DK2457685T3 - Fremgangsmåde og apparat til generering af en laserimpuls ved styring af en modulator - Google Patents

Fremgangsmåde og apparat til generering af en laserimpuls ved styring af en modulator Download PDF

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Publication number
DK2457685T3
DK2457685T3 DK11189446.5T DK11189446T DK2457685T3 DK 2457685 T3 DK2457685 T3 DK 2457685T3 DK 11189446 T DK11189446 T DK 11189446T DK 2457685 T3 DK2457685 T3 DK 2457685T3
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Denmark
Prior art keywords
laser pulse
pulse
láser
modulator
output
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DK11189446.5T
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English (en)
Inventor
Krzysztof Nowak
Howard Baker
Roy Mcbride
Jozef Wendland
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Powerphotonic Ltd
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Publication of DK2457685T3 publication Critical patent/DK2457685T3/da

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/13Stabilisation of laser output parameters, e.g. frequency or amplitude
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/11Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on acousto-optical elements, e.g. using variable diffraction by sound or like mechanical waves
    • G02F1/113Circuit or control arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H01S3/0085Modulating the output, i.e. the laser beam is modulated outside the laser cavity

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Nonlinear Science (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Lasers (AREA)
  • Laser Beam Processing (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)

Claims (15)

1. Fremgangsmáde til generering af en laserimpuls af en onsket energi, hvilken fremgangsmáde omfatter folgende trin: (a) tilvejebringelse af en lysstrále ira en laserkilde (1); hvor laserkilden (1) er en carbondioxidlaser, kendetegnet ved, at fremgangsmáden endvidere omfatter: (b) dirigering af lysstrálen via en modulator (3), hvilken modulator kan styres til at modulere strálen til at producere en udgangslaserimpuls; (c) dirigering af en del af udgangslaserimpulsen til en detektor (21) og derved bestemmelse af udgangslaserimpulsens energi og (d) styring af modulatoren (3) for sáledes at afbryde udgangslaserimpulsen, nár den bestemte energi for udgangslaserimpulsen nár en taerskelvaerdi.
2. Fremgangsmáde ifolge krav 1, hvilken fremgangsmáde omfatter det supplerende trin med styring af modulatoren (3) for sáledes at starte udgangslaserimpulsen pá et forhándsbestemt tidspunkt.
3. Fremgangsmáde ifolge krav 1 eller krav 2, hvilken fremgangsmáde endvidere omfatter trinnet med (a) tilvejebringelse af lysstrálen fra laserkilden (1) ved at forsyne laserkilden med et laserstyringssignal af en forhándsbestemt varighed DI, hvilket bevirker, at laserkilden (1) leverer en kildelaserimpuls af tilsvarende varighed, (b) modulering af strálen ved at forsyne modulatoren (3) med et modulatorstyringssignal af en forhándsbestemt varighed D3 svarende til varigheden af en onsket udgangslaserimpuls, hvor D3 er mindre end DI, og (c) tilvejebringelse af en forhándsbestemt forsinkelse D2 mellem laserstyringssignalet og modulatorstyringssignalet, hvor D2 + D3 < DI og D2 er udvalgt, sáledes at modulatorstyringssignalet svarer til en spektralt stabil región af kildelaserimpulsen.
4. Fremgangsmáde ifolge et hvilket som helst af de foregáende krav, hvor fremgangsmáden endvidere omfatter trinnet med omdirigering af en del af udgangslaserimpulsen til en positionsfolende detektor (51) og styring af et strálestyrende spejl (13), der reagerer pá et udgangssignal fra den positionsfolende detektor (51).
5. Fremgangsmáde ifolge et hvilket som helst af de foregáende krav, hvor fremgangsmáden endvidere omfatter trinnet med styring af kavitetslaengden for laserkilden, der reagerer pá en afVigelse af en mált udgangslaserimpulskraft fra en forhándsbestemt onsket udgangslaserimpulskraft.
