DE853332T1 - Vorrichtung zur Behandlung von Wafern - Google Patents
Vorrichtung zur Behandlung von WafernInfo
- Publication number
- DE853332T1 DE853332T1 DE0853332T DE97122754T DE853332T1 DE 853332 T1 DE853332 T1 DE 853332T1 DE 0853332 T DE0853332 T DE 0853332T DE 97122754 T DE97122754 T DE 97122754T DE 853332 T1 DE853332 T1 DE 853332T1
- Authority
- DE
- Germany
- Prior art keywords
- processing
- bowl
- wafers
- head
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US52423990A | 1990-05-15 | 1990-05-15 | |
US07/526,243 US5168887A (en) | 1990-05-18 | 1990-05-18 | Single wafer processor apparatus |
US52605290A | 1990-05-21 | 1990-05-21 | |
US07/526,057 US5238500A (en) | 1990-05-15 | 1990-05-21 | Aqueous hydrofluoric and hydrochloric acid vapor processing of semiconductor wafers |
US66560991A | 1991-03-06 | 1991-03-06 | |
US07/665,942 US5235995A (en) | 1989-03-27 | 1991-03-06 | Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization |
Publications (1)
Publication Number | Publication Date |
---|---|
DE853332T1 true DE853332T1 (de) | 1999-03-04 |
Family
ID=27560099
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69129850T Expired - Fee Related DE69129850T2 (de) | 1990-05-15 | 1991-04-19 | Vorrichtung zur herstellung von halbleiterschichten mit dynamischer dampfbehandlung und teilchenverflüchtigung |
DE69133335T Expired - Fee Related DE69133335T2 (de) | 1990-05-15 | 1991-05-14 | Vorrichtung zur Behandlung von Wafern |
DE0853332T Pending DE853332T1 (de) | 1990-05-15 | 1991-05-14 | Vorrichtung zur Behandlung von Wafern |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69129850T Expired - Fee Related DE69129850T2 (de) | 1990-05-15 | 1991-04-19 | Vorrichtung zur herstellung von halbleiterschichten mit dynamischer dampfbehandlung und teilchenverflüchtigung |
DE69133335T Expired - Fee Related DE69133335T2 (de) | 1990-05-15 | 1991-05-14 | Vorrichtung zur Behandlung von Wafern |
Country Status (6)
Country | Link |
---|---|
EP (2) | EP0528995B1 (de) |
JP (1) | JP3802554B2 (de) |
AT (2) | ATE168820T1 (de) |
AU (1) | AU7961391A (de) |
DE (3) | DE69129850T2 (de) |
WO (1) | WO1991017897A1 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5348619A (en) * | 1992-09-03 | 1994-09-20 | Texas Instruments Incorporated | Metal selective polymer removal |
US6613692B1 (en) | 1999-07-30 | 2003-09-02 | Tokyo Electron Limited | Substrate processing method and apparatus |
DE19959558A1 (de) * | 1999-12-10 | 2001-06-21 | Messer Griesheim Gmbh | Reinigung von Materialoberflächen mit Gasen |
DE10235020B4 (de) * | 2002-07-31 | 2004-08-26 | Christian-Albrechts-Universität Zu Kiel | Vorrichtung und Verfahren zum Ätzen großflächiger Halbleiterscheiben |
JP4700536B2 (ja) * | 2006-03-22 | 2011-06-15 | 東京エレクトロン株式会社 | 液処理装置並びに液処理装置の処理液供給方法及び処理液供給プログラム。 |
US9773744B2 (en) * | 2011-07-12 | 2017-09-26 | Globalfoundries Inc. | Solder bump cleaning before reflow |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3489608A (en) * | 1965-10-26 | 1970-01-13 | Kulicke & Soffa Ind Inc | Method and apparatus for treating semiconductor wafers |
JPS5882521A (ja) * | 1981-07-10 | 1983-05-18 | Hitachi Ltd | スピンナ |
US4749440A (en) * | 1985-08-28 | 1988-06-07 | Fsi Corporation | Gaseous process and apparatus for removing films from substrates |
JPH0834205B2 (ja) * | 1986-11-21 | 1996-03-29 | 株式会社東芝 | ドライエツチング装置 |
GB2198810A (en) * | 1986-12-19 | 1988-06-22 | Philips Electronic Associated | Apparatus suitable for processing semiconductor slices |
US4768291A (en) * | 1987-03-12 | 1988-09-06 | Monarch Technologies Corporation | Apparatus for dry processing a semiconductor wafer |
US4857142A (en) * | 1988-09-22 | 1989-08-15 | Fsi International, Inc. | Method and apparatus for controlling simultaneous etching of front and back sides of wafers |
-
1991
- 1991-04-19 JP JP51015091A patent/JP3802554B2/ja not_active Expired - Fee Related
- 1991-04-19 EP EP91911521A patent/EP0528995B1/de not_active Expired - Lifetime
- 1991-04-19 AT AT91911521T patent/ATE168820T1/de not_active IP Right Cessation
- 1991-04-19 WO PCT/US1991/002956 patent/WO1991017897A1/en active IP Right Grant
- 1991-04-19 AU AU79613/91A patent/AU7961391A/en not_active Abandoned
- 1991-04-19 DE DE69129850T patent/DE69129850T2/de not_active Expired - Fee Related
- 1991-05-14 DE DE69133335T patent/DE69133335T2/de not_active Expired - Fee Related
- 1991-05-14 EP EP97122754A patent/EP0853332B1/de not_active Expired - Lifetime
- 1991-05-14 AT AT97122754T patent/ATE253257T1/de not_active IP Right Cessation
- 1991-05-14 DE DE0853332T patent/DE853332T1/de active Pending
Also Published As
Publication number | Publication date |
---|---|
AU7961391A (en) | 1991-12-10 |
EP0528995B1 (de) | 1998-07-22 |
ATE253257T1 (de) | 2003-11-15 |
DE69129850D1 (de) | 1998-08-27 |
EP0853332B1 (de) | 2003-10-29 |
JP3802554B2 (ja) | 2006-07-26 |
DE69133335T2 (de) | 2004-07-22 |
WO1991017897A1 (en) | 1991-11-28 |
JPH05507389A (ja) | 1993-10-21 |
DE69133335D1 (de) | 2003-12-04 |
DE69129850T2 (de) | 1998-12-24 |
ATE168820T1 (de) | 1998-08-15 |
EP0528995A4 (en) | 1993-05-05 |
EP0528995A1 (de) | 1993-03-03 |
EP0853332A1 (de) | 1998-07-15 |
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