DK195987A - Fremgangsmaade til fremstilling af en aniosotropt ledende elastomer og anvendelse af denne - Google Patents
Fremgangsmaade til fremstilling af en aniosotropt ledende elastomer og anvendelse af denneInfo
- Publication number
- DK195987A DK195987A DK195987A DK195987A DK195987A DK 195987 A DK195987 A DK 195987A DK 195987 A DK195987 A DK 195987A DK 195987 A DK195987 A DK 195987A DK 195987 A DK195987 A DK 195987A
- Authority
- DK
- Denmark
- Prior art keywords
- aniosotropective
- elastomes
- preparing
- procedure
- preparing aniosotropective
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H10W90/00—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0281—Conductive fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0235—Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires
-
- H10W72/01—
-
- H10W72/60—
-
- H10W90/721—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/853,313 US4778950A (en) | 1985-07-22 | 1986-04-17 | Anisotropic elastomeric interconnecting system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DK195987D0 DK195987D0 (da) | 1987-04-15 |
| DK195987A true DK195987A (da) | 1987-10-18 |
Family
ID=25315701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK195987A DK195987A (da) | 1986-04-17 | 1987-04-15 | Fremgangsmaade til fremstilling af en aniosotropt ledende elastomer og anvendelse af denne |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US4778950A (enExample) |
| EP (1) | EP0242303B1 (enExample) |
| JP (1) | JPS6313287A (enExample) |
| AU (1) | AU594141B2 (enExample) |
| CA (1) | CA1277380C (enExample) |
| DE (1) | DE3787987T2 (enExample) |
| DK (1) | DK195987A (enExample) |
| FI (1) | FI871636A7 (enExample) |
Families Citing this family (73)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4954873A (en) * | 1985-07-22 | 1990-09-04 | Digital Equipment Corporation | Electrical connector for surface mounting |
| US4754546A (en) * | 1985-07-22 | 1988-07-05 | Digital Equipment Corporation | Electrical connector for surface mounting and method of making thereof |
| EP0312802A3 (en) * | 1987-09-24 | 1990-10-10 | Elastomeric Technologies, Inc. | Self-mounted chip carrier |
| EP0332560B1 (en) * | 1988-03-11 | 1994-03-02 | International Business Machines Corporation | Elastomeric connectors for electronic packaging and testing |
| US5213715A (en) * | 1989-04-17 | 1993-05-25 | Western Digital Corporation | Directionally conductive polymer |
| US5147519A (en) * | 1990-07-27 | 1992-09-15 | Motorola, Inc. | Method of manufacturing elastomers containing fine line conductors |
| US5528466A (en) * | 1991-11-12 | 1996-06-18 | Sunright Limited | Assembly for mounting and cooling a plurality of integrated circuit chips using elastomeric connectors and a lid |
| JP2545675B2 (ja) * | 1992-07-17 | 1996-10-23 | 信越ポリマー株式会社 | エラスチックコネクタの製造方法 |
| US5791654A (en) * | 1992-08-19 | 1998-08-11 | The Boeing Company | Corrosion resistant gasket in combination with aircraft antenna |
| US6454276B2 (en) * | 1992-08-19 | 2002-09-24 | The Boeing Company | Corrosion resistant gasket for aircraft |
| US5371654A (en) * | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
| US20050062492A1 (en) * | 2001-08-03 | 2005-03-24 | Beaman Brian Samuel | High density integrated circuit apparatus, test probe and methods of use thereof |