6. Fremgangsmáde til mikroforarbejdning af et substrat (9), hvilken mikroforarbejdning omfatter generering af en laserimpuls af en onsket energi ved anvendelse af fremgangsmáden ifolge et hvilket som helst af kravene 1 til 5 og lagring af laserimpulsen til det substrat (9), der skal mikroforarbejdes.
7. Apparat til at generere en laserimpuls af en onsket energi, hvilket apparat omfatter: en láser (1) til at levere en lysstrále; hvor laserkilden (1) er en carbondioxidlaser; en modulator (3) til at modulere lysstrálen og producere en udgangslaserimpuls; og kendetegnet ved: en styreenhed (7) konfigureret til at styre modulatoren (3); et optisk element (19) til at dirigere en del af strálen til en detektor (21) og en detektor (21) til at bestemme udgangslaserimpulsens energi og levere et tilsvarende signal til styreenheden (7); hvor styreenheden (7) er konfigureret til at bevirke, at modulatoren (3) afbryder udgangslaserimpulsen, nár signalet indikerer, at den bestemte energi for udgangslaserimpulsen har náet en tccrskclvacrdi.
8. Apparat ifolge krav 7, hvor styreenheden er konfigureret til at afgive: et modulatorstyringssignal til modulatoren for sáledes at starte udgangslaserimpulsen pá et forhándsbestemt tidspunkt, DI; et laserstyringssignal til laseren for sáledes at udsende en forhándsbestemt kildelaserimpuls; et modulatorstyringssignal af en forhándsbestemt varighed D3 svarende til varigheden af en onsket udgangslaserimpuls, hvor D3 er mindre end DI; hvor der er en forhándsbestemt forsinkelse D2 mellem laserstyringssignalet og modulatorstyringssignalet, D2 + D3 < DI, og D2 er udvalgt, sáledes at modulatorstyringssignalet svarer til en spektralt stabil región af kildelaserimpulsen.
9. Apparat ifolge krav 7 eller krav 8, hvor apparatet endvidere omfatter en positionsfolende detektor (51) og én eller Aere optiske komponenter (53, 55) til at omdirigere en del af udgangslaserimpulsen til den positionsfolende detektor (51).
10. Apparat ifolge et hvilket som helst af kravene 7 til 9, hvor apparatet endvidere omfatter et temperaturstyringssystem (107) konfigureret til at styre en kavitetslaengde for laserkilden.
11. Apparat ifolge krav 10, hvor temperaturstyringssystemet (107) er konfigureret til at styre kavitetslaengden for laserkilden, der reagerer pá en afvigelse af en mált udgangslaserimpulskraft fia en forhándsbestemt onsket udgangslaserimpulskraft.
12. Apparat til mikroforarbejdning af et substrat (9), hvilken mikroforarbejdning omfatter et apparat ifulge et hvilket som helst af kravene 7 til 11, der genererer en laserimpuls af en 0nsket energi, og én eller Aere optiske komponenter (13), der er indrettet til at styre laserimpulsen til det substrat, der skal mikroforarbejdes.
13. Apparat ifulge krav 12, hvor apparatet endvidere omfatter et X-Y-translationstrin (23) til modtagelse og translation af substratet (9) i forhold til apparatet.
14. Apparat ifulge krav 13, hvor X-Y-translationstrinnet (9) leverer et signal svarende til en position af substratet (9) til styreenheden (7) og styreenheden (7) er konfigureret til at generere én eller Aere udgangslaserimpulser, der reagerer pá det positionsafhsengige signal.
15. Apparat ifulge et hvilket som helst af kravene 12 til 14, hvor apparatet endvidere omfatter en fokuserende linse (15) og et Z-translationstrin (17) til translation af den fokuserende linse (15) for at muliggure fokusering af laserimpulsen pá substratet (9).
DK11189446.5T 2010-11-30 2011-11-16 Fremgangsmåde og apparat til generering af en laserimpuls ved styring af en modulator DK2457685T3 (da)

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GB1020246.3A GB2485985B (en) 2010-11-30 2010-11-30 Laser pulse generation method and apparatus

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US (1) US9089927B2 (da)
EP (1) EP2457685B1 (da)
DK (1) DK2457685T3 (da)
ES (1) ES2558533T3 (da)
GB (1) GB2485985B (da)

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Publication number Publication date
US9089927B2 (en) 2015-07-28
US20120298650A1 (en) 2012-11-29
ES2558533T3 (es) 2016-02-05
EP2457685B1 (en) 2015-11-04
GB201020246D0 (en) 2011-01-12
GB2485985B (en) 2015-07-22
GB2485985A (en) 2012-06-06
EP2457685A1 (en) 2012-05-30

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