DK1258990T3 - Fremgangsmåde og system til afstemning på waferniveau af akustiske volumenbölgeresonatorer og -filtre - Google Patents
Fremgangsmåde og system til afstemning på waferniveau af akustiske volumenbölgeresonatorer og -filtreInfo
- Publication number
- DK1258990T3 DK1258990T3 DK02008098T DK02008098T DK1258990T3 DK 1258990 T3 DK1258990 T3 DK 1258990T3 DK 02008098 T DK02008098 T DK 02008098T DK 02008098 T DK02008098 T DK 02008098T DK 1258990 T3 DK1258990 T3 DK 1258990T3
- Authority
- DK
- Denmark
- Prior art keywords
- filters
- wafer level
- wave resonators
- tuning method
- acoustic volume
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
- H03H2003/0414—Resonance frequency
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
- H03H2003/0414—Resonance frequency
- H03H2003/0478—Resonance frequency in a process for mass production
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/844,264 US6441702B1 (en) | 2001-04-27 | 2001-04-27 | Method and system for wafer-level tuning of bulk acoustic wave resonators and filters |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK1258990T3 true DK1258990T3 (da) | 2008-03-17 |
Family
ID=25292248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK02008098T DK1258990T3 (da) | 2001-04-27 | 2002-04-11 | Fremgangsmåde og system til afstemning på waferniveau af akustiske volumenbölgeresonatorer og -filtre |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6441702B1 (fr) |
| EP (1) | EP1258990B1 (fr) |
| JP (1) | JP4171241B2 (fr) |
| DK (1) | DK1258990T3 (fr) |
Families Citing this family (53)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19947081A1 (de) * | 1999-09-30 | 2001-04-05 | Infineon Technologies Ag | Akustischer Spiegel und Verfahren zu dessen Herstellung |
| GB0012439D0 (en) * | 2000-05-24 | 2000-07-12 | Univ Cranfield | Improvements to filters |
| US20020074897A1 (en) * | 2000-12-15 | 2002-06-20 | Qing Ma | Micro-electromechanical structure resonator frequency adjustment using radient energy trimming and laser/focused ion beam assisted deposition |
| US6601276B2 (en) * | 2001-05-11 | 2003-08-05 | Agere Systems Inc. | Method for self alignment of patterned layers in thin film acoustic devices |
| DE50112976D1 (de) * | 2001-05-22 | 2007-10-18 | Infineon Technologies Ag | Verfahren zur herstellung einer schicht mit einem vordefinierten schichtdickenprofil |
| US7275292B2 (en) * | 2003-03-07 | 2007-10-02 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Method for fabricating an acoustical resonator on a substrate |
| US20040227578A1 (en) * | 2003-05-14 | 2004-11-18 | Miikka Hamalainen | Acoustic resonance-based frequency synthesizer using at least one bulk acoustic wave (BAW) or thin film bulk acoustic wave (FBAR) device |
| US7262070B2 (en) | 2003-09-29 | 2007-08-28 | Intel Corporation | Method to make a weight compensating/tuning layer on a substrate |
| KR100568284B1 (ko) * | 2003-12-09 | 2006-04-05 | 삼성전기주식회사 | Ｆｂａｒ 소자의 주파수 튜닝 방법 및 이를 포함한 제조방법 |
| US7114252B2 (en) * | 2004-06-17 | 2006-10-03 | Toko, Inc. | Large scale simultaneous circuit encapsulating apparatus |
| US20060017352A1 (en) * | 2004-07-20 | 2006-01-26 | Aram Tanielian | Thin device and method of fabrication |
| US7388454B2 (en) | 2004-10-01 | 2008-06-17 | Avago Technologies Wireless Ip Pte Ltd | Acoustic resonator performance enhancement using alternating frame structure |
| US8981876B2 (en) | 2004-11-15 | 2015-03-17 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Piezoelectric resonator structures and electrical filters having frame elements |
| US7202560B2 (en) | 2004-12-15 | 2007-04-10 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Wafer bonding of micro-electro mechanical systems to active circuitry |
| US7791434B2 (en) | 2004-12-22 | 2010-09-07 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic resonator performance enhancement using selective metal etch and having a trench in the piezoelectric |