| US5811982A (en) * | 1995-11-27 | 1998-09-22 | International Business Machines Corporation | High density cantilevered probe for electronic devices |
| US5810607A (en) * | 1995-09-13 | 1998-09-22 | International Business Machines Corporation | Interconnector with contact pads having enhanced durability |
| US5441690A (en) * | 1993-07-06 | 1995-08-15 | International Business Machines Corporation | Process of making pinless connector |
| JP3578232B2 (ja) * | 1994-04-07 | 2004-10-20 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 電気接点形成方法、該電気接点を含むプローブ構造および装置 |
| US5599193A (en) * | 1994-08-23 | 1997-02-04 | Augat Inc. | Resilient electrical interconnect |
| US5949029A (en) * | 1994-08-23 | 1999-09-07 | Thomas & Betts International, Inc. | Conductive elastomers and methods for fabricating the same |
| JPH10506459A (ja) * | 1994-09-09 | 1998-06-23 | マイクロモジュール・システムズ | 回路のメンブレンプローブ |
| JPH10505162A (ja) * | 1994-09-09 | 1998-05-19 | マイクロモジュール・システムズ | 回路のメンブレンプローブ |
| US5506753A (en) * | 1994-09-26 | 1996-04-09 | International Business Machines Corporation | Method and apparatus for a stress relieved electronic module |
| WO1996013967A1 (en) * | 1994-10-28 | 1996-05-09 | Micromodule Systems | Programmable high density electronic testing device |
| MY112945A (en) * | 1994-12-20 | 2001-10-31 | Ibm | Electronic devices comprising dielectric foamed polymers |
| US5785538A (en) * | 1995-11-27 | 1998-07-28 | International Business Machines Corporation | High density test probe with rigid surface structure |
| US5807767A (en) * | 1996-01-02 | 1998-09-15 | Micron Technology, Inc. | Technique for attaching die to leads |
| JP2908747B2 (ja) * | 1996-01-10 | 1999-06-21 | 三菱電機株式会社 | Icソケット |
| US5890915A (en) * | 1996-05-17 | 1999-04-06 | Minnesota Mining And Manufacturing Company | Electrical and thermal conducting structure with resilient conducting paths |
| US6403226B1 (en) | 1996-05-17 | 2002-06-11 | 3M Innovative Properties Company | Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance |
| JP3420435B2 (ja) * | 1996-07-09 | 2003-06-23 | 松下電器産業株式会社 | 基板の製造方法、半導体装置及び半導体装置の製造方法 |
| WO1998007041A1 (fr) * | 1996-08-09 | 1998-02-19 | Advantest Corporation | Appareil d'essai de dispositifs a semi-conducteur |
| US6046091A (en) | 1997-06-10 | 2000-04-04 | Usf Filtration And Seperations Group, Inc. | Capacitor and method of making |
| WO1998057341A1 (en) * | 1997-06-10 | 1998-12-17 | Usf Filtration And Separations Group, Inc. | Capacitor and method of making |
| JP2001024150A (ja) * | 1999-07-06 | 2001-01-26 | Sony Corp | 半導体装置 |
| JP2003110237A (ja) * | 2001-09-28 | 2003-04-11 | Shinko Electric Ind Co Ltd | 多層配線基板及び多層半導体装置 |
| US7017260B2 (en) * | 2002-01-08 | 2006-03-28 | Weiss Roger E | Method of making an elastomeric conductive sheet |
| KR20040074120A (ko) * | 2002-01-15 | 2004-08-21 | 트라이보텍, 인크. | 다중 접촉식 직조형 커넥터 |
| US6945790B2 (en) * | 2002-01-15 | 2005-09-20 | Tribotek, Inc. | Multiple-contact cable connector assemblies |
| US7083427B2 (en) * | 2002-01-15 | 2006-08-01 | Tribotek, Inc. | Woven multiple-contact connectors |
| US6951465B2 (en) * | 2002-01-15 | 2005-10-04 | Tribotek, Inc. | Multiple-contact woven power connectors |
| US7056139B2 (en) * | 2002-01-15 | 2006-06-06 | Tribotek, Inc. | Electrical connector |
