DK527286A - Elektronisk kreditkort med mikromodul - Google Patents

Elektronisk kreditkort med mikromodul

Info

Publication number
DK527286A
DK527286A DK527286A DK527286A DK527286A DK 527286 A DK527286 A DK 527286A DK 527286 A DK527286 A DK 527286A DK 527286 A DK527286 A DK 527286A DK 527286 A DK527286 A DK 527286A
Authority
DK
Denmark
Prior art keywords
micromodo
credit card
electronic credit
electronic
card
Prior art date
Application number
DK527286A
Other languages
English (en)
Other versions
DK527286D0 (da
Inventor
Jean Pierre Gloton
Original Assignee
Eurotechnique Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eurotechnique Sa filed Critical Eurotechnique Sa
Publication of DK527286D0 publication Critical patent/DK527286D0/da
Publication of DK527286A publication Critical patent/DK527286A/da

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
    • G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DK527286A 1985-11-08 1986-11-05 Elektronisk kreditkort med mikromodul DK527286A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8516603A FR2590051B1 (fr) 1985-11-08 1985-11-08 Carte comportant un composant et micromodule a contacts de flanc

Publications (2)

Publication Number Publication Date
DK527286D0 DK527286D0 (da) 1986-11-05
DK527286A true DK527286A (da) 1987-05-09

Family

ID=9324660

Family Applications (1)

Application Number Title Priority Date Filing Date
DK527286A DK527286A (da) 1985-11-08 1986-11-05 Elektronisk kreditkort med mikromodul

Country Status (7)

Country Link
US (1) US4822988A (da)
EP (1) EP0225238B1 (da)
JP (1) JPS62111794A (da)
DE (1) DE3680479D1 (da)
DK (1) DK527286A (da)
ES (1) ES2026136T3 (da)
FR (1) FR2590051B1 (da)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3804361C1 (da) * 1988-02-12 1988-09-29 Deutsche Bundespost, Vertreten Durch Den Praesidenten Des Fernmeldetechnischen Zentralamtes, 6100 Darmstadt, De
JPH01283993A (ja) * 1988-05-11 1989-11-15 Hitachi Ltd 回路プリント板、その面付け部品位置認識装置、及び面付け部品検査装置
US5771143A (en) * 1988-11-30 1998-06-23 Vernois; Goulven Disk cartridge system with removable modules
JP2559849B2 (ja) * 1989-05-23 1996-12-04 三菱電機株式会社 Ｉｃカード
US5244840A (en) * 1989-05-23 1993-09-14 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
DE4007221A1 (de) * 1990-03-07 1991-09-12 Gao Ges Automation Org Pruefkopf fuer kontaktflaechen von wertkarten mit eingelagertem halbleiterchip
US5049728A (en) * 1990-04-04 1991-09-17 Rovin George H IC card system with removable IC modules
JPH05169885A (ja) * 1991-12-26 1993-07-09 Mitsubishi Electric Corp 薄型ｉｃカード
JP2809115B2 (ja) * 1993-10-13 1998-10-08 ヤマハ株式会社 半導体装置とその製造方法
US5736781A (en) * 1993-10-18 1998-04-07 Oki Electric Industry Co., Ltd. IC module and a data carrier employing the same
DE4406704C1 (de) * 1994-03-02 1995-07-20 Angewandte Digital Elektronik Chipkarte
DE19509517C1 (de) * 1995-03-20 1996-10-10 Angewandte Digital Elektronik Vorrichtung, bestehend aus mindestens einem Kartenendgerät zur Übertragung von Energie zu einer Chipkarte und zum Datenaustausch mit der Chipkarte über elektromagnetische Wellen
DE19512191C2 (de) * 1995-03-31 2000-03-09 Siemens Ag Kartenförmiger Datenträger und Leadframe zur Verwendung in einem solchen Datenträger
FR2736453B1 (fr) * 1995-07-07 1997-08-08 Gemplus Card Int Support portable a microcircuit, notamment carte a puce, et procede de fabrication dudit support
JP4000609B2 (ja) * 1995-12-22 2007-10-31 イビデン株式会社 電子部品搭載用基板及びその製造方法
EP1008101A4 (en) * 1996-11-20 2003-03-26 Tecsec Inc CRYPTOGRAPHIC MEDIUM
EP0845755B1 (fr) * 1996-12-02 2004-03-10 Swisscom Mobile AG Carte à puce et programme pour cartes à puces
EP0849695A3 (de) * 1996-12-20 2000-09-06 Tyco Electronics Logistics AG Kartenträgerteil
FR2773900B1 (fr) * 1998-01-22 2000-02-18 Gemplus Card Int Carte a circuit(s) integre(s) a contact, comportant une minicarte detachable
US6109530A (en) * 1998-07-08 2000-08-29 Motorola, Inc. Integrated circuit carrier package with battery coin cell
US6193163B1 (en) 1998-08-31 2001-02-27 The Standard Register Company Smart card with replaceable chip
TW409940U (en) 1998-09-28 2000-10-21 Gen Semiconductor Of Taiwan Lt Package of the leads of a semiconductor device assembled without soldering
US6069403A (en) * 1998-10-06 2000-05-30 Intersil Corporation Power module with lowered inductance and reduced voltage overshoots
EP1005084A1 (en) * 1998-11-17 2000-05-31 General Semiconductor of Taiwan, Ltd. Leaded semiconductor device package for use in nonsoldering assembling
FR2788646B1 (fr) * 1999-01-19 2007-02-09 Bull Cp8 Carte a puce munie d'une antenne en boucle, et micromodule associe
US7295443B2 (en) 2000-07-06 2007-11-13 Onspec Electronic, Inc. Smartconnect universal flash media card adapters
US6545227B2 (en) * 2001-07-11 2003-04-08 Mce/Kdi Corporation Pocket mounted chip having microstrip line
KR100910769B1 (ko) * 2002-06-11 2009-08-04 삼성테크윈 주식회사 Ｉｃ 카드 및, 그것의 제조 방법
US7053314B1 (en) * 2003-06-02 2006-05-30 Cisco Technology, Inc. Methods and apparatus for providing a signal to a circuit board component
US7495926B2 (en) * 2004-10-05 2009-02-24 Sony Ericsson Mobile Communications Ab Interface module for electronic devices
US7287687B2 (en) * 2005-03-22 2007-10-30 I.C.A.R.D., L.L.C. System and method for regulating alcohol consumption
US20130068516A1 (en) * 2011-09-19 2013-03-21 Tessera Research Llc High io substrates and interposers without vias
EP2765536A1 (fr) * 2013-02-07 2014-08-13 Gemalto SA Procédé de connexion d'un microcircuit à des zones conductrices accessibles dans un support
CN104254202B (zh) * 2013-06-28 2017-08-22 鹏鼎控股(深圳)股份有限公司 具有内埋电子元件的电路板及其制作方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3746932A (en) * 1970-12-28 1973-07-17 Texas Instruments Inc Panel board systems and components therefor
US3702464A (en) * 1971-05-04 1972-11-07 Ibm Information card
GB1442339A (en) * 1973-01-04 1976-07-14 Amp Inc Substrate connector
DE2305883A1 (de) * 1973-02-07 1974-08-15 Finsterhoelzl Rafi Elekt Leiterplatte
FR2337381A1 (fr) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
US4246595A (en) * 1977-03-08 1981-01-20 Matsushita Electric Industrial Co., Ltd. Electronics circuit device and method of making the same
FR2439438A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
FR2455320B1 (fr) * 1979-04-25 1986-01-24 Cii Honeywell Bull Dispositif de recyclage de supports d'enregistrement identifiables a l'aide de donnees d'identification et composes de memoires monolithiques non volatiles effacables
GB2073947B (en) * 1980-04-11 1983-12-21 Philips Electronic Associated Integrated circuit encapsulation
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein
US4459607A (en) * 1981-06-18 1984-07-10 Burroughs Corporation Tape automated wire bonded integrated circuit chip assembly
FR2512990B1 (fr) * 1981-09-11 1987-06-19 Radiotechnique Compelec Procede pour fabriquer une carte de paiement electronique, et carte realisee selon ce procede
JPS58206147A (ja) * 1982-05-26 1983-12-01 Fujitsu Ltd 半導体装置モジユ−ル
JPS5947478A (ja) * 1982-09-06 1984-03-17 花王株式会社 合成繊維用紡績油剤
US4511796A (en) * 1982-12-09 1985-04-16 Seiichiro Aigo Information card
IT1212711B (it) * 1983-03-09 1989-11-30 Ates Componenti Elettron Dispositivo a semiconduttore aforma di scheda piana con contatti elettrici su ambedue le facce eprocedimento per la sua fabbricazione.
US4539472A (en) * 1984-01-06 1985-09-03 Horizon Technology, Inc. Data processing card system and method of forming same

