DK1049819T3 - Anordning til elektroplettering af forbiførte metalark, især til trykte kredsløb, ved slutning af et elektrisk kredsløb mellem arkene og et flydende reaktionsprodukt - Google Patents

Anordning til elektroplettering af forbiførte metalark, især til trykte kredsløb, ved slutning af et elektrisk kredsløb mellem arkene og et flydende reaktionsprodukt

Info

Publication number
DK1049819T3
DK1049819T3 DK98902183T DK98902183T DK1049819T3 DK 1049819 T3 DK1049819 T3 DK 1049819T3 DK 98902183 T DK98902183 T DK 98902183T DK 98902183 T DK98902183 T DK 98902183T DK 1049819 T3 DK1049819 T3 DK 1049819T3
Authority
DK
Denmark
Prior art keywords
sheets
electroplating
printed circuits
reaction product
electrical circuit
Prior art date
Application number
DK98902183T
Other languages
Danish (da)
English (en)
Inventor
Francesco Occleppo
Original Assignee
Occleppo Di Francesco Occleppo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Occleppo Di Francesco Occleppo filed Critical Occleppo Di Francesco Occleppo
Application granted granted Critical
Publication of DK1049819T3 publication Critical patent/DK1049819T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Paints Or Removers (AREA)
DK98902183T 1998-01-19 1998-02-11 Anordning til elektroplettering af forbiførte metalark, især til trykte kredsløb, ved slutning af et elektrisk kredsløb mellem arkene og et flydende reaktionsprodukt DK1049819T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT98MI000080A IT1298150B1 (it) 1998-01-19 1998-01-19 Dispositivo per la deposizione elettrolitica su lastre metalliche traslanti in specie per circuiti stampati, mediante la chiusura di un
PCT/IT1998/000021 WO1999036598A1 (fr) 1998-01-19 1998-02-11 Dispositif de revetement electrolytique de plaques metalliques en translation, en particulier de circuits imprimes, par fermeture d'un circuit electrique entre les plaques et un produit reactif liquide

Publications (1)

Publication Number Publication Date
DK1049819T3 true DK1049819T3 (da) 2002-04-15

Family

ID=11378616

Family Applications (1)

Application Number Title Priority Date Filing Date
DK98902183T DK1049819T3 (da) 1998-01-19 1998-02-11 Anordning til elektroplettering af forbiførte metalark, især til trykte kredsløb, ved slutning af et elektrisk kredsløb mellem arkene og et flydende reaktionsprodukt

Country Status (10)

Country Link
US (1) US6485620B1 (fr)
EP (1) EP1049819B1 (fr)
AT (1) ATE211188T1 (fr)
AU (1) AU5878698A (fr)
DE (1) DE69803098T2 (fr)
DK (1) DK1049819T3 (fr)
ES (1) ES2169496T3 (fr)
HK (1) HK1033840A1 (fr)
IT (1) IT1298150B1 (fr)
WO (1) WO1999036598A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0005883D0 (en) * 2000-03-13 2000-05-03 Lowe John M Electro-plating apparatus and a method of electoplating
DE102009057463A1 (de) 2009-12-03 2011-06-09 Hübel, Egon Verfahren und Vorrichtung zum elektrischen Kontaktieren von Gut in Durchlaufanlagen
KR101441532B1 (ko) * 2012-05-10 2014-09-17 주식회사 잉크테크 연속 도금 장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4421624A (en) * 1980-03-25 1983-12-20 Hitachi Shipbuilding & Engineering Co., Ltd. Apparatus for continuously processing a band-shape material
US4394241A (en) * 1981-06-25 1983-07-19 Napco, Inc. High speed plating of flat planar workpieces
US4377461A (en) * 1981-09-23 1983-03-22 Napco, Inc. Tab plater for circuit boards or the like
DE3603856C2 (de) * 1986-02-07 1994-05-05 Bosch Gmbh Robert Verfahren und Vorrichtung zur Galvanisierung von ebenen Werkstücken wie Leiterplatten
DE19717512C3 (de) * 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating

Also Published As

Publication number Publication date
ITMI980080A1 (it) 1999-07-19
DE69803098D1 (de) 2002-01-31
ES2169496T3 (es) 2002-07-01
IT1298150B1 (it) 1999-12-20
DE69803098T2 (de) 2002-07-18
ATE211188T1 (de) 2002-01-15
US6485620B1 (en) 2002-11-26
EP1049819B1 (fr) 2001-12-19
EP1049819A1 (fr) 2000-11-08
HK1033840A1 (en) 2001-09-28
WO1999036598A1 (fr) 1999-07-22
AU5878698A (en) 1999-08-02

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