DE8811128U1 - - Google Patents

Info

Publication number
DE8811128U1
DE8811128U1 DE8811128U DE8811128U DE8811128U1 DE 8811128 U1 DE8811128 U1 DE 8811128U1 DE 8811128 U DE8811128 U DE 8811128U DE 8811128 U DE8811128 U DE 8811128U DE 8811128 U1 DE8811128 U1 DE 8811128U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8811128U
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nixdorf Computer Corp
Original Assignee
Nixdorf Computer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nixdorf Computer Corp filed Critical Nixdorf Computer Corp
Priority to DE8811128U priority Critical patent/DE8811128U1/de
Publication of DE8811128U1 publication Critical patent/DE8811128U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
DE8811128U 1988-09-02 1988-09-02 Expired - Lifetime DE8811128U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8811128U DE8811128U1 (de) 1988-09-02 1988-09-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE8811128U DE8811128U1 (de) 1988-09-02 1988-09-02

Publications (1)

Publication Number Publication Date
DE8811128U1 true DE8811128U1 (de) 1989-12-28

Family

ID=6827527

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8811128U Expired - Lifetime DE8811128U1 (de) 1988-09-02 1988-09-02

Country Status (1)

Country Link
DE (1) DE8811128U1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0751563A2 (de) * 1995-06-30 1997-01-02 Siemens Aktiengesellschaft Einrichtung zum Halten eines elektrischen Bauelements an einem Trägerteil
WO2013019612A1 (en) * 2011-07-29 2013-02-07 American Power Conversion Corporation Heat sink assembly for electronic components
EP3082158A1 (de) * 2015-04-16 2016-10-19 Valeo Powertrain Energy Conversion AS Pressvorrichtung zum andrücken eines bauteils gegen ein element

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7024567U (de) * 1969-06-26 1971-04-01 Redpoint Ltd , Swmdon, Wiltshire (Großbritannien) Kuehlvorrichtung fuer halbleiterelemente
US4537246A (en) * 1983-12-09 1985-08-27 Conver Corporation Vertical heat sink
DE8516915U1 (de) * 1985-06-10 1985-09-26 Siemens AG, 1000 Berlin und 8000 München Kühlkörper zur Kühlung eines Halbleiterbausteins
DE3440334A1 (de) * 1984-11-05 1986-05-15 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum befestigen eines halbleiterbauelementes an einem kuehlkoerper
DE8618283U1 (de) * 1986-07-09 1986-11-06 Austerlitz Electronic GmbH, 8500 Nürnberg Haltefeder zur Befestigung von Halbleitern auf beliebigen Kühlkörpern
GB2187886A (en) * 1986-03-06 1987-09-16 Thermalloy Inc Bonded clip and heat sink

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7024567U (de) * 1969-06-26 1971-04-01 Redpoint Ltd , Swmdon, Wiltshire (Großbritannien) Kuehlvorrichtung fuer halbleiterelemente
US4537246A (en) * 1983-12-09 1985-08-27 Conver Corporation Vertical heat sink
DE3440334A1 (de) * 1984-11-05 1986-05-15 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum befestigen eines halbleiterbauelementes an einem kuehlkoerper
DE8516915U1 (de) * 1985-06-10 1985-09-26 Siemens AG, 1000 Berlin und 8000 München Kühlkörper zur Kühlung eines Halbleiterbausteins
GB2187886A (en) * 1986-03-06 1987-09-16 Thermalloy Inc Bonded clip and heat sink
DE8618283U1 (de) * 1986-07-09 1986-11-06 Austerlitz Electronic GmbH, 8500 Nürnberg Haltefeder zur Befestigung von Halbleitern auf beliebigen Kühlkörpern

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
US-Z: JOY, E.F. et. al.: Heat Sink Clamp. In: IBM Technical Disclosure Bulletin, Vol. 26, No. 10A, March 1984, S. 5179 *
US-Z: JOY, E.F., WHEELER, W.R.: Power Transistor Heat Sink Clamp Plate. In: IBM Technical Disclosure Bulletin, Vol. 26, No. 10A, March 1984,S. 5184 *
US-Z: JOY, E.F.: Movable Transistor-To-Heat Sink Clamp. In: IBM Technical Disclosure Bulletin, Vol. 27, No. 2, July 1984, S. 1140 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0751563A2 (de) * 1995-06-30 1997-01-02 Siemens Aktiengesellschaft Einrichtung zum Halten eines elektrischen Bauelements an einem Trägerteil
EP0751563A3 (de) * 1995-06-30 1998-05-20 Siemens Aktiengesellschaft Einrichtung zum Halten eines elektrischen Bauelements an einem Trägerteil
WO2013019612A1 (en) * 2011-07-29 2013-02-07 American Power Conversion Corporation Heat sink assembly for electronic components
US8893770B2 (en) 2011-07-29 2014-11-25 Schneider Electric It Corporation Heat sink assembly for electronic components
EP3082158A1 (de) * 2015-04-16 2016-10-19 Valeo Powertrain Energy Conversion AS Pressvorrichtung zum andrücken eines bauteils gegen ein element

Similar Documents

Publication Publication Date Title
DE8802975U1 (de)
DE8800850U1 (de)
DE8802829U1 (de)
DE8801727U1 (de)
DE8802360U1 (de)
DE8801680U1 (de)
DE8801949U1 (de)
DE8800347U1 (de)
DE8801385U1 (de)
DE8801970U1 (de)
DE8800425U1 (de)
DE8802025U1 (de)
DE8800747U1 (de)
DE8801075U1 (de)
DE8801003U1 (de)
DE8800414U1 (de)
DE8801070U1 (de)
DE8801414U1 (de)
DE8803333U1 (de)
DE8802168U1 (de)
DE8800185U1 (de)
DE8802669U1 (de)
DE8802883U1 (de)
DE8800524U1 (de)
DE8800638U1 (de)