DK1815514T3 - Et flowfordelingsmodul og en stabel flowfordelingsmoduler - Google Patents

Et flowfordelingsmodul og en stabel flowfordelingsmoduler

Info

Publication number
DK1815514T3
DK1815514T3 DK05803997T DK05803997T DK1815514T3 DK 1815514 T3 DK1815514 T3 DK 1815514T3 DK 05803997 T DK05803997 T DK 05803997T DK 05803997 T DK05803997 T DK 05803997T DK 1815514 T3 DK1815514 T3 DK 1815514T3
Authority
DK
Denmark
Prior art keywords
flow distribution
distribution module
cooling
stack
cooling unit
Prior art date
Application number
DK05803997T
Other languages
English (en)
Inventor
Klaus Kristen Olesen
Original Assignee
Danfoss Silicon Power Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danfoss Silicon Power Gmbh filed Critical Danfoss Silicon Power Gmbh
Application granted granted Critical
Publication of DK1815514T3 publication Critical patent/DK1815514T3/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • External Artificial Organs (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DK05803997T 2004-11-24 2005-11-22 Et flowfordelingsmodul og en stabel flowfordelingsmoduler DK1815514T3 (da)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DKPA200401832 2004-11-24
DKPA200501196 2005-08-29
PCT/DK2005/000746 WO2006056199A1 (en) 2004-11-24 2005-11-22 A flow distribution module and a stack of flow distribution modules

Publications (1)

Publication Number Publication Date
DK1815514T3 true DK1815514T3 (da) 2008-08-25

Family

ID=36000853

Family Applications (1)

Application Number Title Priority Date Filing Date
DK05803997T DK1815514T3 (da) 2004-11-24 2005-11-22 Et flowfordelingsmodul og en stabel flowfordelingsmoduler

Country Status (6)

Country Link
US (1) US7835151B2 (da)
EP (2) EP1965424A3 (da)
AT (1) ATE393475T1 (da)
DE (1) DE602005006310T2 (da)
DK (1) DK1815514T3 (da)
WO (1) WO2006056199A1 (da)

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Also Published As

Publication number Publication date
DE602005006310T2 (de) 2009-05-20
EP1965424A2 (en) 2008-09-03
US7835151B2 (en) 2010-11-16
WO2006056199A1 (en) 2006-06-01
EP1815514A1 (en) 2007-08-08
EP1965424A3 (en) 2011-06-29
EP1815514B1 (en) 2008-04-23
US20090146293A1 (en) 2009-06-11
ATE393475T1 (de) 2008-05-15
DE602005006310D1 (de) 2008-06-05

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