FR2558646B1 - Dispositif de montage et de connexion pour semi-conducteur de puissance - Google Patents

Dispositif de montage et de connexion pour semi-conducteur de puissance

Info

Publication number
FR2558646B1
FR2558646B1 FR8400984A FR8400984A FR2558646B1 FR 2558646 B1 FR2558646 B1 FR 2558646B1 FR 8400984 A FR8400984 A FR 8400984A FR 8400984 A FR8400984 A FR 8400984A FR 2558646 B1 FR2558646 B1 FR 2558646B1
Authority
FR
France
Prior art keywords
mounting
connecting device
power semiconductor
semiconductor
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8400984A
Other languages
English (en)
Other versions
FR2558646A1 (fr
Inventor
Rene Lecomte
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telemecanique SA
Original Assignee
La Telemecanique Electrique SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by La Telemecanique Electrique SA filed Critical La Telemecanique Electrique SA
Priority to FR8400984A priority Critical patent/FR2558646B1/fr
Priority to EP85900680A priority patent/EP0168456B1/fr
Priority to PCT/FR1985/000007 priority patent/WO1985003385A1/fr
Priority to BR8504783A priority patent/BR8504783A/pt
Priority to DE8585900680T priority patent/DE3563284D1/de
Priority to US06/783,380 priority patent/US4739447A/en
Priority to IT19191/85A priority patent/IT1184127B/it
Publication of FR2558646A1 publication Critical patent/FR2558646A1/fr
Application granted granted Critical
Publication of FR2558646B1 publication Critical patent/FR2558646B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR8400984A 1984-01-23 1984-01-23 Dispositif de montage et de connexion pour semi-conducteur de puissance Expired FR2558646B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR8400984A FR2558646B1 (fr) 1984-01-23 1984-01-23 Dispositif de montage et de connexion pour semi-conducteur de puissance
EP85900680A EP0168456B1 (fr) 1984-01-23 1985-01-15 Dispositif de montage et de connexion pour semi-conducteurs de puissance
PCT/FR1985/000007 WO1985003385A1 (fr) 1984-01-23 1985-01-15 Dispositif de montage et de connexion pour semi-conducteurs de puissance
BR8504783A BR8504783A (pt) 1984-01-23 1985-01-15 Dispositivo de montagem e de conexao para semicondutor de potencia
DE8585900680T DE3563284D1 (en) 1984-01-23 1985-01-15 Mounting and connection device for power semi-conductors
US06/783,380 US4739447A (en) 1984-01-23 1985-01-15 Mounting and connection device for power semi-conductors
IT19191/85A IT1184127B (it) 1984-01-23 1985-01-23 Dispositivo di montaggio e di connessione per semi-conduttori di potenza

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8400984A FR2558646B1 (fr) 1984-01-23 1984-01-23 Dispositif de montage et de connexion pour semi-conducteur de puissance

Publications (2)

Publication Number Publication Date
FR2558646A1 FR2558646A1 (fr) 1985-07-26
FR2558646B1 true FR2558646B1 (fr) 1986-09-19

Family

ID=9300379

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8400984A Expired FR2558646B1 (fr) 1984-01-23 1984-01-23 Dispositif de montage et de connexion pour semi-conducteur de puissance

Country Status (1)

Country Link
FR (1) FR2558646B1 (fr)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2804348C2 (de) * 1978-02-02 1991-05-29 Brown, Boveri & Cie Ag, 6800 Mannheim Rotierende Gleichrichteranordnung für die Erregung einer Synchronmaschine

Also Published As

Publication number Publication date
FR2558646A1 (fr) 1985-07-26

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Legal Events

Date Code Title Description
ST Notification of lapse