ATE393475T1 - Strömungsverteilungsmodul und stapel von strömungsverteilungsmodulen - Google Patents

Strömungsverteilungsmodul und stapel von strömungsverteilungsmodulen

Info

Publication number
ATE393475T1
ATE393475T1 AT05803997T AT05803997T ATE393475T1 AT E393475 T1 ATE393475 T1 AT E393475T1 AT 05803997 T AT05803997 T AT 05803997T AT 05803997 T AT05803997 T AT 05803997T AT E393475 T1 ATE393475 T1 AT E393475T1
Authority
AT
Austria
Prior art keywords
flow distribution
modules
stack
cooling
module
Prior art date
Application number
AT05803997T
Other languages
English (en)
Inventor
Klaus Olesen
Original Assignee
Danfoss Silicon Power Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danfoss Silicon Power Gmbh filed Critical Danfoss Silicon Power Gmbh
Application granted granted Critical
Publication of ATE393475T1 publication Critical patent/ATE393475T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • External Artificial Organs (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AT05803997T 2004-11-24 2005-11-22 Strömungsverteilungsmodul und stapel von strömungsverteilungsmodulen ATE393475T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DKPA200401832 2004-11-24
DKPA200501196 2005-08-29

Publications (1)

Publication Number Publication Date
ATE393475T1 true ATE393475T1 (de) 2008-05-15

Family

ID=36000853

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05803997T ATE393475T1 (de) 2004-11-24 2005-11-22 Strömungsverteilungsmodul und stapel von strömungsverteilungsmodulen

Country Status (6)

Country Link
US (1) US7835151B2 (de)
EP (2) EP1965424A3 (de)
AT (1) ATE393475T1 (de)
DE (1) DE602005006310T2 (de)
DK (1) DK1815514T3 (de)
WO (1) WO2006056199A1 (de)

