DE69936794D1 - Halbleiterdrucksensor und vorrichtung zur erfassung von drucken - Google Patents

Halbleiterdrucksensor und vorrichtung zur erfassung von drucken

Info

Publication number
DE69936794D1
DE69936794D1 DE69936794T DE69936794T DE69936794D1 DE 69936794 D1 DE69936794 D1 DE 69936794D1 DE 69936794 T DE69936794 T DE 69936794T DE 69936794 T DE69936794 T DE 69936794T DE 69936794 D1 DE69936794 D1 DE 69936794D1
Authority
DE
Germany
Prior art keywords
pressure sensor
semiconductor pressure
detecting printing
printing
detecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69936794T
Other languages
English (en)
Other versions
DE69936794T2 (de
Inventor
Shinya Sato
Satoshi Shimada
Atsuo Watanabe
Yasuo Onose
Seiji Kuryu
Atsushi Miyazaki
Junichi Horie
Naohiro Monma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Automotive Systems Engineering Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Car Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Car Engineering Co Ltd filed Critical Hitachi Ltd
Publication of DE69936794D1 publication Critical patent/DE69936794D1/de
Application granted granted Critical
Publication of DE69936794T2 publication Critical patent/DE69936794T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00293—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS maintaining a controlled atmosphere with processes not provided for in B81C1/00285
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0145—Hermetically sealing an opening in the lid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
DE69936794T 1999-08-20 1999-08-20 Halbleiterdrucksensor und vorrichtung zur erfassung von drucken Expired - Fee Related DE69936794T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1999/004485 WO2001014842A1 (fr) 1999-08-20 1999-08-20 Detecteur de pression semi-conducteur et dispositif de detection de pression

Publications (2)

Publication Number Publication Date
DE69936794D1 true DE69936794D1 (de) 2007-09-20
DE69936794T2 DE69936794T2 (de) 2008-04-30

Family

ID=14236501

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69936794T Expired - Fee Related DE69936794T2 (de) 1999-08-20 1999-08-20 Halbleiterdrucksensor und vorrichtung zur erfassung von drucken

Country Status (4)

Country Link
US (2) US6892582B1 (de)
EP (1) EP1207378B1 (de)
DE (1) DE69936794T2 (de)
WO (1) WO2001014842A1 (de)

