DK0708926T3 - Adapter med legeme af massivt materiale. - Google Patents
Adapter med legeme af massivt materiale.Info
- Publication number
- DK0708926T3 DK0708926T3 DK94922259.0T DK94922259T DK0708926T3 DK 0708926 T3 DK0708926 T3 DK 0708926T3 DK 94922259 T DK94922259 T DK 94922259T DK 0708926 T3 DK0708926 T3 DK 0708926T3
- Authority
- DK
- Denmark
- Prior art keywords
- adapter
- solid material
- solid
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4323276A DE4323276A1 (de) | 1993-07-12 | 1993-07-12 | Vollmaterialadapter |
Publications (1)
Publication Number | Publication Date |
---|---|
DK0708926T3 true DK0708926T3 (da) | 1997-09-01 |
Family
ID=6492596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK94922259.0T DK0708926T3 (da) | 1993-07-12 | 1994-07-05 | Adapter med legeme af massivt materiale. |
Country Status (8)
Country | Link |
---|---|
US (1) | US5977786A (da) |
EP (1) | EP0708926B1 (da) |
JP (1) | JPH09503578A (da) |
CA (1) | CA2167062C (da) |
DE (2) | DE4323276A1 (da) |
DK (1) | DK0708926T3 (da) |
ES (1) | ES2100729T3 (da) |
WO (1) | WO1995002829A1 (da) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW360790B (en) * | 1996-10-28 | 1999-06-11 | Atg Test Systems Gmbh | Printed circuit board test apparatus and method |
DE19644725C1 (de) * | 1996-10-28 | 1998-04-02 | Atg Test Systems Gmbh | Vorrichtung und Verfahren zum Prüfen von Leiterplatten |
DE19939955A1 (de) * | 1999-08-23 | 2001-03-01 | Atg Test Systems Gmbh | Prüfnadel für einen Rasteranpassungsadapter einer Vorrichtung zum Testen von Leiterplatten |
DE10043726C2 (de) * | 2000-09-05 | 2003-12-04 | Atg Test Systems Gmbh | Verfahren zum Prüfen von Leiterplatten mit einem Paralleltester und eine Vorrichtung zum Ausführen des Verfahrens |
DE10043728C2 (de) * | 2000-09-05 | 2003-12-04 | Atg Test Systems Gmbh | Verfahren zum Prüfen von Leiterplatten und Verwendung einer Vorrichtung zum Ausführen des Verfahrens |
EP1233272A1 (de) * | 2001-02-19 | 2002-08-21 | MANIA GmbH & Co. | Verfahren zur Herstellung eines Vollmaterialadapters aus einem mit Licht aushärtbaren Photopolymer |
US20090267631A1 (en) * | 2008-04-24 | 2009-10-29 | Honeywell International Inc. | Large Component Thermal Head Adapter |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1508884A (en) * | 1975-05-17 | 1978-04-26 | Int Computers Ltd | Apparatus for testing printed circuit board assemblies |
SU813330A1 (ru) * | 1977-07-18 | 1981-03-15 | Завод "Калибр" Минского Производст-Венного Объединения Имени B.И.Ленина | Зондовое устройство |
US4322682A (en) * | 1979-05-21 | 1982-03-30 | Everett/Charles Inc. | Vacuum actuated test head having programming plate |
US4352061A (en) * | 1979-05-24 | 1982-09-28 | Fairchild Camera & Instrument Corp. | Universal test fixture employing interchangeable wired personalizers |
DE3316103C2 (de) * | 1983-05-03 | 1991-12-12 | Nixdorf Computer Ag, 4790 Paderborn | Prüfnadel für ein Prüfgerät zum Prüfen von Leiterplatten |
DE3343274A1 (de) * | 1983-11-30 | 1985-06-05 | Feinmetall Gmbh, 7033 Herrenberg | Kontaktiervorrichtung |
SU1206711A1 (ru) * | 1983-12-20 | 1986-01-23 | Таганрогский радиотехнический институт им.В.Д.Калмыкова | Способ изготовлени зондовых головок |
DE8501493U1 (de) * | 1985-01-22 | 1986-08-14 | Feinmetall Gmbh, 7033 Herrenberg | Prüfadapter |
DE3678825D1 (de) * | 1985-11-01 | 1991-05-23 | Hewlett Packard Co | Halterung fuer leiterplattentest. |
