DK325875A - Fremgangsmade og anleg til etsning - Google Patents

Fremgangsmade og anleg til etsning

Info

Publication number
DK325875A
DK325875A DK325875A DK325875A DK325875A DK 325875 A DK325875 A DK 325875A DK 325875 A DK325875 A DK 325875A DK 325875 A DK325875 A DK 325875A DK 325875 A DK325875 A DK 325875A
Authority
DK
Denmark
Prior art keywords
procedure
Prior art date
Application number
DK325875A
Other languages
Danish (da)
English (en)
Inventor
R Haas
Original Assignee
Hoellmueller H
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoellmueller H filed Critical Hoellmueller H
Publication of DK325875A publication Critical patent/DK325875A/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DK325875A 1974-07-17 1975-07-17 Fremgangsmade og anleg til etsning DK325875A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2434305A DE2434305C2 (de) 1974-07-17 1974-07-17 Ätzanlage

Publications (1)

Publication Number Publication Date
DK325875A true DK325875A (da) 1976-02-13

Family

ID=5920781

Family Applications (1)

Application Number Title Priority Date Filing Date
DK325875A DK325875A (da) 1974-07-17 1975-07-17 Fremgangsmade og anleg til etsning

Country Status (13)

Country Link
US (1) US4017343A (de)
AT (1) AT335246B (de)
BE (1) BE831361A (de)
BR (1) BR7504517A (de)
CH (1) CH615699A5 (de)
DE (1) DE2434305C2 (de)
DK (1) DK325875A (de)
FR (1) FR2278796A1 (de)
GB (1) GB1514286A (de)
IE (1) IE41425B1 (de)
IT (1) IT1050588B (de)
NL (1) NL7508297A (de)
SE (1) SE426713B (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1050864A (en) * 1973-08-29 1979-03-20 James K. Anderson Apparatus for automatically processing photogravure curvilinear surfaces
FR2354796A1 (fr) * 1976-06-16 1978-01-13 Poudres & Explosifs Ste Nale Procede et dispositif de lavage d'un produit impregne par une substance liquide
JPS5767133A (en) * 1980-10-09 1982-04-23 Nippon Steel Corp Continuous annealing installation having adjusting device for strip surface
US4350597A (en) * 1980-10-31 1982-09-21 Wilson & Company Apparatus and process for treatment of sludge
DE3317040A1 (de) * 1983-05-10 1984-11-15 Hans Höllmüller Maschinenbau GmbH & Co, 7033 Herrenberg Verfahren und vorrichtung zur elektrolytischen regeneration eines aetzmittels
US4911761A (en) * 1984-05-21 1990-03-27 Cfm Technologies Research Associates Process and apparatus for drying surfaces
US4778532A (en) * 1985-06-24 1988-10-18 Cfm Technologies Limited Partnership Process and apparatus for treating wafers with process fluids
US4984597B1 (en) * 1984-05-21 1999-10-26 Cfmt Inc Apparatus for rinsing and drying surfaces
US4654089A (en) * 1985-05-31 1987-03-31 Singelyn Daniel D Counterflow spray rinse process
DE3539886A1 (de) * 1985-11-11 1987-05-14 Hoellmueller Maschbau H Verfahren und vorrichtung zum aetzen eines zumindest teilweise aus metall, vorzugsweise kupfer, bestehenden aetzguts
JP2598305B2 (ja) * 1988-06-06 1997-04-09 日東電工株式会社 半導体ウエハの処理システム
DE3833242A1 (de) * 1988-09-30 1990-04-05 Hoellmueller Maschbau H Verfahren zum aetzen von kupferhaltigen werkstuecken sowie aetzanlage zur durchfuehrung des verfahrens
JPH0296334A (ja) * 1988-10-01 1990-04-09 Nisso Eng Kk 高温エッチング液の循環方法
US4895099A (en) * 1988-11-03 1990-01-23 D.E.M. Controls Of Canada Device for sequential spray application of chemical solutions used in the preparation of circuit board inner layers
US4904339A (en) * 1989-05-26 1990-02-27 Psi Star Vertical spray etch reactor and method
DE3935222A1 (de) * 1989-10-23 1991-04-25 Hoellmueller Maschbau H Aetzanlage sowie verfahren zum aetzen von gegenstaenden
MY107434A (en) * 1989-10-26 1995-12-30 Momentive Performance Mat Jp Cleaning compositions.
US5090432A (en) * 1990-10-16 1992-02-25 Verteq, Inc. Single wafer megasonic semiconductor wafer processing system
DE4110423A1 (de) * 1991-03-29 1992-10-01 Scient Impex Establishment Vorrichtung zur chemischen metallbearbeitung
EP0507006B1 (de) * 1991-04-02 1996-03-13 Unitika Ltd. Verfahren zum Behandeln eines geschmolzenen Salzbades
ATE258084T1 (de) * 1991-10-04 2004-02-15 Cfmt Inc Superreinigung von komplizierten mikroteilchen
US6864570B2 (en) * 1993-12-17 2005-03-08 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
DE4345077C2 (de) * 1993-12-31 1999-09-23 Zibulla & Sohn Gmbh Vorrichtung zum Reinigen und Entfetten der Oberflächen von Blechen
US5720813A (en) 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
US5733378A (en) * 1996-02-26 1998-03-31 Austin American Technology Method for cleaning printed circuit boards
US6039059A (en) * 1996-09-30 2000-03-21 Verteq, Inc. Wafer cleaning system
US6328809B1 (en) 1998-10-09 2001-12-11 Scp Global Technologies, Inc. Vapor drying system and method
WO2010030505A1 (en) * 2008-09-10 2010-03-18 Austin American Technology Corporation Cleaning and testing ionic cleanliness of electronic assemblies
US9406500B2 (en) * 2012-02-08 2016-08-02 Taiwan Semiconductor Manufacturing Company, Ltd. Flux residue cleaning system and method
EP3875638A1 (de) * 2020-03-04 2021-09-08 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Verfahren zum aufbereiten eines fremdmetall- und metallsalz-haltigen mediums aus der leiterplatten- und/oder substrat-herstellung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3082774A (en) * 1961-02-08 1963-03-26 Ct Circuits Inc Etching machine
US3310435A (en) * 1963-11-18 1967-03-21 Dravo Corp Process for continuous pickling of steel strip and regeneration of the contact acid
US3871914A (en) * 1971-10-18 1975-03-18 Chemcut Corp Etchant rinse apparatus

Also Published As

Publication number Publication date
NL7508297A (nl) 1976-01-20
CH615699A5 (de) 1980-02-15
FR2278796A1 (fr) 1976-02-13
BR7504517A (pt) 1976-07-06
US4017343A (en) 1977-04-12
IE41425B1 (en) 1980-01-02
FR2278796B3 (de) 1979-04-27
IE41425L (en) 1976-01-17
BE831361A (fr) 1975-11-03
AT335246B (de) 1977-02-25
IT1050588B (it) 1981-03-20
GB1514286A (en) 1978-06-14
DE2434305A1 (de) 1976-01-29
SE7508065L (sv) 1976-01-19
SE426713B (sv) 1983-02-07
DE2434305C2 (de) 1983-09-29
ATA539075A (de) 1976-06-15

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Legal Events

Date Code Title Description
AHB Application shelved due to non-payment