DK2457685T3 - Fremgangsmåde og apparat til generering af en laserimpuls ved styring af en modulator - Google Patents
Fremgangsmåde og apparat til generering af en laserimpuls ved styring af en modulator Download PDFInfo
- Publication number
- DK2457685T3 DK2457685T3 DK11189446.5T DK11189446T DK2457685T3 DK 2457685 T3 DK2457685 T3 DK 2457685T3 DK 11189446 T DK11189446 T DK 11189446T DK 2457685 T3 DK2457685 T3 DK 2457685T3
- Authority
- DK
- Denmark
- Prior art keywords
- laser pulse
- pulse
- láser
- modulator
- output
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/13—Stabilisation of laser output parameters, e.g. frequency or amplitude
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/11—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on acousto-optical elements, e.g. using variable diffraction by sound or like mechanical waves
- G02F1/113—Circuit or control arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
- H01S3/0085—Modulating the output, i.e. the laser beam is modulated outside the laser cavity
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Nonlinear Science (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Lasers (AREA)
- Laser Beam Processing (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Claims (15)
1. Fremgangsmáde til generering af en laserimpuls af en onsket energi, hvilken fremgangsmáde omfatter folgende trin: (a) tilvejebringelse af en lysstrále ira en laserkilde (1); hvor laserkilden (1) er en carbondioxidlaser, kendetegnet ved, at fremgangsmáden endvidere omfatter: (b) dirigering af lysstrálen via en modulator (3), hvilken modulator kan styres til at modulere strálen til at producere en udgangslaserimpuls; (c) dirigering af en del af udgangslaserimpulsen til en detektor (21) og derved bestemmelse af udgangslaserimpulsens energi og (d) styring af modulatoren (3) for sáledes at afbryde udgangslaserimpulsen, nár den bestemte energi for udgangslaserimpulsen nár en taerskelvaerdi.
2. Fremgangsmáde ifolge krav 1, hvilken fremgangsmáde omfatter det supplerende trin med styring af modulatoren (3) for sáledes at starte udgangslaserimpulsen pá et forhándsbestemt tidspunkt.
3. Fremgangsmáde ifolge krav 1 eller krav 2, hvilken fremgangsmáde endvidere omfatter trinnet med (a) tilvejebringelse af lysstrálen fra laserkilden (1) ved at forsyne laserkilden med et laserstyringssignal af en forhándsbestemt varighed DI, hvilket bevirker, at laserkilden (1) leverer en kildelaserimpuls af tilsvarende varighed, (b) modulering af strálen ved at forsyne modulatoren (3) med et modulatorstyringssignal af en forhándsbestemt varighed D3 svarende til varigheden af en onsket udgangslaserimpuls, hvor D3 er mindre end DI, og (c) tilvejebringelse af en forhándsbestemt forsinkelse D2 mellem laserstyringssignalet og modulatorstyringssignalet, hvor D2 + D3 < DI og D2 er udvalgt, sáledes at modulatorstyringssignalet svarer til en spektralt stabil región af kildelaserimpulsen.
4. Fremgangsmáde ifolge et hvilket som helst af de foregáende krav, hvor fremgangsmáden endvidere omfatter trinnet med omdirigering af en del af udgangslaserimpulsen til en positionsfolende detektor (51) og styring af et strálestyrende spejl (13), der reagerer pá et udgangssignal fra den positionsfolende detektor (51).
5. Fremgangsmáde ifolge et hvilket som helst af de foregáende krav, hvor fremgangsmáden endvidere omfatter trinnet med styring af kavitetslaengden for laserkilden, der reagerer pá en afVigelse af en mált udgangslaserimpulskraft fra en forhándsbestemt onsket udgangslaserimpulskraft.
6. Fremgangsmáde til mikroforarbejdning af et substrat (9), hvilken mikroforarbejdning omfatter generering af en laserimpuls af en onsket energi ved anvendelse af fremgangsmáden ifolge et hvilket som helst af kravene 1 til 5 og lagring af laserimpulsen til det substrat (9), der skal mikroforarbejdes.
7. Apparat til at generere en laserimpuls af en onsket energi, hvilket apparat omfatter: en láser (1) til at levere en lysstrále; hvor laserkilden (1) er en carbondioxidlaser; en modulator (3) til at modulere lysstrálen og producere en udgangslaserimpuls; og kendetegnet ved: en styreenhed (7) konfigureret til at styre modulatoren (3); et optisk element (19) til at dirigere en del af strálen til en detektor (21) og en detektor (21) til at bestemme udgangslaserimpulsens energi og levere et tilsvarende signal til styreenheden (7); hvor styreenheden (7) er konfigureret til at bevirke, at modulatoren (3) afbryder udgangslaserimpulsen, nár signalet indikerer, at den bestemte energi for udgangslaserimpulsen har náet en tccrskclvacrdi.