DE3539720A1 (de) * | 1985-11-08 | 1987-05-14 | Martin Maelzer | Adapter fuer ein leiterplattenpruefgeraet |
DE3702184A1 (de) * | 1986-01-27 | 1987-07-30 | Feinmetall Gmbh | Pruefeinrichtung zur wafer-pruefung |
US4841241A (en) * | 1986-08-07 | 1989-06-20 | Siemens Aktiengesellschaft | Testing device for both-sided contacting of component-equipped printed circuit boards |
DE3630548A1 (de) * | 1986-09-08 | 1988-03-10 | Mania Gmbh | Vorrichtung zum elektronischen pruefen von leiterplatten mit kontaktpunkten im 1/20 zoll-raster |
DE3638372A1 (de) * | 1986-11-11 | 1988-05-26 | Lang Dahlke Helmut | Vorrichtung zum pruefen von elektrischen leiterplatten |
DE3736689A1 (de) * | 1986-11-18 | 1988-05-26 | Luther Erich | Adapter fuer ein leiterplattenpruefgeraet |
DE3639360A1 (de) * | 1986-11-18 | 1988-05-19 | Luther Erich | Pruefstift fuer einen adapter zum verbinden von im raster befindlichen pruefkontakten eines leiterplattenpruefgeraetes mit in und/oder ausser raster befindlichen pruefpunkten eines prueflings |
DE3801222C2 (de) * | 1988-01-18 | 1996-11-14 | Siemens Ag | Kontaktiereinrichtung für Prüfzwecke, insbesondere zur Prüfung von Halbleiterbausteinen |
DE3806793A1 (de) * | 1988-02-29 | 1989-09-07 | Siemens Ag | Adaptereinrichtung fuer eine vorrichtung zum pruefen von leiterplatten |
CH676898A5 (da) * | 1988-09-02 | 1991-03-15 | Microcontact Ag | |
DE4011434A1 (de) * | 1990-04-09 | 1991-10-10 | Atg Electronic Gmbh | Verfahren und vorrichtung zum bohren und/oder bestuecken der fuehrungsplatten eines pruefadapters |
US5043656A (en) * | 1990-06-20 | 1991-08-27 | Clark Oren S | Electrical test probe |
US5351002A (en) * | 1990-08-20 | 1994-09-27 | Snap-On Incorporated | Test probe |
DE9014236U1 (de) * | 1990-10-13 | 1990-12-20 | Feinmetall Gmbh, 7033 Herrenberg | Kontaktiervorrichtung für die elektrische Verbindung einer Prüfeinrichtung mit einem Prüfling |
GB9103191D0 (en) * | 1991-02-14 | 1991-04-03 | Dow Corning | Platinum complexes and use thereof |
US5159265A (en) * | 1991-09-19 | 1992-10-27 | Motorola, Inc. | Pivotable spring contact |
US5175493A (en) * | 1991-10-11 | 1992-12-29 | Interconnect Devices, Inc. | Shielded electrical contact spring probe assembly |
US5493230A (en) * | 1994-02-25 | 1996-02-20 | Everett Charles Technologies, Inc. | Retention of test probes in translator fixtures |
-
1993
- 1993-07-12 DE DE4323276A patent/DE4323276A1/de not_active Withdrawn
-
1994
- 1994-07-05 DK DK94922259.0T patent/DK0708926T3/da active
- 1994-07-05 EP EP94922259A patent/EP0708926B1/de not_active Expired - Lifetime
- 1994-07-05 US US08/591,554 patent/US5977786A/en not_active Expired - Fee Related
- 1994-07-05 ES ES94922259T patent/ES2100729T3/es not_active Expired - Lifetime
- 1994-07-05 WO PCT/EP1994/002198 patent/WO1995002829A1/de active IP Right Grant
- 1994-07-05 DE DE59401837T patent/DE59401837D1/de not_active Expired - Fee Related
- 1994-07-05 JP JP7504323A patent/JPH09503578A/ja active Pending
- 1994-07-05 CA CA002167062A patent/CA2167062C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA2167062C (en) | 2000-02-15 |
US5977786A (en) | 1999-11-02 |
EP0708926A1 (de) | 1996-05-01 |
WO1995002829A1 (de) | 1995-01-26 |
DE59401837D1 (de) | 1997-03-27 |
EP0708926B1 (de) | 1997-02-19 |
CA2167062A1 (en) | 1995-01-26 |
DE4323276A1 (de) | 1995-01-19 |
ES2100729T3 (es) | 1997-06-16 |
JPH09503578A (ja) | 1997-04-08 |
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