EP0014198A1 - Dispositif redresseur rotatif pour l'excitation d'une machine synchrone - Google Patents

Dispositif redresseur rotatif pour l'excitation d'une machine synchrone

Info

Publication number
EP0014198A1
EP0014198A1 EP79900142A EP79900142A EP0014198A1 EP 0014198 A1 EP0014198 A1 EP 0014198A1 EP 79900142 A EP79900142 A EP 79900142A EP 79900142 A EP79900142 A EP 79900142A EP 0014198 A1 EP0014198 A1 EP 0014198A1
Authority
EP
European Patent Office
Prior art keywords
heat sink
arrangement according
insulating body
machine
shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP79900142A
Other languages
German (de)
English (en)
Inventor
Kurt Jäger
Philipp RÖSCH
Rolf Fischl
Heinrich Wambsganss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Germany
Original Assignee
BBC Brown Boveri AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Germany filed Critical BBC Brown Boveri AG Germany
Publication of EP0014198A1 publication Critical patent/EP0014198A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/04—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for rectification
    • H02K11/042—Rectifiers associated with rotating parts, e.g. rotor cores or rotary shafts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • Synchronous machine especially a turbo generator.
  • Rotating rectifier arrangement for excitation of a synchronous machine with an alternating current excitation machine, the rotating armature of which is coupled to the shaft of the synchronous machine, with at least one carrier wheel, on the inner surface of which cooling elements are arranged, on which disk-shaped semiconductor elements, in which the alternating current generated in the armature is rectified, with their one surface.
  • Such an arrangement is known from Brown Boveri Mitteilungen 1967, pages 539 to 553.
  • the one electrode facing the heat sink e.g. the cathode
  • the one electrode facing the heat sink is well cooled, while only a comparatively small amount of heat can flow off at the second electrode facing away from the heat sink.
  • the load capacity of the semiconductor element is thus limited and cannot reach the same values 5 as in stationary systems in which direct cooling on both sides can easily be achieved.
  • a second heat sink rests on the second surface of the disk-shaped semiconductor elements, which is spring-mounted on the first heat sink via an insulating body.
  • a spring element is arranged between an edge surface of the second heat sink facing the machine shaft and the insulating body 5.
  • Xu, W that is, the insulating body and the spring element only have to be dimensioned for the fixation of the bearings and the centering of the disk-shaped semiconductor element with respect to the two cooling bodies.
  • the required contact pressure between the surfaces of the semiconductor element and the surfaces of the two heat sinks lying thereon is exerted by the centrifugal forces that occur during the rotation.
  • the spring element has a rah-shaped design and has at least two resilient sections resting against the surface of the rectangularly shaped insulating body.
  • the effective cooling surface can be increased compared to a circular design thereof.
  • the insulating body is U-shaped in frame-like section, its short legs enclosing the frame-shaped spring element.
  • the second heat sink has ribs on its part facing the machine shaft.
  • the ribs can run in the circumferential direction, in the axial direction or also at an angle to the machine axis. In the last embodiment, self-funding results, through which the cooling is particularly favorable.
  • the insulating body is provided with recesses in which fastening screws screwed into the first heat sink run.
  • the recesses can be drilled or provided at the corners
  • the insulating body is pressed onto the first heat sink via sealing elements. In this way, the space receiving the semiconductor elements can be protected from the ingress of dust and dirt.
  • a strand which serves to conduct current is arranged on the second heat sink on the side facing the machine shaft.
  • the insulating body and the second cooling body can have an annular or circular design and a disc spring can be arranged between the two.
  • FIG. 1 shows a detail from FIG. 1
  • OM IP 3 is a view of the " arrangement according to r * fgur 2 seen from the machine shaft,
  • FIG. 4 shows an embodiment variant for the arrangement according to FIG. 2,
  • FIG. 5 shows an embodiment variant for the arrangement according to FIG. 4.
  • 1 denotes the carrier wheel which is L-shaped or T-shaped in longitudinal section.
  • the machine shaft and the armature of the AC exciter are not shown.
  • the second heat sink 4 rests on a likewise flat surface 41 of the second heat sink 4.
  • This heat sink is rectangular and has ribs 41 in its part facing the machine shaft.
  • the second heat sink 4 has on its outer part a flat surface 42 facing the machine shaft.
  • an elastic intermediate layer 11 is located between the insulating body 5 and the first cooling body 2.
  • the mentioned insulating body 5.3 consists either of a pressure-resistant ceramic material or of a temperature-resistant glass fiber reinforced plastic.
  • the insulating body has
  • the insulating body 5.5 in the radial direction is shorter in FIG. 5, so that it does not abut the cooling body 2. This avoids ver that he is exposed to bending stress, so that we can do without an elastic intermediate layer.
  • the invention is applied to the excitation device of synchronous machines, in particular of turbogenerators for the generation of electrical energy.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Synchronous Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Dispositif redresseur rotatif pour l'excitation d'une machine synchrone pourvue d'une excitatrice a courant alternatif dont l'induit rotatif est accouple a l'arbre de la machine synchrone, ce dispositif comprenant au moins une roue de support, sur la surface interieure de laquelle sont disposes des corps de refroidissement (2) contre lesquels sont appliques des elements semi-conducteurs (3) en forme de disque assurant le redressement du courant alternatif engendre dans l'induit. En vue d'accroitre la charge susceptible d'etre appliquee a un tel element semi-conducteur d'un dispositif redresseur rotatif, ce qui permet avec des elements semi-conducteurs de meme grandeur de transmettre des courants plus grands, il est prevu un deuxieme corps de refroidissement (4) qui est applique contre la deuxieme surface (32) de chaque element semi-conducteur (3) en forme de disque et qui est fixe elastiquement au premier corps de refroidissement (2) par l'intermediaire d'un corps isolant (5).
EP79900142A 1978-02-02 1979-08-28 Dispositif redresseur rotatif pour l'excitation d'une machine synchrone Withdrawn EP0014198A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2804348 1978-02-02
DE2804348A DE2804348C2 (de) 1978-02-02 1978-02-02 Rotierende Gleichrichteranordnung für die Erregung einer Synchronmaschine

