DK457988A - Fremgangsmaade til bemoenstring af modstandsgivende materiale paa et trykt kredsloebskort - Google Patents

Fremgangsmaade til bemoenstring af modstandsgivende materiale paa et trykt kredsloebskort

Info

Publication number
DK457988A
DK457988A DK457988A DK457988A DK457988A DK 457988 A DK457988 A DK 457988A DK 457988 A DK457988 A DK 457988A DK 457988 A DK457988 A DK 457988A DK 457988 A DK457988 A DK 457988A
Authority
DK
Denmark
Prior art keywords
board
film
ultraviolet
photo
printed circuit
Prior art date
Application number
DK457988A
Other languages
English (en)
Other versions
DK170480B1 (da
DK457988D0 (da
Inventor
Harold Lake
Paul E Grandmont
Original Assignee
Foxboro Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxboro Co filed Critical Foxboro Co
Publication of DK457988A publication Critical patent/DK457988A/da
Publication of DK457988D0 publication Critical patent/DK457988D0/da
Application granted granted Critical
Publication of DK170480B1 publication Critical patent/DK170480B1/da

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G03F7/0952—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer comprising silver halide or silver salt based image forming systems, e.g. for camera speed exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0505—Double exposure of the same photosensitive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0551—Exposure mask directly printed on the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
DK457988A 1985-06-10 1988-08-16 Fremgangsmåde til bemønstring af modstandsgivende materiale på et trykt kredsløbskort DK170480B1 (da)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US74274285 1985-06-10
US06/742,742 US4666818A (en) 1985-06-10 1985-06-10 Method of patterning resist for printed wiring board
US8602709 1986-12-17
PCT/US1986/002709 WO1988004797A1 (en) 1985-06-10 1986-12-17 Method of patterning resist for printed wiring board

Publications (3)

Publication Number Publication Date
DK457988A true DK457988A (da) 1988-08-16
DK457988D0 DK457988D0 (da) 1988-08-16
DK170480B1 DK170480B1 (da) 1995-09-11

Family

ID=24986015

Family Applications (1)

Application Number Title Priority Date Filing Date
DK457988A DK170480B1 (da) 1985-06-10 1988-08-16 Fremgangsmåde til bemønstring af modstandsgivende materiale på et trykt kredsløbskort

Country Status (8)

Country Link
US (1) US4666818A (da)
EP (1) EP0339020B1 (da)
JP (1) JPH02501427A (da)
KR (1) KR940007800B1 (da)
DE (1) DE3689659T2 (da)
DK (1) DK170480B1 (da)
NO (1) NO883643L (da)
WO (1) WO1988004797A1 (da)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5254435A (en) * 1985-06-10 1993-10-19 The Foxboro Company Method of patterning resist
US5302494A (en) * 1985-06-10 1994-04-12 The Foxboro Company Multilayer circuit board having microporous layers and process for making same
US5015553A (en) * 1985-06-10 1991-05-14 The Foxboro Company Method of patterning resist
IL81157A (en) * 1987-01-05 1990-04-29 Uri Shoshani Decorative products made of plastic having a metallic decorative pattern
EP0346355B1 (en) * 1987-01-22 1994-05-04 The Foxboro Company Photopatternable composite
CA1249065A (en) * 1987-07-06 1989-01-17 Allan R. Drake Process for forming silver conductors on a substrate
US4999277A (en) * 1988-02-22 1991-03-12 Trw Inc. Production of precision patterns on curved surfaces
JPH0234984A (ja) * 1988-04-13 1990-02-05 Mitsubishi Electric Corp プリント回路基板の製造方法
US4987050A (en) * 1988-12-06 1991-01-22 Fuji Photo Film Co., Ltd. Light-sensitive transfer material and image-forming process using the same
US5260168A (en) * 1989-10-13 1993-11-09 The Foxboro Company Application specific tape automated bonding
KR920702046A (ko) * 1989-10-13 1992-08-12 원본미기재 테이프 자동 본딩
JPH04504332A (ja) * 1989-10-30 1992-07-30 ザ・フォックスボロ・カンパニー ミクロ孔の層を有する多層回路板及びその製造方法
EP0433721A3 (en) * 1989-12-22 1992-07-08 Siemens Aktiengesellschaft Method of applying a solder stop coating on printed circuit boards
EP0486246A1 (en) * 1990-11-14 1992-05-20 Canon Kabushiki Kaisha Heat-developable photosensitive material
US5384230A (en) * 1992-03-02 1995-01-24 Berg; N. Edward Process for fabricating printed circuit boards
US5751594A (en) * 1993-03-16 1998-05-12 Emc Corporation Aperture control system for printed circuit board fabrication
JP3149289B2 (ja) * 1993-03-24 2001-03-26 三菱製紙株式会社 画像形成材料及びそれを使用する画像形成方法
DE4408507A1 (de) * 1994-03-14 1995-09-28 Heidelberg Instruments Mikrotechnik Gmbh Lithografisches Verfahren
US5712613A (en) * 1995-05-05 1998-01-27 Mcdonnell Douglas Corporation Computer-aided method for producing resistive tapers and resistive taper produced thereby
EP0785474A1 (de) * 1996-01-16 1997-07-23 Schablonentechnik Kufstein Aktiengesellschaft Verfahren und Vorrichtung zur Herstellung einer Flexodruckschablone
CN1104832C (zh) * 1996-08-09 2003-04-02 松下电工株式会社 独立导体电路电镀的方法
EP1246773A2 (en) 2000-01-07 2002-10-09 President And Fellows Of Harvard College Fabrication of metallic microstructures via exposure of photosensitive composition
JP3657168B2 (ja) 2000-02-28 2005-06-08 富士通株式会社 多層プリント配線板の製造方法
TW200507131A (en) 2003-07-02 2005-02-16 North Corp Multi-layer circuit board for electronic device
WO2005092043A2 (en) * 2004-03-22 2005-10-06 Epic Research Company, Inc. Process for fabrication of printed circuit boards
US8142987B2 (en) * 2004-04-10 2012-03-27 Eastman Kodak Company Method of producing a relief image for printing
KR100697601B1 (ko) 2004-07-10 2007-03-21 지성우 명함 제조 방법
JP2009239070A (ja) * 2008-03-27 2009-10-15 Fujifilm Corp 配線形成方法
CN108650797A (zh) * 2018-06-22 2018-10-12 赣州中盛隆电子有限公司 一种电路板负片图形转移工艺
CN118315120B (zh) * 2024-06-07 2024-08-30 珠海智锐科技有限公司 一种柔性透明导电薄膜及其制备工艺

