DK0662719T3 - Apparat og fremgangsmåde til forbedring af gennemslagsspændingsrobusthed i halvlederindretninger - Google Patents

Apparat og fremgangsmåde til forbedring af gennemslagsspændingsrobusthed i halvlederindretninger

Info

Publication number
DK0662719T3
DK0662719T3 DK94120629T DK94120629T DK0662719T3 DK 0662719 T3 DK0662719 T3 DK 0662719T3 DK 94120629 T DK94120629 T DK 94120629T DK 94120629 T DK94120629 T DK 94120629T DK 0662719 T3 DK0662719 T3 DK 0662719T3
Authority
DK
Denmark
Prior art keywords
semiconductor devices
breakdown voltage
voltage resistance
improving breakdown
improving
Prior art date
Application number
DK94120629T
Other languages
English (en)
Inventor
Victor Albert Keith Temple
Stephen Daley Arthur
Donald Leland Watrous
John Manning Savidge Neilson
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Application granted granted Critical
Publication of DK0662719T3 publication Critical patent/DK0662719T3/da

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/739Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
    • H01L29/7393Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
    • H01L29/7395Vertical transistors, e.g. vertical IGBT
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Bipolar Transistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Thyristors (AREA)
DK94120629T 1993-12-27 1994-12-23 Apparat og fremgangsmåde til forbedring af gennemslagsspændingsrobusthed i halvlederindretninger DK0662719T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/173,077 US5424563A (en) 1993-12-27 1993-12-27 Apparatus and method for increasing breakdown voltage ruggedness in semiconductor devices

Publications (1)

Publication Number Publication Date
DK0662719T3 true DK0662719T3 (da) 2001-10-29

Family

ID=22630442

Family Applications (1)

Application Number Title Priority Date Filing Date
DK94120629T DK0662719T3 (da) 1993-12-27 1994-12-23 Apparat og fremgangsmåde til forbedring af gennemslagsspændingsrobusthed i halvlederindretninger

Country Status (7)

Country Link
US (1) US5424563A (da)
EP (1) EP0662719B1 (da)
JP (1) JPH07254613A (da)
KR (1) KR950021508A (da)
CA (1) CA2139072A1 (da)
DE (1) DE69427683T2 (da)
DK (1) DK0662719T3 (da)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3495847B2 (ja) * 1995-09-11 2004-02-09 シャープ株式会社 サイリスタを備える半導体集積回路
KR19990024988A (ko) * 1997-09-09 1999-04-06 윤종용 반절연 폴리실리콘막을 이용한 전력 반도체장치의 제조방법
JP2001085463A (ja) * 1999-09-09 2001-03-30 Rohm Co Ltd 半導体チップおよびそれを用いた半導体装置
US6528846B1 (en) 1999-09-23 2003-03-04 International Business Machines Corporation Asymmetric high voltage silicon on insulator device design for input output circuits
CA2386095A1 (en) * 1999-09-30 2001-04-05 Hollis-Eden Pharmaceuticals, Inc. Therapeutic treatment of androgen receptor driven conditions
SE0004377D0 (sv) 2000-11-29 2000-11-29 Abb Research Ltd A semiconductor device and a method for production thereof
US7304327B1 (en) * 2003-11-12 2007-12-04 T-Ram Semiconductor, Inc. Thyristor circuit and approach for temperature stability
US7521773B2 (en) * 2006-03-31 2009-04-21 Fairchild Semiconductor Corporation Power device with improved edge termination
US8304829B2 (en) 2008-12-08 2012-11-06 Fairchild Semiconductor Corporation Trench-based power semiconductor devices with increased breakdown voltage characteristics
US8174067B2 (en) * 2008-12-08 2012-05-08 Fairchild Semiconductor Corporation Trench-based power semiconductor devices with increased breakdown voltage characteristics
US8106487B2 (en) 2008-12-23 2012-01-31 Pratt & Whitney Rocketdyne, Inc. Semiconductor device having an inorganic coating layer applied over a junction termination extension
US8227855B2 (en) * 2009-02-09 2012-07-24 Fairchild Semiconductor Corporation Semiconductor devices with stable and controlled avalanche characteristics and methods of fabricating the same
US8148749B2 (en) * 2009-02-19 2012-04-03 Fairchild Semiconductor Corporation Trench-shielded semiconductor device
US8049276B2 (en) * 2009-06-12 2011-11-01 Fairchild Semiconductor Corporation Reduced process sensitivity of electrode-semiconductor rectifiers
CN106298165B (zh) * 2016-09-29 2018-03-16 宇龙计算机通信科技(深圳)有限公司 一种电压控制的可调电感

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1073560A (en) * 1964-12-28 1967-06-28 Gen Electric Improvements in semiconductor devices
GB1280948A (en) * 1969-12-17 1972-07-12 Motorola Inc Semiconductor structure
JPS5565461A (en) * 1978-11-10 1980-05-16 Oki Electric Ind Co Ltd Semiconductor switch
US4268846A (en) * 1978-12-22 1981-05-19 Eaton Corporation Integrated gate turn-off device with lateral regenerative portion and vertical non-regenerative power portion
JPS57169270A (en) * 1981-04-10 1982-10-18 Meidensha Electric Mfg Co Ltd Gate turn of thyristor
JPS5857748A (ja) * 1981-09-30 1983-04-06 Sharp Corp 半導体装置
JPS58147064A (ja) * 1982-02-25 1983-09-01 Fuji Electric Co Ltd トランジスタ
JP2633544B2 (ja) * 1987-01-29 1997-07-23 株式会社東芝 ゲートターンオフサイリスタ
JP2960108B2 (ja) * 1990-05-08 1999-10-06 株式会社東芝 過電圧保護機能付半導体素子

Also Published As

Publication number Publication date
DE69427683D1 (de) 2001-08-16
CA2139072A1 (en) 1995-06-28
EP0662719A1 (en) 1995-07-12
EP0662719B1 (en) 2001-07-11
DE69427683T2 (de) 2002-04-25
KR950021508A (ko) 1995-07-26
JPH07254613A (ja) 1995-10-03
US5424563A (en) 1995-06-13

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