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007013520B4 (de) * 2007-03-21 2011-05-05 Rittal Gmbh & Co. Kg Anordnung zum Führen von Kühlmittel für einen Schaltschrank oder ein Rack Schaltschrank oder Rack damit und Anreihanordnung mit mindestens zwei solchen Schaltschränken oder Racks
US7608924B2 (en) 2007-05-03 2009-10-27 Delphi Technologies, Inc. Liquid cooled power electronic circuit comprising stacked direct die cooled packages
JP4967988B2 (ja) * 2007-10-25 2012-07-04 株式会社豊田自動織機 半導体冷却装置
JP4819071B2 (ja) * 2008-02-06 2011-11-16 本田技研工業株式会社 電気車両及び車両用ｄｃ／ｄｃコンバータの冷却方法
DE102008021898B4 (de) * 2008-05-02 2015-10-01 Siemens Aktiengesellschaft Detektionseinrichtung mit einer Vorrichtung zur Kühlung
EP2272311B1 (de) * 2008-05-02 2016-10-26 Danfoss Silicon Power GmbH Kühlvorrichtung für eine mehrzahl von leistungsmodulen
CN101713618B (zh) 2008-10-03 2012-03-21 丹佛斯传动有限公司 流量分配器组件及带流量分配器组件的冷却单元
US8059404B2 (en) * 2008-10-09 2011-11-15 GM Global Technology Operations LLC Power inverters
US7952875B2 (en) * 2009-05-29 2011-05-31 GM Global Technology Operations LLC Stacked busbar assembly with integrated cooling
US8488315B2 (en) * 2009-08-18 2013-07-16 GM Global Technology Operations LLC Power module assemblies with staggered coolant channels
CN102870211B (zh) * 2010-04-13 2015-12-16 丹福斯矽电有限责任公司 流分布器
US8279597B2 (en) 2010-05-27 2012-10-02 International Business Machines Corporation Heatsink allowing in-situ maintenance in a stackable module
US8174826B2 (en) 2010-05-27 2012-05-08 International Business Machines Corporation Liquid cooling system for stackable modules in energy-efficient computing systems
US8179674B2 (en) 2010-05-28 2012-05-15 International Business Machines Corporation Scalable space-optimized and energy-efficient computing system
US8358503B2 (en) 2010-05-28 2013-01-22 International Business Machines Corporation Stackable module for energy-efficient computing systems
JP5206822B2 (ja) * 2010-07-09 2013-06-12 株式会社デンソー 半導体装置
WO2012051704A1 (en) 2010-10-19 2012-04-26 Electronic Motion Systems Holdings Limited A power module for converting dc to ac
KR101209686B1 (ko) * 2010-12-03 2012-12-10 기아자동차주식회사 하이브리드 및 전기 자동차용 전기장치의 냉각장치
US8427832B2 (en) * 2011-01-05 2013-04-23 Toyota Motor Engineering & Manufacturing North America, Inc. Cold plate assemblies and power electronics modules
US8897013B2 (en) * 2011-02-17 2014-11-25 Lear Corporation Sealed battery charger housing
US8391008B2 (en) * 2011-02-17 2013-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
US8482919B2 (en) * 2011-04-11 2013-07-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics card assemblies, power electronics modules, and power electronics devices
DE102011100543A1 (de) 2011-05-05 2012-11-08 Semikron Elektronik Gmbh & Co. Kg Leistungselektronische Anordnung mit Flüssigkeitskühlung
DE102011100524B4 (de) * 2011-05-05 2016-06-09 Semikron Elektronik Gmbh & Co. Kg Leistungselektronische Anordnung
DE102011100526A1 (de) 2011-05-05 2012-11-08 Semikron Elektronik Gmbh & Co. Kg Leistungselektronische Anordnung mit Flüssigkeitskühlung
DE202011100820U1 (de) 2011-05-17 2011-12-01 Ixys Semiconductor Gmbh Leistungshalbleiter
FR2978538B1 (fr) * 2011-07-25 2015-06-19 Valeo Systemes Thermiques Plaque d'echangeur de chaleur.
CN103023279B (zh) * 2011-09-27 2015-05-13 株式会社京浜 半导体控制装置
US9048721B2 (en) * 2011-09-27 2015-06-02 Keihin Corporation Semiconductor device
US9186088B2 (en) 2011-09-29 2015-11-17 Siemens Aktiengesellschaft Active catheter reconstruction for interventional magnetic resonance imaging
FI20116054L (fi) * 2011-10-26 2013-04-27 John Deere Forestry Oy Menetelmä energiansyötön järjestämiseksi ja energiansyöttölaite
DE102012206264A1 (de) * 2012-04-17 2013-10-17 Semikron Elektronik Gmbh & Co. Kg Anreihbares flüssigkeitsgekühltes Leistungshalbleitermodul und Anordnung hiermit
DE102012206271A1 (de) 2012-04-17 2013-10-17 Semikron Elektronik Gmbh & Co. Kg Flüssigkeitsgekühlte Anordnung mit anreihbaren Leistungshalbleitermodulen und mindestens einer Kondensatoreinrichtung und Leistungshalbleitermodul hierzu
EP2719985B1 (de) * 2012-10-09 2015-08-26 Danfoss Silicon Power GmbH Durchflussverteilungsmodul mit einer gemusterten Deckplatte
