DK359187A - Flerlaget kredsloebsplade med stive og boejelige omraader - Google Patents

Flerlaget kredsloebsplade med stive og boejelige omraader

Info

Publication number
DK359187A
DK359187A DK359187A DK359187A DK359187A DK 359187 A DK359187 A DK 359187A DK 359187 A DK359187 A DK 359187A DK 359187 A DK359187 A DK 359187A DK 359187 A DK359187 A DK 359187A
Authority
DK
Denmark
Prior art keywords
flexible
rigid
circuit board
regions
layered circuit
Prior art date
Application number
DK359187A
Other languages
English (en)
Other versions
DK165040C (da
DK359187D0 (da
DK165040B (da
Inventor
Friedrich-Wilhelm Schlitter
Original Assignee
Schoeller & Co Elektronik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schoeller & Co Elektronik filed Critical Schoeller & Co Elektronik
Publication of DK359187D0 publication Critical patent/DK359187D0/da
Publication of DK359187A publication Critical patent/DK359187A/da
Publication of DK165040B publication Critical patent/DK165040B/da
Application granted granted Critical
Publication of DK165040C publication Critical patent/DK165040C/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Glass Compositions (AREA)
DK359187A 1986-07-22 1987-07-10 Flerlaget kredsloebsplade med stive og boejelige omraader DK165040C (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19863624719 DE3624719A1 (de) 1986-07-22 1986-07-22 Vorlaminat fuer starr-flexible leiterplatten
DE3624719 1986-07-22

Publications (4)

Publication Number Publication Date
DK359187D0 DK359187D0 (da) 1987-07-10
DK359187A true DK359187A (da) 1988-01-23
DK165040B DK165040B (da) 1992-09-28
DK165040C DK165040C (da) 1993-02-08

Family

ID=6305684

Family Applications (1)

Application Number Title Priority Date Filing Date
DK359187A DK165040C (da) 1986-07-22 1987-07-10 Flerlaget kredsloebsplade med stive og boejelige omraader

Country Status (4)

Country Link
EP (1) EP0255607B1 (da)
AT (1) ATE55531T1 (da)
DE (2) DE3624719A1 (da)
DK (1) DK165040C (da)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5095628A (en) * 1990-08-09 1992-03-17 Teledyne Industries, Inc. Process of forming a rigid-flex circuit
GB9125173D0 (en) * 1991-11-27 1992-01-29 Northumbria Circuits Limited Printed circuit combination and process
CN101605430B (zh) * 2009-07-16 2012-01-25 东莞康源电子有限公司 刚挠性产品层垫片的压合方法
CN104302126A (zh) * 2014-10-11 2015-01-21 无锡长辉机电科技有限公司 一种刚挠结合印制板的制造工艺
WO2017017127A1 (en) * 2015-07-28 2017-02-02 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Stretchable electronic component carrier
CN108260275B (zh) * 2017-12-21 2019-09-06 深南电路股份有限公司 采用抽取式垫片结构的刚挠结合pcb及其加工方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3346415A (en) * 1963-12-16 1967-10-10 Carl L Hachenberger Flexible printed circuit wiring
DE2657212C3 (de) * 1976-12-17 1982-09-02 Schoeller & Co Elektronik Gmbh, 3552 Wetter Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten
JPS5683096A (en) * 1979-12-10 1981-07-07 Sony Corp Hybrid integrated circuit and method of manufacturing same
DE3119884C1 (de) * 1981-05-19 1982-11-04 Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten
US4597177A (en) * 1984-01-03 1986-07-01 International Business Machines Corporation Fabricating contacts for flexible module carriers
US4687695A (en) * 1985-09-27 1987-08-18 Hamby Bill L Flexible printed circuits and methods of fabricating and forming plated thru-holes therein

Also Published As

Publication number Publication date
ATE55531T1 (de) 1990-08-15
DK165040C (da) 1993-02-08
DE3764217D1 (de) 1990-09-13
EP0255607A3 (en) 1988-07-13
DE3624719A1 (de) 1988-01-28
DE3624719C2 (da) 1988-05-26
DK359187D0 (da) 1987-07-10
EP0255607B1 (de) 1990-08-08
EP0255607A2 (de) 1988-02-10
DK165040B (da) 1992-09-28

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Legal Events

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