DE69943412D1 - Verfahren zur herstellung einer brücke in einer mikro-anordnung - Google Patents

Verfahren zur herstellung einer brücke in einer mikro-anordnung

Info

Publication number
DE69943412D1
DE69943412D1 DE69943412T DE69943412T DE69943412D1 DE 69943412 D1 DE69943412 D1 DE 69943412D1 DE 69943412 T DE69943412 T DE 69943412T DE 69943412 T DE69943412 T DE 69943412T DE 69943412 D1 DE69943412 D1 DE 69943412D1
Authority
DE
Germany
Prior art keywords
micro
infill
bridge
producing
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69943412T
Other languages
German (de)
English (en)
Inventor
Mark Edward Mcnie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qinetiq Ltd
Original Assignee
Qinetiq Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qinetiq Ltd filed Critical Qinetiq Ltd
Application granted granted Critical
Publication of DE69943412D1 publication Critical patent/DE69943412D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/567—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode
    • G01C19/5677—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially two-dimensional [2D] vibrators, e.g. ring-shaped vibrators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00095—Interconnects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5705—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis
    • G01C19/5712—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0109—Bridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/07—Interconnects

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Defrosting Systems (AREA)
  • Treatment And Processing Of Natural Fur Or Leather (AREA)
  • Gyroscopes (AREA)
  • Pressure Sensors (AREA)
DE69943412T 1998-09-12 1999-09-13 Verfahren zur herstellung einer brücke in einer mikro-anordnung Expired - Lifetime DE69943412D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9819817.9A GB9819817D0 (en) 1998-09-12 1998-09-12 Improvements relating to micro-machining
PCT/GB1999/003026 WO2000016105A1 (en) 1998-09-12 1999-09-13 Formation of a bridge in a micro-device

Publications (1)

Publication Number Publication Date
DE69943412D1 true DE69943412D1 (de) 2011-06-16

Family

ID=10838705

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69943412T Expired - Lifetime DE69943412D1 (de) 1998-09-12 1999-09-13 Verfahren zur herstellung einer brücke in einer mikro-anordnung

Country Status (11)

Country Link
US (1) US6846426B1 (https=)
EP (1) EP1116038B1 (https=)
JP (1) JP2002525212A (https=)
KR (1) KR20010075057A (https=)
AT (1) ATE508370T1 (https=)
AU (1) AU5873899A (https=)
CA (1) CA2343308A1 (https=)
DE (1) DE69943412D1 (https=)
GB (1) GB9819817D0 (https=)
NO (1) NO322454B1 (https=)
WO (1) WO2000016105A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
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KR100837987B1 (ko) * 2000-06-21 2008-06-16 텍사스 인스트루먼츠 인코포레이티드 용해 수지를 이용하는 마이크로 전기기계 시스템 장치의재코팅 방법
ITTO20020793A1 (it) 2002-09-12 2004-03-13 Olivetti Jet Spa Metodo per ricoprire selettivamente una superficie microlavorata.
US7424198B2 (en) * 2004-09-27 2008-09-09 Idc, Llc Method and device for packaging a substrate
US7573547B2 (en) 2004-09-27 2009-08-11 Idc, Llc System and method for protecting micro-structure of display array using spacers in gap within display device
US8685778B2 (en) 2010-06-25 2014-04-01 International Business Machines Corporation Planar cavity MEMS and related structures, methods of manufacture and design structures
US9630836B2 (en) * 2015-09-30 2017-04-25 Mems Drive, Inc. Simplified MEMS device fabrication process