CN104247010B (zh) * 2012-10-29 2017-06-20 富士电机株式会社 半导体装置
US8643173B1 (en) 2013-01-04 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features
US9693479B2 (en) * 2013-03-14 2017-06-27 Hewlett Packard Enterprise Development Lp Support member
US9042100B2 (en) * 2013-03-14 2015-05-26 Aavid Thermalloy, Llc System and method for cooling heat generating components
US9449895B2 (en) * 2013-05-03 2016-09-20 Infineon Technologies Ag Cooling system for molded modules and corresponding manufacturing methods
JP2014222745A (ja) * 2013-05-14 2014-11-27 富士通株式会社 冷却構造体、基板ユニット、システム基板体及び電子機器
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
CN104617085B (zh) * 2013-11-04 2017-10-27 江苏宏微科技股份有限公司 叠加组装式功率模块
JP6233257B2 (ja) * 2014-04-15 2017-11-22 トヨタ自動車株式会社 電力変換器
CN103957681B (zh) * 2014-04-28 2016-06-22 中国船舶重工集团公司第七二三研究所 一种等流体分配的电子设备冷却装置
US9613885B2 (en) 2015-03-03 2017-04-04 Infineon Technologies Ag Plastic cooler for semiconductor modules
US9538691B2 (en) 2015-04-15 2017-01-03 Ford Global Technologies, Llc Power inverter for a vehicle
US9919608B2 (en) 2015-04-15 2018-03-20 Ford Global Technologies, Llc Power-module assembly for a vehicle
US10000126B2 (en) 2015-04-15 2018-06-19 Ford Global Technologies, Llc Power-module assembly and method
US10123465B2 (en) 2015-04-15 2018-11-06 Ford Global Technologies, Llc Power-module assembly
US10448543B2 (en) * 2015-05-04 2019-10-15 Google Llc Cooling electronic devices in a data center
WO2016203884A1 (ja) * 2015-06-17 2016-12-22 富士電機株式会社 パワー半導体モジュール、流路部材及びパワー半導体モジュール構造体
US10014794B2 (en) 2015-07-28 2018-07-03 Ford Global Technologies, Llc Power inverter assembly for a vehicle
US10137798B2 (en) * 2015-08-04 2018-11-27 Ford Global Technologies, Llc Busbars for a power module assembly
US10037977B2 (en) 2015-08-19 2018-07-31 Ford Global Technologies, Llc Power electronics system
US9847275B2 (en) 2015-12-21 2017-12-19 International Business Machines Corporation Distribution and stabilization of fluid flow for interlayer chip cooling
US9941189B2 (en) 2015-12-21 2018-04-10 International Business Machines Corporation Counter-flow expanding channels for enhanced two-phase heat removal
EP3206468B1 (de) * 2016-02-15 2018-12-26 Siemens Aktiengesellschaft Umrichter mit gleichspannungszwischenkreis
US9961808B2 (en) * 2016-03-09 2018-05-01 Ford Global Technologies, Llc Power electronics system
US9950628B2 (en) * 2016-03-09 2018-04-24 Ford Global Technologies, Llc Power-module assembly with dummy module
US10017073B2 (en) 2016-03-09 2018-07-10 Ford Global Technologies, Llc Coolant channels for power module assemblies
US9867319B2 (en) 2016-05-24 2018-01-09 Ford Global Technologies, Llc Vehicle power module assemblies and manifolds
US9847734B1 (en) * 2016-05-24 2017-12-19 Ford Global Technologies, Llc Power-module assembly
US10492343B2 (en) * 2016-08-23 2019-11-26 Ford Global Technologies, Llc Vehicle power module assembly with cooling
JP6596398B2 (ja) * 2016-08-29 2019-10-23 本田技研工業株式会社 電力変換装置
US10178800B2 (en) * 2017-03-30 2019-01-08 Honeywell International Inc. Support structure for electronics having fluid passageway for convective heat transfer
US10453777B2 (en) * 2018-01-30 2019-10-22 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics assemblies with cio bonding layers and double sided cooling, and vehicles incorporating the same
US11317546B2 (en) * 2018-06-26 2022-04-26 Ford Global Technologies, Llc Vehicle power module assembly
US10533809B1 (en) 2018-07-06 2020-01-14 Keysight Technologies, Inc. Cooling apparatus and methods of use
US10874037B1 (en) 2019-09-23 2020-12-22 Ford Global Technologies, Llc Power-module assembly with cooling arrangement
DE102019214728A1 (de) 2019-09-26 2021-04-01 Robert Bosch Gmbh Kühlsystem und Kühlanordnung
DE102019214724A1 (de) * 2019-09-26 2021-04-01 Robert Bosch Gmbh Elektronikmodul und Kühlanordnung
EP3833171B1 (de) * 2019-12-06 2023-12-27 Delta Electronics, Inc. Kühlsystem für leistungsmodule
US11502349B2 (en) 2020-08-31 2022-11-15 Borgwarner, Inc. Cooling manifold assembly
US11920877B2 (en) * 2021-11-18 2024-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. 3D printed cold plates and methods for cooling power devices embedded in 3D printed circuit boards

