DE9003623U1 - Vorrichtung zum Abführen der Verlustwärme von einer Leiterplatte - Google Patents

Vorrichtung zum Abführen der Verlustwärme von einer Leiterplatte

Info

Publication number
DE9003623U1
DE9003623U1 DE9003623U DE9003623U DE9003623U1 DE 9003623 U1 DE9003623 U1 DE 9003623U1 DE 9003623 U DE9003623 U DE 9003623U DE 9003623 U DE9003623 U DE 9003623U DE 9003623 U1 DE9003623 U1 DE 9003623U1
Authority
DE
Germany
Prior art keywords
circuit board
heat
casting compound
conductor tracks
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9003623U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE9003623U priority Critical patent/DE9003623U1/de
Publication of DE9003623U1 publication Critical patent/DE9003623U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
DE9003623U 1990-03-28 1990-03-28 Vorrichtung zum Abführen der Verlustwärme von einer Leiterplatte Expired - Lifetime DE9003623U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9003623U DE9003623U1 (de) 1990-03-28 1990-03-28 Vorrichtung zum Abführen der Verlustwärme von einer Leiterplatte

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9003623U DE9003623U1 (de) 1990-03-28 1990-03-28 Vorrichtung zum Abführen der Verlustwärme von einer Leiterplatte

Publications (1)

Publication Number Publication Date
DE9003623U1 true DE9003623U1 (de) 1990-10-31

Family

ID=6852423

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9003623U Expired - Lifetime DE9003623U1 (de) 1990-03-28 1990-03-28 Vorrichtung zum Abführen der Verlustwärme von einer Leiterplatte

Country Status (1)

Country Link
DE (1) DE9003623U1 (fi)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19528632A1 (de) * 1995-08-04 1997-02-06 Bosch Gmbh Robert Steuergerät bestehend aus mindestens zwei Gehäuseteilen
DE19528459A1 (de) * 1995-08-03 1997-02-13 Garufo Gmbh Leuchtaggregat
DE10102353A1 (de) * 2001-01-19 2002-08-01 Osram Opto Semiconductors Gmbh LED-Signalmodul
DE10162404A1 (de) * 2001-12-19 2003-07-03 Hella Kg Hueck & Co Schaltungsanordnung für die Ansteuerung mindestens einer Leuchtdiode
US8794797B2 (en) 2003-11-07 2014-08-05 Teknoware Oy Hybrid illuminator

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19528459A1 (de) * 1995-08-03 1997-02-13 Garufo Gmbh Leuchtaggregat
DE19528459C2 (de) * 1995-08-03 2001-08-23 Garufo Gmbh Kühlung für ein mit LED's bestücktes Leuchtaggregat
DE19528632A1 (de) * 1995-08-04 1997-02-06 Bosch Gmbh Robert Steuergerät bestehend aus mindestens zwei Gehäuseteilen
DE10102353A1 (de) * 2001-01-19 2002-08-01 Osram Opto Semiconductors Gmbh LED-Signalmodul
DE10102353B4 (de) * 2001-01-19 2007-11-15 Siemens Ag LED-Signalmodul
DE10162404A1 (de) * 2001-12-19 2003-07-03 Hella Kg Hueck & Co Schaltungsanordnung für die Ansteuerung mindestens einer Leuchtdiode
US8794797B2 (en) 2003-11-07 2014-08-05 Teknoware Oy Hybrid illuminator
DE102004053680B4 (de) * 2003-11-07 2015-12-24 Teknoware Oy Beleuchtungskörper

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