-20 Thomson-Csf Procede de fabrication d'une sonde acoustique
US6729001B2 (en) * 1997-11-07 2004-05-04 Thomson-Csf Method for making a sonoprobe

Also Published As

Publication number Publication date
US4371805A (en) 1983-02-01
DE2929541A1 (de) 1981-02-05
EP0025092B1 (fr) 1984-04-11
ATE7083T1 (de) 1984-04-15
JPS5620400A (en) 1981-02-25
DE3067426D1 (en) 1984-05-17

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