EA201070348A1 - Способ получения высокоплотных металлоксидных слоев и полученные таким способом слои - Google Patents

Способ получения высокоплотных металлоксидных слоев и полученные таким способом слои

Info

Publication number
EA201070348A1
EA201070348A1 EA201070348A EA201070348A EA201070348A1 EA 201070348 A1 EA201070348 A1 EA 201070348A1 EA 201070348 A EA201070348 A EA 201070348A EA 201070348 A EA201070348 A EA 201070348A EA 201070348 A1 EA201070348 A1 EA 201070348A1
Authority
EA
Eurasian Patent Office
Prior art keywords
layers
metal
ecu
metalloxide
density
Prior art date
Application number
EA201070348A
Other languages
English (en)
Inventor
Эндрю Б. Бокарсли
Брент В. Керби
Дэвид Даулинг
Original Assignee
Эпплайд Семикондактор Интернэшнл Лтд.
Дзе Трастиз Оф Принстон Юниверсити
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Эпплайд Семикондактор Интернэшнл Лтд., Дзе Трастиз Оф Принстон Юниверсити filed Critical Эпплайд Семикондактор Интернэшнл Лтд.
Publication of EA201070348A1 publication Critical patent/EA201070348A1/ru

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F13/00—Inhibiting corrosion of metals by anodic or cathodic protection
    • C23F13/02—Inhibiting corrosion of metals by anodic or cathodic protection cathodic; Selection of conditions, parameters or procedures for cathodic protection, e.g. of electrical conditions
    • C23F13/06—Constructional parts, or assemblies of cathodic-protection apparatus
    • C23F13/08—Electrodes specially adapted for inhibiting corrosion by cathodic protection; Manufacture thereof; Conducting electric current thereto

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Oxygen, Ozone, And Oxides In General (AREA)
  • Chemical Treatment Of Metals (AREA)

Abstract

Способ получения оксидного слоя, включающий окисление металлической поверхности, причем эту металлическую поверхность электрически соединяют с электронным блоком управления (ЭБУ), при этом полученный металлоксидный слой имеет количество металла, присутствующего в упомянутом металлоксидном слое, которое является более высоким, чем металла, присутствующего в металлоксидном слое, полученном окислением этой металлической поверхности в отсутствие ЭБУ; или окисление способной окисляться неметаллической электропроводной поверхности, причем эту способную окисляться неметаллическую электропроводную поверхность электрически соединяют с электронным блоком управления (ЭБУ), при этом полученный оксидный слой является более плотным, чем слой, полученный окислением этой способной окисляться неметаллической электропроводной поверхности в отсутствие ЭБУ; и полученные таким способом металлоксидные или оксидные слои.
EA201070348A 2007-09-07 2008-09-05 Способ получения высокоплотных металлоксидных слоев и полученные таким способом слои EA201070348A1 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US97055507P 2007-09-07 2007-09-07
PCT/US2008/075357 WO2009032992A1 (en) 2007-09-07 2008-09-05 Method of preparing high density metal oxide layers and the layers produced thereby

Publications (1)

Publication Number Publication Date
EA201070348A1 true EA201070348A1 (ru) 2010-10-29

Family

ID=40429351

Family Applications (1)

Application Number Title Priority Date Filing Date
EA201070348A EA201070348A1 (ru) 2007-09-07 2008-09-05 Способ получения высокоплотных металлоксидных слоев и полученные таким способом слои

Country Status (11)

Country Link
US (1) US20090148714A1 (ru)
EP (1) EP2212448A1 (ru)
JP (1) JP2010538169A (ru)
KR (1) KR20100093517A (ru)
CN (1) CN101802268A (ru)
AU (1) AU2008296143A1 (ru)
CA (1) CA2698368A1 (ru)
EA (1) EA201070348A1 (ru)
TW (1) TW200936814A (ru)
WO (1) WO2009032992A1 (ru)
ZA (1) ZA201001517B (ru)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014058388A1 (en) * 2012-10-11 2014-04-17 Ecospec Global Technology Pte Ltd System and method for providing corrosion protection of metallic structure using time varying electromagnetic wave

