DK0629333T3 - Elektretmikrofonsamling og fremgangsmåde til fremstilling heraf - Google Patents

Elektretmikrofonsamling og fremgangsmåde til fremstilling heraf

Info

Publication number
DK0629333T3
DK0629333T3 DK93904859.1T DK93904859T DK0629333T3 DK 0629333 T3 DK0629333 T3 DK 0629333T3 DK 93904859 T DK93904859 T DK 93904859T DK 0629333 T3 DK0629333 T3 DK 0629333T3
Authority
DK
Denmark
Prior art keywords
manufacture
microphone assembly
electret microphone
electret
assembly
Prior art date
Application number
DK93904859.1T
Other languages
English (en)
Inventor
Ernest L Lenzini
Timothy K Wickstrom
Original Assignee
Knowles Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Knowles Electronics Inc filed Critical Knowles Electronics Inc
Application granted granted Critical
Publication of DK0629333T3 publication Critical patent/DK0629333T3/da

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2225/00—Details of deaf aids covered by H04R25/00, not provided for in any of its subgroups
    • H04R2225/49—Reducing the effects of electromagnetic noise on the functioning of hearing aids, by, e.g. shielding, signal processing adaptation, selective (de)activation of electronic parts in hearing aid
DK93904859.1T 1992-03-05 1993-02-03 Elektretmikrofonsamling og fremgangsmåde til fremstilling heraf DK0629333T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US84765692A 1992-03-05 1992-03-05
US07/930,006 US5408534A (en) 1992-03-05 1992-08-13 Electret microphone assembly, and method of manufacturer

Publications (1)

Publication Number Publication Date
DK0629333T3 true DK0629333T3 (da) 1996-12-02

Family

ID=27126724

Family Applications (1)

Application Number Title Priority Date Filing Date
DK93904859.1T DK0629333T3 (da) 1992-03-05 1993-02-03 Elektretmikrofonsamling og fremgangsmåde til fremstilling heraf

Country Status (7)

Country Link
US (1) US5408534A (da)
EP (1) EP0629333B1 (da)
JP (1) JPH07504550A (da)
AU (1) AU668137B2 (da)
DE (1) DE69303705T2 (da)
DK (1) DK0629333T3 (da)
WO (1) WO1993018627A1 (da)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5446413A (en) * 1994-05-20 1995-08-29 Knowles Electronics, Inc. Impedance circuit for a miniature hearing aid
US5548658A (en) * 1994-06-06 1996-08-20 Knowles Electronics, Inc. Acoustic Transducer
US5772575A (en) * 1995-09-22 1998-06-30 S. George Lesinski Implantable hearing aid
AU2343397A (en) * 1996-03-25 1997-10-17 S. George Lesinski Attaching an implantable hearing aid microactuator
DE69733837T2 (de) * 1996-05-24 2006-04-27 Lesinski, S. George, Cincinnati Verbesserte mikrophone für implantierbares hörhilfegerät
US5977689A (en) * 1996-07-19 1999-11-02 Neukermans; Armand P. Biocompatible, implantable hearing aid microactuator
AU4520401A (en) * 1999-12-09 2001-06-18 Sonionmicrotronic Nederland B.V. Miniature microphone
US6937735B2 (en) * 2001-04-18 2005-08-30 SonionMicrotronic Néderland B.V. Microphone for a listening device having a reduced humidity coefficient
US7062058B2 (en) * 2001-04-18 2006-06-13 Sonion Nederland B.V. Cylindrical microphone having an electret assembly in the end cover
US7136496B2 (en) * 2001-04-18 2006-11-14 Sonion Nederland B.V. Electret assembly for a microphone having a backplate with improved charge stability
US7139404B2 (en) * 2001-08-10 2006-11-21 Hear-Wear Technologies, Llc BTE/CIC auditory device and modular connector system therefor
US7110562B1 (en) * 2001-08-10 2006-09-19 Hear-Wear Technologies, Llc BTE/CIC auditory device and modular connector system therefor
US7065224B2 (en) * 2001-09-28 2006-06-20 Sonionmicrotronic Nederland B.V. Microphone for a hearing aid or listening device with improved internal damping and foreign material protection
US7239714B2 (en) 2001-10-09 2007-07-03 Sonion Nederland B.V. Microphone having a flexible printed circuit board for mounting components
US8147544B2 (en) * 2001-10-30 2012-04-03 Otokinetics Inc. Therapeutic appliance for cochlea
US7072482B2 (en) 2002-09-06 2006-07-04 Sonion Nederland B.V. Microphone with improved sound inlet port
US8280082B2 (en) * 2002-10-08 2012-10-02 Sonion Nederland B.V. Electret assembly for a microphone having a backplate with improved charge stability
US7130434B1 (en) * 2003-03-26 2006-10-31 Plantronics, Inc. Microphone PCB with integrated filter
US7352876B2 (en) * 2003-04-28 2008-04-01 Knowles Electronics, Llc. Method and apparatus for substantially improving power supply rejection performance in a miniature microphone assembly
US20050213787A1 (en) * 2004-03-26 2005-09-29 Knowles Electronics, Llc Microphone assembly with preamplifier and manufacturing method thereof
EP1767051B1 (en) * 2004-07-09 2013-03-20 Knowles Electronics, LLC Apparatus for suppressing radio frequency interference in a microphone assembly with preamplifier
US7415121B2 (en) * 2004-10-29 2008-08-19 Sonion Nederland B.V. Microphone with internal damping
TWI323242B (en) * 2007-05-15 2010-04-11 Ind Tech Res Inst Package and packageing assembly of microelectromechanical system microphone
TWI370101B (en) * 2007-05-15 2012-08-11 Ind Tech Res Inst Package and packaging assembly of microelectromechanical sysyem microphone
TWI336770B (en) * 2007-11-05 2011-02-01 Ind Tech Res Inst Sensor
US9398389B2 (en) 2013-05-13 2016-07-19 Knowles Electronics, Llc Apparatus for securing components in an electret condenser microphone (ECM)