| US7077662B2 (en) * | 2002-01-15 | 2006-07-18 | Tribotek, Inc. | Contact woven connectors |
| US20040214454A1 (en) * | 2002-01-15 | 2004-10-28 | Tribotek, Inc. | Method and apparatus for manufacturing woven connectors |
| JP4023166B2 (ja) * | 2002-01-25 | 2007-12-19 | ソニー株式会社 | 高周波モジュール用基板及び高周波モジュール |
| AU2003220941A1 (en) * | 2002-03-20 | 2003-09-29 | J.S.T. Mfg. Co., Ltd. | Flexible good conductive layer and anisotropic conductive sheet comprising same |
| US20050221645A1 (en) * | 2002-03-20 | 2005-10-06 | Miki Hasegawa | Anisotropically conductive block and its manufacturing method |
| TWI244658B (en) * | 2002-03-20 | 2005-12-01 | J S T Mfg Co Ltd | Anisotropic conducting plate and its manufacturing method |
| US7190180B2 (en) * | 2003-01-17 | 2007-03-13 | Jsr Corporation | Anisotropic conductive connector and production method therefor and inspection unit for circuit device |
| US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
| TWI239684B (en) * | 2003-04-16 | 2005-09-11 | Jsr Corp | Anisotropic conductive connector and electric inspection device for circuit device |
| JP2007529089A (ja) * | 2003-07-11 | 2007-10-18 | トライボテック,インコーポレイテッド | 多接点織成電気スイッチ |
| US7097495B2 (en) * | 2003-07-14 | 2006-08-29 | Tribotek, Inc. | System and methods for connecting electrical components |
| US7417197B2 (en) * | 2003-09-19 | 2008-08-26 | Medconx, Inc. | Direct contact power transfer pad and method of making same |
| JP2005259475A (ja) * | 2004-03-10 | 2005-09-22 | Jst Mfg Co Ltd | 異方導電性シート |
| US7130185B2 (en) * | 2004-06-02 | 2006-10-31 | Research In Motion Limited | Handheld computing device having drop-resistant LCD display |
| US7140916B2 (en) * | 2005-03-15 | 2006-11-28 | Tribotek, Inc. | Electrical connector having one or more electrical contact points |
| US7214106B2 (en) * | 2005-07-18 | 2007-05-08 | Tribotek, Inc. | Electrical connector |
| US20070159753A1 (en) * | 2006-01-09 | 2007-07-12 | Randall Michael S | System for EMI/RFI filtering and transient voltage suppression |
| TWI377624B (en) * | 2008-05-13 | 2012-11-21 | Ind Tech Res Inst | Conducting film structure, fabrication method thereof, and conducting film type probe device for ic |
| TWI399812B (zh) * | 2008-12-29 | 2013-06-21 | Ind Tech Res Inst | 導電膜結構及其製法與導電膜式積體電路針測裝置 |
| JP4709329B2 (ja) * | 2009-01-15 | 2011-06-22 | 株式会社コバック | 金属等メッシュ接点及びスイッチ、並びにその製造方法 |
| US8098079B2 (en) | 2009-04-17 | 2012-01-17 | Oracle America, Inc. | Receive circuit for connectors with variable complex impedance |
| US8476749B2 (en) | 2009-07-22 | 2013-07-02 | Oracle America, Inc. | High-bandwidth ramp-stack chip package |
| JP5931447B2 (ja) * | 2012-01-11 | 2016-06-08 | 三菱航空機株式会社 | 航空機の窓、航空機、航空機の窓の組立方法。 |
| WO2015033622A1 (ja) * | 2013-09-04 | 2015-03-12 | オリンパスメディカルシステムズ株式会社 | 超音波振動子及び超音波内視鏡 |
| US9435855B2 (en) | 2013-11-19 | 2016-09-06 | Teradyne, Inc. | Interconnect for transmitting signals between a device and a tester |
| US9594114B2 (en) | 2014-06-26 | 2017-03-14 | Teradyne, Inc. | Structure for transmitting signals in an application space between a device under test and test electronics |
| CN107689332B (zh) * | 2014-10-15 | 2019-07-26 | 申宇慈 | 导线柱体集成体、功能性柱体及其集成体、以及功能性基板 |
| KR20160046977A (ko) * | 2014-10-20 | 2016-05-02 | 삼성디스플레이 주식회사 | 이방성 도전입자 |