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1698302A (en) * 1921-04-22 1929-01-08 Gen Electric Coating method
US2121412A (en) * 1936-11-28 1938-06-21 Burgess Lab Inc C F Method for treating zinc and product formed thereby
US5055165A (en) * 1988-01-19 1991-10-08 Marine Environmental Research, Inc. Method and apparatus for the prevention of fouling and/or corrosion of structures in seawater, brackish water and fresh water
US4957594A (en) * 1988-02-19 1990-09-18 Nippon Steel Corporation Process for producing a zinc or zinc alloy coated steel sheet having excellent spot weldability
JPH0762276B2 (ja) * 1989-09-22 1995-07-05 新日本製鐵株式会社 溶接性、加工性に優れた亜鉛‐クロム合金メッキ鋼板及びその製造方法
US6325915B1 (en) * 1999-12-09 2001-12-04 Applied Semiconductor, Inc. Method and system of preventing corrosion of conductive structures
US6551491B2 (en) * 2000-06-02 2003-04-22 Applied Semiconductor, Inc. Method and system of preventing corrosion of conductive structures
US6524466B1 (en) * 2000-07-18 2003-02-25 Applied Semiconductor, Inc. Method and system of preventing fouling and corrosion of biomedical devices and structures
US6562201B2 (en) * 2001-06-08 2003-05-13 Applied Semiconductor, Inc. Semiconductive polymeric system, devices incorporating the same, and its use in controlling corrosion
US6402933B1 (en) * 2001-06-08 2002-06-11 Applied Semiconductor, Inc. Method and system of preventing corrosion of conductive structures
JP3582511B2 (ja) * 2001-10-23 2004-10-27 住友金属工業株式会社 熱間プレス成形用表面処理鋼とその製造方法
US6811681B2 (en) * 2002-11-12 2004-11-02 Applied Semiconductor International Ltd. Semiconductive corrosion and fouling control apparatus, system, and method
US6811882B1 (en) * 2003-02-11 2004-11-02 Ensci Inc. Metal non-oxide coated polymer substrates
US7318889B2 (en) * 2005-06-02 2008-01-15 Applied Semiconductor International, Ltd. Apparatus, system and method for extending the life of sacrificial anodes on cathodic protection systems
JP4415922B2 (ja) * 2005-09-27 2010-02-17 パナソニック電工株式会社 シリコン酸化膜の形成方法

Also Published As

Publication number Publication date
US20090148714A1 (en) 2009-06-11
AU2008296143A1 (en) 2009-03-12
ZA201001517B (en) 2011-05-25
JP2010538169A (ja) 2010-12-09
EP2212448A1 (en) 2010-08-04
CA2698368A1 (en) 2010-03-12
CN101802268A (zh) 2010-08-11
TW200936814A (en) 2009-09-01
KR20100093517A (ko) 2010-08-25
WO2009032992A1 (en) 2009-03-12

Similar Documents

Publication Publication Date Title
TW200702494A (en) Surface treatment method for copper and copper
SG135106A1 (en) Method and process for embedding electrically conductive elements in a dielectric layer
TW200730062A (en) Multilayered wiring substrate and method of manufacturing the same
TW200731893A (en) Wiring board and manufacturing method of wiring board
WO2013071197A3 (en) Printed circuit boards with embedded electro-optical passive element for higher bandwidth transmission
TW200634985A (en) Semiconductor device and MIM capacitor
TW200610108A (en) A manufacturing method of an electronic part built-in substrate
TW200624001A (en) Printed wiring board and manufacturing method therefor
TW200833201A (en) Wiring substrate and method for manufacturing the same
TW200625596A (en) Inductor and method of forming the same
CN103153002B (zh) 具有三面包夹孔铜结构印制电路板的制造方法
WO2008139934A1 (ja) 多層基板およびその製造方法
WO2007015834A3 (en) Optimization of through plane transitions
EP2072483A3 (en) Ceramic-copper foil bonding method
TW200702189A (en) Method of manufacturing multi-layered substrate
MX2011013434A (es) Proceso para producir un revestimiento estructurado de metal.
TW200746287A (en) Method for production of semiconductor devices
ATE494637T1 (de) Piezoaktor mit mehrschicht-verkapselung und verfahren zu seiner herstellung
TW200704298A (en) Multilayer wiring board and method for producing the same
MY177387A (en) Copper foil with attached carrier foil, method for manufacturing copper foil with attached carrier foil, and copper clad laminate board for laser beam drilling obtained by using copper foil with
MY154122A (en) Electronic circuit, method for forming same, and copper clad laminate for forming electronic circuit
TW200733839A (en) Substrate with multi-layer PTH and method for forming the multi-layer PTH
EP2019573A3 (en) Wired circuit board and producing method thereof
WO2012085472A3 (fr) Circuit imprime a substrat metallique isole
TW200740328A (en) Multilayer wiring substrate and method of connecting the same