HK1033840A1 - Device for electroplating on translating metal sheets, especially for printed circuits, by closure of an electric circuit between the sheets and a liquid reactant product - Google Patents

Device for electroplating on translating metal sheets, especially for printed circuits, by closure of an electric circuit between the sheets and a liquid reactant product

Info

Publication number
HK1033840A1
HK1033840A1 HK01103243A HK01103243A HK1033840A1 HK 1033840 A1 HK1033840 A1 HK 1033840A1 HK 01103243 A HK01103243 A HK 01103243A HK 01103243 A HK01103243 A HK 01103243A HK 1033840 A1 HK1033840 A1 HK 1033840A1
Authority
HK
Hong Kong
Prior art keywords
sheets
electroplating
closure
electric circuit
printed circuits
Prior art date
Application number
HK01103243A
Inventor
Francesco Occleppo
Original Assignee
Occleppo Di Francesco Occleppo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Occleppo Di Francesco Occleppo filed Critical Occleppo Di Francesco Occleppo
Publication of HK1033840A1 publication Critical patent/HK1033840A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Paints Or Removers (AREA)

Abstract

Device (60) having one or more operative units (55) for electroplating a film by chemical reaction with a specially made liquid product (29) and application of direct current, on sheets (50) for printed circuits continuously translating between one or more pairs of opposing oblong chambers (210, 130) respectively supplied with tubular nozzles (231) and with one longitudinal slit nozzle (233) and having internal electrodes (220, 240) electrically connected to the negative pole of a generator of direct current, between one or more pairs of titanium contact rollers (61-62, 130-131), electrically connected to the positive pole of the current, and plastic containment rollers (100-101, 110-111) of the liquid (29) rotating in each pair reciprocally in opposite directions, due to closure of the electric circuit between the liquid product (29), pumped in under pressure by the pump and projected by the nozzles (213, 233) of the chambers (210, 230) against the sheets (50), and said sheets through the contact rollers.
HK01103243A 1998-01-19 2001-05-08 Device for electroplating on translating metal sheets, especially for printed circuits, by closure of an electric circuit between the sheets and a liquid reactant product HK1033840A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT98MI000080A IT1298150B1 (en) 1998-01-19 1998-01-19 DEVICE FOR ELECTROLYTIC DEPOSITION ON TRANSLATING METALLIC SHEETS IN SPECIES FOR PRINTED CIRCUITS, BY CLOSING A
PCT/IT1998/000021 WO1999036598A1 (en) 1998-01-19 1998-02-11 Device for electroplating on translating metal sheets, especially for printed circuits, by closure of an electric circuit between the sheets and a liquid reactant product

Publications (1)

Publication Number Publication Date
HK1033840A1 true HK1033840A1 (en) 2001-09-28

Family

ID=11378616

Family Applications (1)

Application Number Title Priority Date Filing Date
HK01103243A HK1033840A1 (en) 1998-01-19 2001-05-08 Device for electroplating on translating metal sheets, especially for printed circuits, by closure of an electric circuit between the sheets and a liquid reactant product

Country Status (10)

Country Link
US (1) US6485620B1 (en)
EP (1) EP1049819B1 (en)
AT (1) ATE211188T1 (en)
AU (1) AU5878698A (en)
DE (1) DE69803098T2 (en)
DK (1) DK1049819T3 (en)
ES (1) ES2169496T3 (en)
HK (1) HK1033840A1 (en)
IT (1) IT1298150B1 (en)
WO (1) WO1999036598A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0005883D0 (en) * 2000-03-13 2000-05-03 Lowe John M Electro-plating apparatus and a method of electoplating
DE102009057463A1 (en) 2009-12-03 2011-06-09 Hübel, Egon Method for electrochemical treatment of goods as section, comprises conveying the goods in transport direction with mutual distance as a gap through continuous flow system by means of rotating or moving transport and/or contact means
KR101441532B1 (en) * 2012-05-10 2014-09-17 주식회사 잉크테크 Continuous plating apparatus

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4421624A (en) * 1980-03-25 1983-12-20 Hitachi Shipbuilding & Engineering Co., Ltd. Apparatus for continuously processing a band-shape material
US4394241A (en) * 1981-06-25 1983-07-19 Napco, Inc. High speed plating of flat planar workpieces
US4377461A (en) * 1981-09-23 1983-03-22 Napco, Inc. Tab plater for circuit boards or the like
DE3603856C2 (en) * 1986-02-07 1994-05-05 Bosch Gmbh Robert Method and device for galvanizing flat workpieces such as printed circuit boards
DE19717512C3 (en) * 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Device for electroplating circuit boards under constant conditions in continuous systems
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating

Also Published As

Publication number Publication date
EP1049819B1 (en) 2001-12-19
ITMI980080A1 (en) 1999-07-19
DE69803098T2 (en) 2002-07-18
DK1049819T3 (en) 2002-04-15
WO1999036598A1 (en) 1999-07-22
EP1049819A1 (en) 2000-11-08
US6485620B1 (en) 2002-11-26
ES2169496T3 (en) 2002-07-01
DE69803098D1 (en) 2002-01-31
ATE211188T1 (en) 2002-01-15
AU5878698A (en) 1999-08-02
IT1298150B1 (en) 1999-12-20

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20100211