Also Published As

Publication number Publication date
FR2590051B1 (fr) 1991-05-17
JPS62111794A (ja) 1987-05-22
EP0225238B1 (fr) 1991-07-24
ES2026136T3 (es) 1992-04-16
DK527286D0 (da) 1986-11-05
FR2590051A1 (fr) 1987-05-15
EP0225238A1 (fr) 1987-06-10
US4822988A (en) 1989-04-18
DE3680479D1 (de) 1991-08-29

Similar Documents

Publication Publication Date Title
DK527286D0 (da) Elektronisk kreditkort med mikromodul
DE3650258D1 (de) IC-Karte.
DE3688984D1 (de) IC-Karte.
DE3689094D1 (de) Ic-karte.
DE3677686D1 (de) Ic-karte.
DE3689251D1 (de) Anordnung mit Wertkarten.
NO172020C (no) Elektronisk system med integrert ryggstykke
EP0209791A3 (en) Electronic memory card
EP0213534A3 (en) Ic card
DE3670154D1 (de) Elektronisches hubodometer.
EP0212615A3 (en) Ic card
ATA238385A (de) Elektronischer taxameter
DK146581A (da) Betalingsanlaeg med magnetkort
KR870011251U (ko) 슬라이드형 전자부품
ATA312785A (de) Chip-karte
BR8505609A (pt) Aperfeicoamentos em minuteria eletronica
DE3679954D1 (de) Ic-karte.
DD228668C2 (de) Tragbare karte mit integrierten schaltkreisen
KR890002465U (ko) 신용카드 소인기
SE8504280D0 (sv) Elektronisk senkklocka
MX158531A (es) Mejoras en tarjeta termometro
ES547357A0 (es) Lector-codificador electronico de tarjetas perforadas
BR6400704U (pt) Cartao magnetico
GB8517966D0 (en) Credit card
GB8502222D0 (en) Credit card

Legal Events

Date Code Title Description
AHS Application shelved for other reasons than non-payment