DK527286A - ELECTRONIC CREDIT CARD WITH MICROMODO - Google Patents

ELECTRONIC CREDIT CARD WITH MICROMODO

Info

Publication number
DK527286A
DK527286A DK527286A DK527286A DK527286A DK 527286 A DK527286 A DK 527286A DK 527286 A DK527286 A DK 527286A DK 527286 A DK527286 A DK 527286A DK 527286 A DK527286 A DK 527286A
Authority
DK
Denmark
Prior art keywords
micromodo
credit card
electronic credit
electronic
card
Prior art date
Application number
DK527286A
Other languages
Danish (da)
Other versions
DK527286D0 (en
Inventor
Jean Pierre Gloton
Original Assignee
Eurotechnique Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eurotechnique Sa filed Critical Eurotechnique Sa
Publication of DK527286D0 publication Critical patent/DK527286D0/en
Publication of DK527286A publication Critical patent/DK527286A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
    • G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DK527286A 1985-11-08 1986-11-05 ELECTRONIC CREDIT CARD WITH MICROMODO DK527286A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8516603A FR2590051B1 (en) 1985-11-08 1985-11-08 CARD COMPRISING A COMPONENT AND MICROMODULE WITH SIDING CONTACTS

Publications (2)

Publication Number Publication Date
DK527286D0 DK527286D0 (en) 1986-11-05
DK527286A true DK527286A (en) 1987-05-09

Family

ID=9324660

Family Applications (1)

Application Number Title Priority Date Filing Date
DK527286A DK527286A (en) 1985-11-08 1986-11-05 ELECTRONIC CREDIT CARD WITH MICROMODO

Country Status (7)

Country Link
US (1) US4822988A (en)
EP (1) EP0225238B1 (en)
JP (1) JPS62111794A (en)
DE (1) DE3680479D1 (en)
DK (1) DK527286A (en)
ES (1) ES2026136T3 (en)
FR (1) FR2590051B1 (en)

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DE3804361C1 (en) * 1988-02-12 1988-09-29 Deutsche Bundespost, Vertreten Durch Den Praesidenten Des Fernmeldetechnischen Zentralamtes, 6100 Darmstadt, De
JPH01283993A (en) * 1988-05-11 1989-11-15 Hitachi Ltd Circuit printed board, its surface mounting component position recognition device and surface mounting component inspecting device
US5771143A (en) * 1988-11-30 1998-06-23 Vernois; Goulven Disk cartridge system with removable modules
JP2559849B2 (en) * 1989-05-23 1996-12-04 三菱電機株式会社 IC card
US5244840A (en) * 1989-05-23 1993-09-14 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
DE4007221A1 (en) * 1990-03-07 1991-09-12 Gao Ges Automation Org TEST HEAD FOR CONTACT AREAS OF VALUE CARDS WITH STORED SEMICONDUCTOR CHIP
US5049728A (en) * 1990-04-04 1991-09-17 Rovin George H IC card system with removable IC modules
JPH05169885A (en) * 1991-12-26 1993-07-09 Mitsubishi Electric Corp Thin ic card
JP2809115B2 (en) * 1993-10-13 1998-10-08 ヤマハ株式会社 Semiconductor device and manufacturing method thereof
US5736781A (en) * 1993-10-18 1998-04-07 Oki Electric Industry Co., Ltd. IC module and a data carrier employing the same
DE4406704C1 (en) * 1994-03-02 1995-07-20 Angewandte Digital Elektronik Smart card
DE19509517C1 (en) * 1995-03-20 1996-10-10 Angewandte Digital Elektronik Device consisting of at least one card terminal for transmitting energy to a chip card and for exchanging data with the chip card via electromagnetic waves
DE19512191C2 (en) * 1995-03-31 2000-03-09 Siemens Ag Card-shaped data carrier and lead frame for use in such a data carrier
FR2736453B1 (en) * 1995-07-07 1997-08-08 Gemplus Card Int PORTABLE MICROCIRCUIT MEDIUM, ESPECIALLY CHIP CARD, AND METHOD FOR MANUFACTURING SUCH MEDIUM
JP4000609B2 (en) * 1995-12-22 2007-10-31 イビデン株式会社 Electronic component mounting substrate and manufacturing method thereof
EP1008101A4 (en) * 1996-11-20 2003-03-26 Tecsec Inc Cryptographic medium
EP0845755B1 (en) * 1996-12-02 2004-03-10 Swisscom Mobile AG IC-card and program for IC-cards
EP0849695A3 (en) * 1996-12-20 2000-09-06 Tyco Electronics Logistics AG Card carrier part
FR2773900B1 (en) * 1998-01-22 2000-02-18 Gemplus Card Int CARD WITH INTEGRATED CONTACT CIRCUIT (S), COMPRISING A DETACHABLE MINICARD
US6109530A (en) * 1998-07-08 2000-08-29 Motorola, Inc. Integrated circuit carrier package with battery coin cell
US6193163B1 (en) 1998-08-31 2001-02-27 The Standard Register Company Smart card with replaceable chip
TW409940U (en) 1998-09-28 2000-10-21 Gen Semiconductor Of Taiwan Lt Package of the leads of a semiconductor device assembled without soldering
US6069403A (en) * 1998-10-06 2000-05-30 Intersil Corporation Power module with lowered inductance and reduced voltage overshoots
EP1005084A1 (en) * 1998-11-17 2000-05-31 General Semiconductor of Taiwan, Ltd. Leaded semiconductor device package for use in nonsoldering assembling
FR2788646B1 (en) * 1999-01-19 2007-02-09 Bull Cp8 CHIP CARD HAVING A LOOP ANTENNA, AND ASSOCIATED MICROMODULE
US7295443B2 (en) 2000-07-06 2007-11-13 Onspec Electronic, Inc. Smartconnect universal flash media card adapters
US6545227B2 (en) * 2001-07-11 2003-04-08 Mce/Kdi Corporation Pocket mounted chip having microstrip line
KR100910769B1 (en) * 2002-06-11 2009-08-04 삼성테크윈 주식회사 IC card and manufacturing method thereof
US7053314B1 (en) * 2003-06-02 2006-05-30 Cisco Technology, Inc. Methods and apparatus for providing a signal to a circuit board component
US7495926B2 (en) * 2004-10-05 2009-02-24 Sony Ericsson Mobile Communications Ab Interface module for electronic devices
US7287687B2 (en) * 2005-03-22 2007-10-30 I.C.A.R.D., L.L.C. System and method for regulating alcohol consumption
US20130068516A1 (en) * 2011-09-19 2013-03-21 Tessera Research Llc High io substrates and interposers without vias
EP2765536A1 (en) * 2013-02-07 2014-08-13 Gemalto SA Method for connecting a microcircuit with accessible conductive areas in a substrate
CN104254202B (en) * 2013-06-28 2017-08-22 鹏鼎控股(深圳)股份有限公司 Circuit board with interior embedded electronic component and preparation method thereof

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Also Published As

Publication number Publication date
FR2590051B1 (en) 1991-05-17
JPS62111794A (en) 1987-05-22
EP0225238B1 (en) 1991-07-24
ES2026136T3 (en) 1992-04-16
DK527286D0 (en) 1986-11-05
FR2590051A1 (en) 1987-05-15
EP0225238A1 (en) 1987-06-10
US4822988A (en) 1989-04-18
DE3680479D1 (en) 1991-08-29

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Legal Events

Date Code Title Description
AHS Application shelved for other reasons than non-payment