| US7369013B2 (en) | 2005-04-06 | 2008-05-06 | Avago Technologies Wireless Ip Pte Ltd | Acoustic resonator performance enhancement using filled recessed region |
| US7868522B2 (en) * | 2005-09-09 | 2011-01-11 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Adjusted frequency temperature coefficient resonator |
| US7737807B2 (en) * | 2005-10-18 | 2010-06-15 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic galvanic isolator incorporating series-connected decoupled stacked bulk acoustic resonators |
| US7675390B2 (en) | 2005-10-18 | 2010-03-09 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic galvanic isolator incorporating single decoupled stacked bulk acoustic resonator |
| US7463499B2 (en) | 2005-10-31 | 2008-12-09 | Avago Technologies General Ip (Singapore) Pte Ltd. | AC-DC power converter |
| US20070139140A1 (en) * | 2005-12-20 | 2007-06-21 | Rao Valluri R | Frequency tuning of film bulk acoustic resonators (FBAR) |
| US7746677B2 (en) | 2006-03-09 | 2010-06-29 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | AC-DC converter circuit and power supply |
| US20070210748A1 (en) * | 2006-03-09 | 2007-09-13 | Mark Unkrich | Power supply and electronic device having integrated power supply |
| US7479685B2 (en) | 2006-03-10 | 2009-01-20 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Electronic device on substrate with cavity and mitigated parasitic leakage path |
| JP4797772B2 (ja) * | 2006-04-20 | 2011-10-19 | パナソニック電工株式会社 | Ｂａｗ共振器 |
| JP5036215B2 (ja) * | 2006-05-19 | 2012-09-26 | 日本碍子株式会社 | 圧電薄膜共振子及び圧電薄膜共振子の共振周波数の調整方法 |
| US7791435B2 (en) | 2007-09-28 | 2010-09-07 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Single stack coupled resonators having differential output |
| DE102008003820B4 (de) * | 2008-01-10 | 2013-01-17 | Epcos Ag | Frontendschaltung |
| US7855618B2 (en) | 2008-04-30 | 2010-12-21 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Bulk acoustic resonator electrical impedance transformers |
| US7732977B2 (en) | 2008-04-30 | 2010-06-08 | Avago Technologies Wireless Ip (Singapore) | Transceiver circuit for film bulk acoustic resonator (FBAR) transducers |
| JP2009296265A (ja) * | 2008-06-04 | 2009-12-17 | Japan Radio Co Ltd | 弾性表面波デバイスの中心周波数調整方法及び弾性表面波デバイスの製造方法並びに弾性表面波デバイス。 |
| WO2010061479A1 (fr) * | 2008-11-28 | 2010-06-03 | 富士通株式会社 | Dispositif à ondes élastiques et son procédé de fabrication |
| US8902023B2 (en) | 2009-06-24 | 2014-12-02 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator structure having an electrode with a cantilevered portion |
| US8248185B2 (en) | 2009-06-24 | 2012-08-21 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic resonator structure comprising a bridge |
| US8193877B2 (en) | 2009-11-30 | 2012-06-05 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Duplexer with negative phase shifting circuit |
| JP5617523B2 (ja) * | 2009-12-08 | 2014-11-05 | 株式会社村田製作所 | 積層型圧電薄膜フィルタの製造方法 |
| US9243316B2 (en) | 2010-01-22 | 2016-01-26 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Method of fabricating piezoelectric material with selected c-axis orientation |
| US8796904B2 (en) | 2011-10-31 | 2014-08-05 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Bulk acoustic resonator comprising piezoelectric layer and inverse piezoelectric layer |
| US8962443B2 (en) | 2011-01-31 | 2015-02-24 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Semiconductor device having an airbridge and method of fabricating the same |
| US9154112B2 (en) | 2011-02-28 | 2015-10-06 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Coupled resonator filter comprising a bridge |
| US9083302B2 (en) | 2011-02-28 | 2015-07-14 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Stacked bulk acoustic resonator comprising a bridge and an acoustic reflector along a perimeter of the resonator |