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT326703B (de) * 1971-10-07 1975-12-29 Zimmer Peter Verfahren zur herstellung von druckformen
US3867150A (en) * 1973-06-08 1975-02-18 Grace W R & Co Printing plate process and apparatus using a laser scanned silver negative
US4168980A (en) * 1977-08-19 1979-09-25 Eastman Kodak Company Heat developable photographic material and process
US4419675A (en) * 1979-05-24 1983-12-06 American Hoechst Corporation Imaging system and method for printed circuit artwork and the like
JPS5660442A (en) * 1979-10-23 1981-05-25 Fuji Photo Film Co Ltd Photosensitive lithographic plate and method for making lithographic plate
JPS56129394A (en) * 1980-03-14 1981-10-09 Dainippon Screen Mfg Method of producing through hole of printed board
US4373018A (en) * 1981-06-05 1983-02-08 Bell Telephone Laboratories, Incorporated Multiple exposure microlithography patterning method
JPS5965838A (ja) * 1982-10-07 1984-04-14 Dainippon Screen Mfg Co Ltd 多層構造を有する感材およびその製版方法
JPS5973748U (ja) * 1982-11-11 1984-05-18 大日本スクリ−ン製造株式会社 色校正用フイルム
US4515877A (en) * 1982-11-27 1985-05-07 Basf Aktiengesellschaft Image-recording materials and image-recording carried out using these to produce an optical mask
JPH0664341B2 (ja) * 1983-01-24 1994-08-22 ウエスターン エレクトリック カムパニー，インコーポレーテッド 半導体デバイスの製作法
US4469777A (en) * 1983-12-01 1984-09-04 E. I. Du Pont De Nemours And Company Single exposure process for preparing printed circuits

Also Published As

Publication number Publication date
NO883643L (no) 1988-10-14
KR940007800B1 (ko) 1994-08-25
KR890700855A (ko) 1989-04-27
EP0339020B1 (en) 1994-02-16
US4666818A (en) 1987-05-19
WO1988004797A1 (en) 1988-06-30
DK170480B1 (da) 1995-09-11
DK457988D0 (da) 1988-08-16
NO883643D0 (no) 1988-08-16
JPH02501427A (ja) 1990-05-17
EP0339020A1 (en) 1989-11-02
DE3689659D1 (de) 1994-03-24
DE3689659T2 (de) 1994-09-29

Similar Documents

Publication Publication Date Title
DK457988A (da) Fremgangsmaade til bemoenstring af modstandsgivende materiale paa et trykt kredsloebskort
DE3064381D1 (en) Positive photoresist layer and means for transfer
JPS5420719A (en) Photosensitive material for image formation and image formation method
US2446915A (en) Photographic process of producing a printing image
US3169063A (en) Method of making printed circuits
JPS5613789A (en) Method of manufacturing optically transparent conductor film pattern on substrate and printed mixture used therefor
US3973130A (en) Apparatus for recording information on a film
US2441010A (en) Reflex reproducing process
EP0048297B1 (de) Vorrichtung und Verfahren zur Herstellung von Schriftzeichen, insbesondere von Titelsatz, auf einem Fotomaterial
EP0517923A4 (en) Method of forming minute resist pattern
JPS56125830A (en) Uniform exposure patterning method in electron beam patterning device
JPS55157737A (en) Resist pattern forming method for photofabrication
FR2348511A1 (fr) Dispositif de traitement automatique de papier photosensible expose, dans un appareil photographique automatique
ES326326A1 (es) Un procedimiento para la confeccion de una plancha para la impresion en offset.
US5773576A (en) Coded thin layer chromatography support
US3741764A (en) Method of making accurate reproduction
US3179519A (en) Method of making gravure relief images
JPS54141573A (en) Mask for exposure
KR850002692A (ko) X-선 노광 방법 및 장치
US3794492A (en) Process for producing an image bearing screen transparency
DE3173223D1 (en) Method for the production of a granulated screen
SE8305112D0 (sv) Finlinjiga fotografiska overforingsbilder
JPS5478989A (en) Manufacture for semiconductor device
KR890002719A (ko) 감광층을 화학선에 영상 노출하는 방법
JPH02144989A (ja) プリント回路板の処理方法