| US9977052B2 (en) | 2016-10-04 | 2018-05-22 | Teradyne, Inc. | Test fixture |
| CN110582895B (zh) * | 2017-05-18 | 2022-01-14 | 信越聚合物株式会社 | 电连接器及其制造方法 |
| US10677815B2 (en) | 2018-06-08 | 2020-06-09 | Teradyne, Inc. | Test system having distributed resources |
| US11363746B2 (en) | 2019-09-06 | 2022-06-14 | Teradyne, Inc. | EMI shielding for a signal trace |
| US11862901B2 (en) | 2020-12-15 | 2024-01-02 | Teradyne, Inc. | Interposer |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1289300B (de) * | 1967-02-23 | 1969-02-13 | Rost & Co H | Gewebeeinlage fuer einen Foerdergurt oder Treibriemen |
| GB1387587A (en) * | 1971-07-22 | 1975-03-19 | Plessey Co Ltd | Electrical interconnectors and connector assemblies |
| US3982320A (en) * | 1975-02-05 | 1976-09-28 | Technical Wire Products, Inc. | Method of making electrically conductive connector |
| US4003621A (en) * | 1975-06-16 | 1977-01-18 | Technical Wire Products, Inc. | Electrical connector employing conductive rectilinear elements |
| JPS5265892A (en) * | 1975-11-26 | 1977-05-31 | Shinetsu Polymer Co | Nonnisotropic conductiveesheet type composite materials and method of manufacture thereof |
| JPS5915376B2 (ja) * | 1977-10-18 | 1984-04-09 | 信越ポリマ−株式会社 | 電子回路部品 |
| JPS5482699A (en) * | 1977-12-15 | 1979-07-02 | Shinetsu Polymer Co | Pressure sensitive resistance element |
| JPS5555985U (enExample) * | 1978-10-12 | 1980-04-16 | ||
| US4252391A (en) * | 1979-06-19 | 1981-02-24 | Shin-Etsu Polymer Co., Ltd. | Anisotropically pressure-sensitive electroconductive composite sheets and method for the preparation thereof |
| JPS568081U (enExample) * | 1979-06-29 | 1981-01-23 | ||
| JPS6038809B2 (ja) * | 1979-11-20 | 1985-09-03 | 信越ポリマ−株式会社 | 異方導電性を有するエラスチツク構造体の製造方法 |
| US4449774A (en) * | 1981-02-05 | 1984-05-22 | Shin-Etsu Polymer Co., Ltd. | Electroconductive rubbery member and elastic connector therewith |
| NL8303447A (nl) * | 1983-10-07 | 1985-05-01 | Philips Nv | Werkwijze voor het maken van meerlaags condensatoren. |
-
1986
- 1986-04-17 US US06/853,313 patent/US4778950A/en not_active Expired - Lifetime
-
1987
- 1987-04-14 FI FI871636A patent/FI871636A7/fi not_active Application Discontinuation
- 1987-04-15 DK DK195987A patent/DK195987A/da not_active Application Discontinuation
- 1987-04-16 DE DE3787987T patent/DE3787987T2/de not_active Expired - Fee Related
- 1987-04-16 AU AU71600/87A patent/AU594141B2/en not_active Ceased
- 1987-04-16 EP EP87400879A patent/EP0242303B1/en not_active Expired - Lifetime
- 1987-04-16 CA CA000534923A patent/CA1277380C/en not_active Expired - Lifetime
- 1987-04-17 JP JP62095015A patent/JPS6313287A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| DE3787987T2 (de) | 1994-05-19 |
| EP0242303B1 (en) | 1993-11-03 |
| AU7160087A (en) | 1987-10-22 |
| EP0242303A3 (en) | 1989-10-18 |
| US4778950A (en) | 1988-10-18 |
| EP0242303A2 (en) | 1987-10-21 |
| FI871636A0 (fi) | 1987-04-14 |
| FI871636A7 (fi) | 1987-10-18 |
| DK195987D0 (da) | 1987-04-15 |
| CA1277380C (en) | 1990-12-04 |
| AU594141B2 (en) | 1990-03-01 |
| JPS6313287A (ja) | 1988-01-20 |
| JPH02830B2 (enExample) | 1990-01-09 |
| DE3787987D1 (de) | 1993-12-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AHB | Application shelved due to non-payment |