8. Apparat ifolge krav 7, hvor styreenheden er konfigureret til at afgive: et modulatorstyringssignal til modulatoren for sáledes at starte udgangslaserimpulsen pá et forhándsbestemt tidspunkt, DI; et laserstyringssignal til laseren for sáledes at udsende en forhándsbestemt kildelaserimpuls; et modulatorstyringssignal af en forhándsbestemt varighed D3 svarende til varigheden af en onsket udgangslaserimpuls, hvor D3 er mindre end DI; hvor der er en forhándsbestemt forsinkelse D2 mellem laserstyringssignalet og modulatorstyringssignalet, D2 + D3 < DI, og D2 er udvalgt, sáledes at modulatorstyringssignalet svarer til en spektralt stabil región af kildelaserimpulsen.
9. Apparat ifolge krav 7 eller krav 8, hvor apparatet endvidere omfatter en positionsfolende detektor (51) og én eller Aere optiske komponenter (53, 55) til at omdirigere en del af udgangslaserimpulsen til den positionsfolende detektor (51).
10. Apparat ifolge et hvilket som helst af kravene 7 til 9, hvor apparatet endvidere omfatter et temperaturstyringssystem (107) konfigureret til at styre en kavitetslaengde for laserkilden.
11. Apparat ifolge krav 10, hvor temperaturstyringssystemet (107) er konfigureret til at styre kavitetslaengden for laserkilden, der reagerer pá en afvigelse af en mált udgangslaserimpulskraft fia en forhándsbestemt onsket udgangslaserimpulskraft.
12. Apparat til mikroforarbejdning af et substrat (9), hvilken mikroforarbejdning omfatter et apparat ifulge et hvilket som helst af kravene 7 til 11, der genererer en laserimpuls af en 0nsket energi, og én eller Aere optiske komponenter (13), der er indrettet til at styre laserimpulsen til det substrat, der skal mikroforarbejdes.
13. Apparat ifulge krav 12, hvor apparatet endvidere omfatter et X-Y-translationstrin (23) til modtagelse og translation af substratet (9) i forhold til apparatet.
14. Apparat ifulge krav 13, hvor X-Y-translationstrinnet (9) leverer et signal svarende til en position af substratet (9) til styreenheden (7) og styreenheden (7) er konfigureret til at generere én eller Aere udgangslaserimpulser, der reagerer pá det positionsafhsengige signal.
15. Apparat ifulge et hvilket som helst af kravene 12 til 14, hvor apparatet endvidere omfatter en fokuserende linse (15) og et Z-translationstrin (17) til translation af den fokuserende linse (15) for at muliggure fokusering af laserimpulsen pá substratet (9).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1020246.3A GB2485985B (en) | 2010-11-30 | 2010-11-30 | Laser pulse generation method and apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
DK2457685T3 true DK2457685T3 (da) | 2016-01-18 |
Family
ID=43500831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK11189446.5T DK2457685T3 (da) | 2010-11-30 | 2011-11-16 | Fremgangsmåde og apparat til generering af en laserimpuls ved styring af en modulator |
Country Status (5)
Country | Link |
---|---|
US (1) | US9089927B2 (da) |
EP (1) | EP2457685B1 (da) |
DK (1) | DK2457685T3 (da) |
ES (1) | ES2558533T3 (da) |
GB (1) | GB2485985B (da) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9023461B2 (en) | 2010-10-21 | 2015-05-05 | Electro Scientific Industries, Inc. | Apparatus for optically laser marking articles |
FR2991214B1 (fr) | 2012-06-01 | 2014-06-13 | Snecma | Procede de percage d'une piece par impulsions laser |
JP2016013557A (ja) * | 2013-02-13 | 2016-01-28 | 住友化学株式会社 | レーザー光照射装置及び光学部材貼合体の製造装置 |
CN103779776B (zh) * | 2013-10-10 | 2017-01-25 | 中国科学院上海光学精密机械研究所 | 基于电光晶体调谐腔长的种子注入单频脉冲激光器 |
JP6199224B2 (ja) * | 2014-03-31 | 2017-09-20 | ビアメカニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
JP6415357B2 (ja) * | 2015-03-06 | 2018-10-31 | 住友重機械工業株式会社 | レーザ加工装置 |
US10826644B2 (en) * | 2016-02-19 | 2020-11-03 | The Boeing Company | Blocking jamming signals intended to disrupt communications |
CN108057953A (zh) * | 2017-12-13 | 2018-05-22 | 广东正业科技股份有限公司 | 一种激光加工系统及激光能量控制方法 |
GB2569798B (en) * | 2017-12-22 | 2022-02-23 | Powerphotonic Ltd | Improvements in or Relating to Laser Based Machining |
