DK329489A - Epoxyharpiksmaterialer til brug ved anvendelser, hvor der haerdes ved lav temperatur - Google Patents

Epoxyharpiksmaterialer til brug ved anvendelser, hvor der haerdes ved lav temperatur Download PDF

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Publication number
DK329489A
DK329489A DK329489A DK329489A DK329489A DK 329489 A DK329489 A DK 329489A DK 329489 A DK329489 A DK 329489A DK 329489 A DK329489 A DK 329489A DK 329489 A DK329489 A DK 329489A
Authority
DK
Denmark
Prior art keywords
epoxy resin
low temperature
resin materials
temperature tempering
applications
Prior art date
Application number
DK329489A
Other languages
Danish (da)
English (en)
Other versions
DK329489D0 (da
Inventor
Paul L Wykowski
Paul M Puckett
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of DK329489D0 publication Critical patent/DK329489D0/da
Publication of DK329489A publication Critical patent/DK329489A/da

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5026Amines cycloaliphatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/38Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2221Coating or impregnation is specified as water proof
    • Y10T442/2246Nitrogen containing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DK329489A 1987-11-03 1989-07-03 Epoxyharpiksmaterialer til brug ved anvendelser, hvor der haerdes ved lav temperatur DK329489A (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/116,593 US4798761A (en) 1987-11-03 1987-11-03 Epoxy resin compositions for use in low temperature curing applications
PCT/US1988/003725 WO1989004335A1 (fr) 1987-11-03 1988-10-21 Compositions de resine epoxyde utilisees dans des applications de polymerisation a basse temperature

Publications (2)

Publication Number Publication Date
DK329489D0 DK329489D0 (da) 1989-07-03
DK329489A true DK329489A (da) 1989-07-03

Family

ID=22368117

Family Applications (1)

Application Number Title Priority Date Filing Date
DK329489A DK329489A (da) 1987-11-03 1989-07-03 Epoxyharpiksmaterialer til brug ved anvendelser, hvor der haerdes ved lav temperatur

Country Status (9)

Country Link
US (1) US4798761A (fr)
EP (1) EP0315090A3 (fr)
JP (1) JPH02502101A (fr)
BR (1) BR8807277A (fr)
DK (1) DK329489A (fr)
FI (1) FI893208A (fr)
IL (1) IL88200A0 (fr)
NZ (1) NZ226771A (fr)
WO (1) WO1989004335A1 (fr)