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3648113A (en) * 1970-10-22 1972-03-07 Singer Co Electronic assembly having cooling means for stacked modules
US4186422A (en) * 1978-08-01 1980-01-29 The Singer Company Modular electronic system with cooling means and stackable electronic circuit unit therefor
DE3133485A1 (de) * 1980-09-15 1982-05-06 Peter 2563 Ipsach Herren Fluessigkeitsgekuehlte elektrische baugruppe
US4631573A (en) * 1985-05-24 1986-12-23 Sundstrand Corporation Cooled stack of electrically isolated semiconductors
US4841355A (en) * 1988-02-10 1989-06-20 Amdahl Corporation Three-dimensional microelectronic package for semiconductor chips
US4956746A (en) * 1989-03-29 1990-09-11 Hughes Aircraft Company Stacked wafer electronic package
US5053856A (en) * 1990-09-04 1991-10-01 Sun Microsystems, Inc. Apparatus for providing electrical conduits in compact arrays of electronic circuitry utilizing cooling devices
US5270571A (en) * 1991-10-30 1993-12-14 Amdahl Corporation Three-dimensional package for semiconductor devices
US5469331A (en) * 1994-04-07 1995-11-21 Conway; Harry E. Cooling system for modular power supply device
US5546274A (en) * 1995-03-10 1996-08-13 Sun Microsystems, Inc. Three-dimensional compact array of electronic circuitry
DE19514545A1 (de) 1995-04-20 1996-10-24 Daimler Benz Ag Anordnung von mehreren mit elektronischen Bauelementen versehenen Mikrokühleinrichtungen
JPH10259742A (ja) 1997-03-19 1998-09-29 Unisia Jecs Corp アクセル操作量検出装置
FR2765067B1 (fr) * 1997-06-19 1999-07-16 Alsthom Cge Alcatel Module d'electronique de puissance et un dispositif d'electronique de puissance pourvu de tels modules
ES2267254T3 (es) 1998-08-18 2007-03-01 Hamamatsu Photonics K.K. Disipador de calor y dispositivo laser semiconductor y pila de laser de semiconductor que usa un disipador de calor.
US6257320B1 (en) 2000-03-28 2001-07-10 Alec Wargo Heat sink device for power semiconductors
EP2234154B1 (de) * 2000-04-19 2016-03-30 Denso Corporation Kühlmittelgekühlte Halbleiteranordnung
WO2002055942A2 (en) 2000-06-08 2002-07-18 Mikros Manufacturing, Inc. Normal-flow heat exchanger
JP4608763B2 (ja) 2000-11-09 2011-01-12 日本電気株式会社 半導体装置
US6828675B2 (en) * 2001-09-26 2004-12-07 Modine Manufacturing Company Modular cooling system and thermal bus for high power electronics cabinets
DK174881B1 (da) 2002-05-08 2004-01-19 Danfoss Silicon Power Gmbh Anordning med flere køleceller til køling af halvledere
JP2004095599A (ja) 2002-08-29 2004-03-25 Denso Corp 積層冷却器
JP4089595B2 (ja) 2002-12-16 2008-05-28 株式会社デンソー 冷媒冷却型両面冷却半導体装置
US7030486B1 (en) * 2003-05-29 2006-04-18 Marshall Paul N High density integrated circuit package architecture
FR2855912B1 (fr) 2003-06-04 2006-04-14 Alstom Cellule de commutation de puissance, et procede de fabrication de la cellule
US7245493B2 (en) 2003-08-06 2007-07-17 Denso Corporation Cooler for cooling electric part
EP2216890B1 (de) 2003-08-21 2012-01-04 Denso Corporation Montagestruktur eines Halbleiterbausteins
DK176137B1 (da) * 2003-10-27 2006-09-25 Danfoss Silicon Power Gmbh Flowfordelingsenhed og köleenhed med bypassflow
DE102004057526B4 (de) 2003-12-03 2020-08-20 Denso Corporation Stapelkühler
DE102004059963A1 (de) 2003-12-18 2005-08-11 Denso Corp., Kariya Einfach zusammengesetzter Kühler
JP2005191082A (ja) 2003-12-24 2005-07-14 Toyota Motor Corp 電気機器の冷却装置
JP2005332863A (ja) 2004-05-18 2005-12-02 Denso Corp パワースタック
US8125781B2 (en) 2004-11-11 2012-02-28 Denso Corporation Semiconductor device

Also Published As

Publication number Publication date
DE602005006310D1 (de) 2008-06-05
EP1815514A1 (de) 2007-08-08
WO2006056199A1 (en) 2006-06-01
US7835151B2 (en) 2010-11-16
DK1815514T3 (da) 2008-08-25
DE602005006310T2 (de) 2009-05-20
EP1815514B1 (de) 2008-04-23
EP1965424A3 (de) 2011-06-29
EP1965424A2 (de) 2008-09-03
US20090146293A1 (en) 2009-06-11

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