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US3340440A (en) * 1966-03-15 1967-09-05 Jerry B Minter Multi-circuit separable connector for printed circuit boards and the like
JPS5121334B2 (da) * 1971-08-27 1976-07-01
SE362571B (da) * 1971-12-02 1973-12-10 Ericsson Telefon Ab L M
JPS4861126A (da) * 1971-12-02 1973-08-27
US3816671A (en) * 1972-04-06 1974-06-11 Thermo Electron Corp Electret transducer cartridge and case
SE371358B (da) * 1973-10-24 1974-11-11 Ericsson Telefon Ab L M
US3864531A (en) * 1973-10-29 1975-02-04 Electro Voice Microphone and connector unit therefor
US4063050A (en) * 1976-12-30 1977-12-13 Industrial Research Products, Inc. Acoustic transducer with improved electret assembly
SU625276A1 (ru) * 1977-03-09 1978-09-25 Предприятие П/Я А-3759 Токопровод щее соединение дл заземлени экранных поверхностей микрополосковых схем
JPS5538735A (en) * 1978-09-08 1980-03-18 Matsushita Electric Ind Co Ltd Electret microphone
DE3325966A1 (de) * 1982-07-22 1984-01-26 AKG Akustische u. Kino-Geräte GmbH, 1150 Wien Elektrostatischer wandler, insbesondere kondensatormikrophon
US4701640A (en) * 1985-03-11 1987-10-20 Telex Communications, Inc. Electret transducer and method of fabrication
US4636768A (en) * 1985-10-04 1987-01-13 Resistance Technology, Inc. Compression connection for potentiometer leads
US4764690A (en) * 1986-06-18 1988-08-16 Lectret S.A. Electret transducing
EP0254925A1 (de) * 1986-07-21 1988-02-03 Siemens Aktiengesellschaft Hörgerät mit einer Kontaktfederanordnung
DE8708893U1 (da) * 1987-06-26 1988-10-27 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
DE8803428U1 (da) * 1988-03-14 1989-07-13 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
US4828515A (en) * 1988-03-18 1989-05-09 Augat Inc. Bottom loaded I.C. socket
US5004317A (en) * 1990-01-03 1991-04-02 International Business Machines Corp. Wire bond connection system with cancellation of mutual coupling
US5041016A (en) * 1990-03-08 1991-08-20 Raytheon Company Flexible link connector

Also Published As

Publication number Publication date
EP0629333B1 (en) 1996-07-17
US5408534A (en) 1995-04-18
JPH07504550A (ja) 1995-05-18
EP0629333A1 (en) 1994-12-21
AU3607993A (en) 1993-10-05
DE69303705D1 (de) 1996-08-22
AU668137B2 (en) 1996-04-26
DE69303705T2 (de) 1996-11-28
WO1993018627A1 (en) 1993-09-16

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