| US9148117B2 (en) | 2011-02-28 | 2015-09-29 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Coupled resonator filter comprising a bridge and frame elements |
| US9136818B2 (en) | 2011-02-28 | 2015-09-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Stacked acoustic resonator comprising a bridge |
| US9425764B2 (en) | 2012-10-25 | 2016-08-23 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Accoustic resonator having composite electrodes with integrated lateral features |
| US9048812B2 (en) | 2011-02-28 | 2015-06-02 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Bulk acoustic wave resonator comprising bridge formed within piezoelectric layer |
| US9203374B2 (en) | 2011-02-28 | 2015-12-01 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Film bulk acoustic resonator comprising a bridge |
| US8575820B2 (en) | 2011-03-29 | 2013-11-05 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Stacked bulk acoustic resonator |
| US9444426B2 (en) | 2012-10-25 | 2016-09-13 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Accoustic resonator having integrated lateral feature and temperature compensation feature |
| US8350445B1 (en) | 2011-06-16 | 2013-01-08 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Bulk acoustic resonator comprising non-piezoelectric layer and bridge |
| US8922302B2 (en) | 2011-08-24 | 2014-12-30 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator formed on a pedestal |
| US10135415B2 (en) * | 2015-12-18 | 2018-11-20 | Texas Instruments Incorporated | Method to reduce frequency distribution of bulk acoustic wave resonators during manufacturing |
| CH716605A1 (fr) * | 2019-09-16 | 2021-03-31 | Richemont Int Sa | Procédé de fabrication d'une pluralité de résonateurs sur une plaquette. |
| CN113810014A (zh) * | 2021-09-23 | 2021-12-17 | 武汉敏声新技术有限公司 | 叉指型体声波谐振器及滤波器 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1566009A1 (de) * | 1967-08-26 | 1971-02-18 | Telefunken Patent | Mechanisches Frequenzfilter und Verfahren zu seiner Herstellung |
| JPS60170312A (ja) * | 1984-02-14 | 1985-09-03 | Matsushima Kogyo Co Ltd | 圧電発振片の製造方法 |
| US4638536A (en) * | 1986-01-17 | 1987-01-27 | The United States Of America As Represented By The Secretary Of The Army | Method of making a resonator having a desired frequency from a quartz crystal resonator plate |
| JPH0316308A (ja) * | 1989-06-13 | 1991-01-24 | Murata Mfg Co Ltd | 圧電共振子の製造方法 |
| US5382930A (en) * | 1992-12-21 | 1995-01-17 | Trw Inc. | Monolithic multipole filters made of thin film stacked crystal filters |
| US6051907A (en) * | 1996-10-10 | 2000-04-18 | Nokia Mobile Phones Limited | Method for performing on-wafer tuning of thin film bulk acoustic wave resonators (FBARS) |
| US5894647A (en) * | 1997-06-30 | 1999-04-20 | Tfr Technologies, Inc. | Method for fabricating piezoelectric resonators and product |
| US6081171A (en) | 1998-04-08 | 2000-06-27 | Nokia Mobile Phones Limited | Monolithic filters utilizing thin film bulk acoustic wave devices and minimum passive components for controlling the shape and width of a passband response |
| US6339276B1 (en) * | 1999-11-01 | 2002-01-15 | Agere Systems Guardian Corp. | Incremental tuning process for electrical resonators based on mechanical motion |
| US6307447B1 (en) * | 1999-11-01 | 2001-10-23 | Agere Systems Guardian Corp. | Tuning mechanical resonators for electrical filter |
-
2001
- 2001-04-27 US US09/844,264 patent/US6441702B1/en not_active Expired - Fee Related
-
2002
- 2002-04-11 EP EP02008098A patent/EP1258990B1/fr not_active Expired - Lifetime
- 2002-04-11 DK DK02008098T patent/DK1258990T3/da active
- 2002-04-26 JP JP2002126693A patent/JP4171241B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1258990A3 (fr) | 2004-02-04 |
| US6441702B1 (en) | 2002-08-27 |
| EP1258990A2 (fr) | 2002-11-20 |
| JP4171241B2 (ja) | 2008-10-22 |
| EP1258990B1 (fr) | 2007-11-21 |
| JP2003050584A (ja) | 2003-02-21 |
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