JP6957113B2 (ja) * | 2018-01-30 | 2021-11-02 | 住友重機械工業株式会社 | レーザ制御装置 |
TWI843784B (zh) * | 2019-01-31 | 2024-06-01 | 美商伊雷克托科學工業股份有限公司 | 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4277146A (en) * | 1979-07-19 | 1981-07-07 | The United States Of America As Represented By The Secretary Of The Army | Visible and infrared intensity limiter |
JPS63193130A (ja) * | 1987-02-05 | 1988-08-10 | Canon Inc | 光量制御装置 |
US4949345A (en) * | 1989-06-30 | 1990-08-14 | Microelectronics And Computer Technology Corporation | Method and apparatus for reducing the effect of random polarization on the power/energy output of lasers |
JP3088117B2 (ja) * | 1991-02-21 | 2000-09-18 | エヌイーシーレーザ・オートメーション株式会社 | レーザ加工装置 |
US5353296A (en) * | 1993-07-12 | 1994-10-04 | Coherent, Inc. | Materials processing with a high repetition rate isotopic carbon dioxide laser |
SE517550C2 (sv) * | 2000-04-17 | 2002-06-18 | Micronic Laser Systems Ab | Mönstergenereringssystem användande en spatialljusmodulator |
WO2004107510A2 (en) * | 2003-06-03 | 2004-12-09 | Kilolambda Technologies Ltd. | Laser pulse generator |
US7133187B2 (en) * | 2004-06-07 | 2006-11-07 | Electro Scientific Industries, Inc. | AOM modulation techniques employing plurality of transducers to improve laser system performance |
US7885311B2 (en) * | 2007-03-27 | 2011-02-08 | Imra America, Inc. | Beam stabilized fiber laser |
US7508850B2 (en) * | 2004-09-02 | 2009-03-24 | Coherent, Inc. | Apparatus for modifying CO2 slab laser pulses |
US20110061810A1 (en) * | 2009-09-11 | 2011-03-17 | Applied Materials, Inc. | Apparatus and Methods for Cyclical Oxidation and Etching |
-
2010
- 2010-11-30 GB GB1020246.3A patent/GB2485985B/en active Active
-
2011
- 2011-11-16 ES ES11189446.5T patent/ES2558533T3/es active Active
- 2011-11-16 DK DK11189446.5T patent/DK2457685T3/da active
- 2011-11-16 EP EP11189446.5A patent/EP2457685B1/en active Active
- 2011-11-22 US US13/301,927 patent/US9089927B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US9089927B2 (en) | 2015-07-28 |
US20120298650A1 (en) | 2012-11-29 |
ES2558533T3 (es) | 2016-02-05 |
EP2457685B1 (en) | 2015-11-04 |
GB201020246D0 (en) | 2011-01-12 |
GB2485985B (en) | 2015-07-22 |
GB2485985A (en) | 2012-06-06 |
EP2457685A1 (en) | 2012-05-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DK2457685T3 (da) | Fremgangsmåde og apparat til generering af en laserimpuls ved styring af en modulator | |
KR101604742B1 (ko) | 시드 레이저 모드 안정화 시스템 및 방법 | |
JP5373814B2 (ja) | Euv光源用の駆動レーザ | |
US20150014286A1 (en) | Co2 laser with rapid power control | |
JP4677392B2 (ja) | パルスレーザ熱処理装置とその制御方法 | |
US8634441B2 (en) | Master oscillator, laser system, and laser light generation method | |
JP2007531314A (ja) | パルス高パワーファイバ増幅器システムを制御し保護するための方法と装置。 | |
US20160087389A1 (en) | Laser system, extreme ultraviolet light generation system, and method of controlling laser apparatus | |
US9832854B2 (en) | Systems and methods for stabilization of droplet-plasma interaction via laser energy modulation | |
JP2003272892A (ja) | X線発生方法およびx線発生装置 | |
US9980359B2 (en) | Systems and methods for controlling EUV energy generation using pulse intensity | |
AU2018235246B2 (en) | Laser device for material processing | |
KR20160127461A (ko) | 레이저 가공 장치 및 그 가공방법 | |
EP3769381A1 (en) | Controlling laser beam parameters by crystal shifting | |
US20230098272A1 (en) | Method and apparatus for pulsed laser beam control in laser shock peening process | |
JP2015153917A (ja) | レーザ加工装置 | |
JP2007251015A (ja) | レーザアニール装置及びレーザアニール方法 | |
JP5995767B2 (ja) | レーザ加工装置及びレーザ加工方法 | |
JP6713203B2 (ja) | レーザ加工装置 | |
Mielke et al. | Pulse width stabilization for ultrafast laser systems | |
JP4977726B2 (ja) | レーザ加工装置 | |
US20240017350A1 (en) | Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same | |
WO2022230045A1 (ja) | レーザ装置およびレーザ加工装置 | |
WO2023227277A1 (en) | Pulsed lasers and methods of operation | |
JP2004228222A (ja) | レーザ装置 |