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US5232970A (en) * 1990-08-31 1993-08-03 The Dow Chemical Company Ceramic-filled thermally-conductive-composites containing fusible semi-crystalline polyamide and/or polybenzocyclobutenes for use in microelectronic applications
DE4039715A1 (de) * 1990-12-13 1992-06-17 Basf Ag Epoxidharzmischungen fuer faserverbundwerkstoffe
US5350779A (en) * 1991-12-19 1994-09-27 Hughes Aircraft Company Low exotherm, low temperature curing, epoxy impregnants
DE69229262T2 (de) * 1992-03-16 2000-01-20 Raytheon Co., Lexington Wärmetransferklebstoff
US5385990A (en) * 1992-11-02 1995-01-31 Lord Corporation Structural adhesive composition having high temperature resistance
EP0705856A2 (fr) * 1994-10-07 1996-04-10 Shell Internationale Researchmaatschappij B.V. Composition de résine époxide pour l'encapsulation d'un dispositif semi-conducteurs
JPH0925393A (ja) * 1995-05-09 1997-01-28 Toray Ind Inc 繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料
US6187374B1 (en) 1998-09-02 2001-02-13 Xim Products, Inc. Coatings with increased adhesion
US6322848B1 (en) 1999-10-26 2001-11-27 Lord Corporation Flexible epoxy encapsulating material
US20060182949A1 (en) * 2005-02-17 2006-08-17 3M Innovative Properties Company Surfacing and/or joining method
US7528195B2 (en) * 2006-12-11 2009-05-05 The United States Of America As Represented By The Secretary Of The Navy Mixing and curing carboxy-terminated butadiene-nitrile rubber, epoxy resin and curing agent
EP2162481A1 (fr) * 2007-06-15 2010-03-17 Dow Global Technologies Inc. Procédé de préparation de composites utilisant des compositions de résine époxy
JP5291975B2 (ja) * 2008-04-21 2013-09-18 木村化工機株式会社 高水素含有エポキシ混合硬化物の形成方法
DE102009001793A1 (de) 2009-03-24 2010-10-07 Evonik Degussa Gmbh Prepregs und daraus hergestellte Formkörper
DE102009001806A1 (de) 2009-03-24 2010-09-30 Evonik Degussa Gmbh Prepregs und daraus bei niedriger Temperatur hergestellte Formkörper
ITMI20091980A1 (it) 2009-11-12 2011-05-13 Imast S C A R L Polimeri rinforzati con fibre, composizioni polimeriche a base epossidica e loro impiego
DE102010029355A1 (de) 2010-05-27 2011-12-01 Evonik Degussa Gmbh Verfahren zur Herstellung von lagerstabilen Polyurethan-Prepregs und daraus hergestellte Formkörper
DE102010041247A1 (de) 2010-09-23 2012-03-29 Evonik Degussa Gmbh Verfahren zur Herstellung von lagerstabilen Polyurethan-Prepregs und daraus hergestellte Formkörper aus Polyurethanzusammensetzung in Lösung
US9878500B2 (en) 2011-01-04 2018-01-30 Evonik Degussa Gmbh Composite semifinished products, molded parts produced therefrom, and molded parts produced directly based on hydroxy-functionalized (meth)acrylates, which are cross-linked by means of uretdiones in a thermosetting manner
DE102011006163A1 (de) 2011-03-25 2012-09-27 Evonik Degussa Gmbh Lagerstabile Polyurethan-Prepregs und daraus hergestellte Formkörper aus Polyurethanzusammensetzung mit flüssigen Harzkomponenten
US20120328811A1 (en) * 2011-06-24 2012-12-27 Air Products And Chemicals, Inc. Epoxy Resin Compositions
DE102011087226A1 (de) 2011-11-28 2013-05-29 Evonik Degussa Gmbh Pseudo-thermoplastische, selbstvernetzende Composites
JP5725559B2 (ja) * 2011-12-28 2015-05-27 信越化学工業株式会社 液状導電性樹脂組成物及び電子部品
KR102129641B1 (ko) * 2012-10-24 2020-07-02 블루 큐브 아이피 엘엘씨 상온 경화 내후성 코팅
US20140213697A1 (en) * 2013-01-28 2014-07-31 Basf Se 2,2',6,6'-tetramethyl-4,4'-methylenebis(cyclohexylamine) as hardener for epoxy resins
KR20150110758A (ko) * 2013-01-28 2015-10-02 바스프 에스이 에폭시 수지에 대한 경화제로서의 2,2'',6,6''-테트라메틸-4,4''-메틸렌-비스(시클로헥실아민)
DE102013204124A1 (de) 2013-03-11 2014-09-11 Evonik Industries Ag Composite-Halbzeuge und daraus hergestellte Formteile sowie direkt hergestellte Formteile auf Basis von hydroxyfunktionalisierten (Meth)Acrylaten und Uretdionen die mittels Strahlung duroplastisch vernetzt werden
CA2930476A1 (fr) 2013-11-19 2015-05-28 Evonik Degussa Gmbh Pieces faconnees a base de (meth)acrylates a fonctionnalite diene et de (hetero)dienophiles de diels-alder, avec reticulation reversible
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EP2979851A1 (fr) 2014-07-28 2016-02-03 Evonik Degussa GmbH Fabrication efficace de demi-produits et composants composites dans le cadre du procédé de pressage à froid utilisant des (méth)acrylates hydroxyfonctionnalisés réticulés par duroplastie à l'aide d'isocyanates ou d'uretdions
EP2982704A1 (fr) 2014-08-06 2016-02-10 Evonik Degussa GmbH Émulsions de polymère réticulées réversibles
EP2993202A1 (fr) 2014-09-08 2016-03-09 Evonik Degussa GmbH Demi-produits composites et pièces moulées en étant constituées ainsi que pièces moulées directement fabriquées à base de (méth)acrylates hydroxyfonctionnalisés et d'uretdions réticulés par duroplastie
RU2018100340A (ru) * 2015-06-25 2019-07-25 Торэй Индастриз, Инк. Композиция эпоксидной смолы, армированный волокном композиционный материал, формованное изделие и сосуд высокого давления
US20180179330A1 (en) * 2015-07-07 2018-06-28 Dow Global Technologies, Llc Stable high glass transition temperature epoxy resin system for making composites
EP3199575A1 (fr) 2016-01-29 2017-08-02 Evonik Degussa GmbH Nouvel agent de reticulation d'hetero-diels-alter et son utilisation dans des systemes polymeres a reticulation reversible
WO2018054684A1 (fr) 2016-09-20 2018-03-29 Evonik Degussa Gmbh Nouvel élément réticulé à utiliser dans des systèmes polymères à réticulation réversible
EP3296347A1 (fr) 2016-09-20 2018-03-21 Evonik Degussa GmbH Nouvel élément structural dien à utiliser dans des systèmes polymères de (hétéro)-diels-alder à réticulation réversible
EP3330311B1 (fr) 2016-12-02 2021-05-05 Evonik Operations GmbH Préimprégné de monocomposant polyuréthane stable au stockage et corps moulés ainsi fabriqués à partir de ladite composition de polyuréthane
JP6179685B2 (ja) * 2017-02-14 2017-08-16 山栄化学株式会社 穴埋め用硬化性樹脂組成物
US20190330432A1 (en) 2018-04-27 2019-10-31 Evonik Degussa Gmbh Two-component hybrid matrix system made of polyurethanes and polymethacrylates for the production of short-fibre-reinforced semifinished products

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Also Published As

Publication number Publication date
WO1989004335A1 (fr) 1989-05-18
EP0315090A3 (fr) 1991-01-02
FI893208A0 (fi) 1989-06-30
US4798761A (en) 1989-01-17
DK329489D0 (da) 1989-07-03
EP0315090A2 (fr) 1989-05-10
FI893208A (fi) 1989-06-30
JPH02502101A (ja) 1990-07-12
IL88200A0 (en) 1989-06-30
NZ226771A (en) 1991-09-25
BR8807277A (pt) 1990-03-27

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