Publications (1)

Publication Number Publication Date
EP0014198A1 true EP0014198A1 (fr) 1980-08-20

Family

ID=6030938

Family Applications (1)

Application Number Title Priority Date Filing Date
EP79900142A Withdrawn EP0014198A1 (fr) 1978-02-02 1979-08-28 Dispositif redresseur rotatif pour l'excitation d'une machine synchrone

Country Status (6)

Country Link
EP (1) EP0014198A1 (fr)
AT (1) AT364415B (fr)
DE (1) DE2804348C2 (fr)
GB (1) GB2036455B (fr)
NL (1) NL187220C (fr)
WO (1) WO1979000578A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4620215A (en) * 1982-04-16 1986-10-28 Amdahl Corporation Integrated circuit packaging systems with double surface heat dissipation
WO1985003385A1 (fr) * 1984-01-23 1985-08-01 La Telemecanique Electrique Dispositif de montage et de connexion pour semi-conducteurs de puissance
FR2558646B1 (fr) * 1984-01-23 1986-09-19 Telemecanique Electrique Dispositif de montage et de connexion pour semi-conducteur de puissance
US4965658A (en) * 1988-12-29 1990-10-23 York International Corporation System for mounting and cooling power semiconductor devices

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3348127A (en) * 1964-08-20 1967-10-17 Westinghouse Electric Corp Support arrangement for diodes in a rotating rectifier exciter
DE2300935A1 (fr) * 1972-03-06
US3852628A (en) * 1972-09-11 1974-12-03 Westinghouse Electric Corp Rectifier assembly for brushless excitation systems
DE2262394C3 (de) * 1972-12-15 1980-02-14 Siemens Ag, 1000 Berlin Und 8000 Muenchen Erregeranordnung fur eine burstenlose elektrische Synchronmaschine
US3902774A (en) * 1974-08-22 1975-09-02 Westinghouse Electric Corp Force equalizing system
DE2511636C3 (de) * 1975-03-17 1980-04-17 Kraftwerk Union Ag, 4330 Muelheim Rotierende Gleichrichteranordnung für Erregersysteme elektrischer Maschinen
DE2607015C2 (de) * 1976-02-19 1984-01-19 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Rotierende Gleichrichteranordnung für elektrische Maschinen

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO7900578A1 *

Also Published As

Publication number Publication date
ATA62379A (de) 1981-03-15
GB2036455B (en) 1982-08-18
NL187220C (nl) 1991-07-01
DE2804348A1 (de) 1979-08-09
WO1979000578A1 (fr) 1979-08-23
NL7900672A (nl) 1979-08-06
GB2036455A (en) 1980-06-25
NL187220B (nl) 1991-02-01
DE2804348C2 (de) 1991-05-29
AT364415B (de) 1981-10-27

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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18D Application deemed to be withdrawn
AK Designated contracting states

Designated state(s): FR

RIN1 Information on inventor provided before grant (corrected)

Inventor name: WAMBSGANSS, HEINRICH

Inventor name: JAEGER, KURT

Inventor name: FISCHL, ROLF

Inventor name: ROESCH, PHILIPP