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US3560893A (en) * 1968-12-27 1971-02-02 Rca Corp Surface strip transmission line and microwave devices using same
US4289846A (en) * 1979-12-28 1981-09-15 General Electric Company Process for forming low-reactance interconnections on semiconductors
US4997521A (en) * 1987-05-20 1991-03-05 Massachusetts Institute Of Technology Electrostatic micromotor
US4851080A (en) * 1987-06-29 1989-07-25 Massachusetts Institute Of Technology Resonant accelerometer
US4945069A (en) 1988-12-16 1990-07-31 Texas Instruments, Incorporated Organic space holder for trench processing
GB8921722D0 (en) * 1989-09-26 1989-11-08 British Telecomm Micromechanical switch
US5473945A (en) * 1990-02-14 1995-12-12 The Charles Stark Draper Laboratory, Inc. Micromechanical angular accelerometer with auxiliary linear accelerometer
US5090254A (en) * 1990-04-11 1992-02-25 Wisconsin Alumni Research Foundation Polysilicon resonating beam transducers
EP0543901B1 (en) * 1990-08-17 1995-10-04 Analog Devices, Inc. Monolithic accelerometer
US5198385A (en) * 1991-01-11 1993-03-30 Harris Corporation Photolithographic formation of die-to-package airbridge in a semiconductor device
US5337606A (en) 1992-08-10 1994-08-16 Motorola, Inc. Laterally sensitive accelerometer and method for making
US5479042A (en) * 1993-02-01 1995-12-26 Brooktree Corporation Micromachined relay and method of forming the relay
US5275973A (en) * 1993-03-01 1994-01-04 Motorola, Inc. Method for forming metallization in an integrated circuit
US5324553A (en) * 1993-04-30 1994-06-28 Energy Conversion Devices, Inc. Method for the improved microwave deposition of thin films
US5427975A (en) * 1993-05-10 1995-06-27 Delco Electronics Corporation Method of micromachining an integrated sensor on the surface of a silicon wafer
US5324683A (en) * 1993-06-02 1994-06-28 Motorola, Inc. Method of forming a semiconductor structure having an air region
US5364497A (en) * 1993-08-04 1994-11-15 Analog Devices, Inc. Method for fabricating microstructures using temporary bridges
US5516720A (en) 1994-02-14 1996-05-14 United Microelectronics Corporation Stress relaxation in dielectric before metallization
US5725729A (en) * 1994-09-26 1998-03-10 The Charles Stark Draper Laboratory, Inc. Process for micromechanical fabrication
US5563105A (en) * 1994-09-30 1996-10-08 International Business Machines Corporation PECVD method of depositing fluorine doped oxide using a fluorine precursor containing a glass-forming element
US5656123A (en) * 1995-06-07 1997-08-12 Varian Associates, Inc. Dual-frequency capacitively-coupled plasma reactor for materials processing
US5798283A (en) * 1995-09-06 1998-08-25 Sandia Corporation Method for integrating microelectromechanical devices with electronic circuitry
US5738757A (en) * 1995-11-22 1998-04-14 Northrop Grumman Corporation Planar masking for multi-depth silicon etching
JPH09190764A (ja) * 1996-01-08 1997-07-22 Yamaha Corp 電界放射型素子の製造方法
JPH09264900A (ja) * 1996-03-29 1997-10-07 Murata Mfg Co Ltd 熱式流速センサの製造方法
JPH09279365A (ja) * 1996-04-11 1997-10-28 Mitsubishi Materials Corp 微細構造部品を製造する方法
US5747353A (en) * 1996-04-16 1998-05-05 National Semiconductor Corporation Method of making surface micro-machined accelerometer using silicon-on-insulator technology
US5686743A (en) 1996-07-10 1997-11-11 Trw Inc. Method of forming airbridged metallization for integrated circuit fabrication
US5871655A (en) * 1998-03-19 1999-02-16 International Business Machines Corporation Integrated conductor magnetic recording head and suspension having cross-over integrated circuits for noise reduction

Also Published As

Publication number Publication date
EP1116038A1 (en) 2001-07-18
NO20011229D0 (no) 2001-03-09
WO2000016105A1 (en) 2000-03-23
GB9819817D0 (en) 1998-11-04
ATE508370T1 (de) 2011-05-15
CA2343308A1 (en) 2000-03-23
KR20010075057A (ko) 2001-08-09
EP1116038B1 (en) 2011-05-04
US6846426B1 (en) 2005-01-25
JP2002525212A (ja) 2002-08-13
NO20011229L (no) 2001-05-11
AU5873899A (en) 2000-04-03
NO322454B1 (no) 2006-10-09

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