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JP3532776B2 (ja) * 1998-10-20 2004-05-31 株式会社日立製作所 自動車用センサの取付け構造
DE10163567A1 (de) * 2001-12-21 2003-07-17 Endress & Hauser Gmbh & Co Kg Drucksensor mit hydrophober Beschichtung
EP1394554B1 (de) * 2002-08-30 2011-11-02 STMicroelectronics Srl Herstellungsverfahren für einen Grenzbeschleunigungsaufnehmer
JP3994885B2 (ja) * 2003-02-17 2007-10-24 ソニー株式会社 Ｍｅｍｓ素子とその製造方法、回折型ｍｅｍｓ素子
FR2864341B1 (fr) * 2003-12-19 2006-03-24 Commissariat Energie Atomique Microcomposant a cavite hermetique comportant un bouchon et procede de fabrication d'un tel microcomposant
US7491566B2 (en) 2004-02-09 2009-02-17 Analog Devices, Inc. Method of forming a device by removing a conductive layer of a wafer
JP2005233877A (ja) * 2004-02-23 2005-09-02 Alps Electric Co Ltd 圧力センサ
US7231832B2 (en) * 2004-09-13 2007-06-19 United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration System and method for detecting cracks and their location
US7089797B2 (en) 2004-10-18 2006-08-15 Silverbrook Research Pty Ltd Temperature insensitive pressure sensor
US7089798B2 (en) * 2004-10-18 2006-08-15 Silverbrook Research Pty Ltd Pressure sensor with thin membrane
US7089790B2 (en) * 2004-10-18 2006-08-15 Silverbrook Research Pty Ltd Pressure sensor with laminated membrane
US6968744B1 (en) * 2004-10-18 2005-11-29 Silverbrook Research Pty Ltd Capacitative pressure sensor with close electrodes
US7093494B2 (en) * 2004-10-18 2006-08-22 Silverbrook Research Pty Ltd Micro-electromechanical pressure sensor
US7194901B2 (en) * 2004-10-18 2007-03-27 Silverbrook Research Pty Ltd Pressure sensor with apertured membrane guard
US7159467B2 (en) * 2004-10-18 2007-01-09 Silverbrook Research Pty Ltd Pressure sensor with conductive ceramic membrane
US7240560B2 (en) * 2004-10-18 2007-07-10 Silverbrook Research Pty Ltd Pressure sensor with remote power source
US7234357B2 (en) * 2004-10-18 2007-06-26 Silverbrook Research Pty Ltd Wafer bonded pressure sensor
US7121145B2 (en) * 2004-10-18 2006-10-17 Silverbrook Research Pty Ltd Capacitative pressure sensor
US7143652B2 (en) * 2004-10-18 2006-12-05 Silverbrook Research Pty Ltd Pressure sensor for high acceleration environment
EP1841688A1 (de) * 2005-01-24 2007-10-10 University College Cork-National University of Ireland, Cork Verpackung von mikrovorrichtungen
US7956428B2 (en) * 2005-08-16 2011-06-07 Robert Bosch Gmbh Microelectromechanical devices and fabrication methods
US7379792B2 (en) 2005-09-29 2008-05-27 Rosemount Inc. Pressure transmitter with acoustic pressure sensor
US7415886B2 (en) * 2005-12-20 2008-08-26 Rosemount Inc. Pressure sensor with deflectable diaphragm
JP4988217B2 (ja) * 2006-02-03 2012-08-01 株式会社日立製作所 Ｍｅｍｓ構造体の製造方法
DE102006008584A1 (de) * 2006-02-24 2007-09-06 Atmel Germany Gmbh Fertigungsprozess für integrierte Piezo-Bauelemente
JP4897318B2 (ja) * 2006-03-16 2012-03-14 ラピスセミコンダクタ株式会社 ピエゾ抵抗素子及びその製造方法
JP5127210B2 (ja) 2006-11-30 2013-01-23 株式会社日立製作所 Ｍｅｍｓセンサが混載された半導体装置
US8358047B2 (en) * 2008-09-29 2013-01-22 Xerox Corporation Buried traces for sealed electrostatic membrane actuators or sensors
US7870791B2 (en) 2008-12-03 2011-01-18 Rosemount Inc. Method and apparatus for pressure measurement using quartz crystal
US7954383B2 (en) * 2008-12-03 2011-06-07 Rosemount Inc. Method and apparatus for pressure measurement using fill tube
US8327713B2 (en) 2008-12-03 2012-12-11 Rosemount Inc. Method and apparatus for pressure measurement using magnetic property
JP5158442B2 (ja) * 2009-02-27 2013-03-06 三菱電機株式会社 半導体圧力センサおよびその製造方法
DK2229967T3 (da) 2009-03-17 2020-06-15 Hoffmann La Roche Kanylesamling og ambulant infusionssystem med en tryksensor lavet af stablede koplanare lag
JP5092167B2 (ja) * 2009-03-24 2012-12-05 三菱電機株式会社 半導体圧力センサおよびその製造方法
JP5216041B2 (ja) * 2010-04-07 2013-06-19 ダイキン工業株式会社 透明圧電シートをそれぞれ有するフレーム付透明圧電シート、タッチパネル、および電子装置
US8132464B2 (en) 2010-07-12 2012-03-13 Rosemount Inc. Differential pressure transmitter with complimentary dual absolute pressure sensors
US8703517B2 (en) * 2010-10-29 2014-04-22 Denso Corporation Method of Manufacturing a Semiconductor Device Including Removing a Reformed Layer
DE102010062622A1 (de) * 2010-12-08 2012-06-14 Ifm Electronic Gmbh Verfahren zur Selbstüberwachung einer keramischen Druckmesszelle eines kapazitiven Drucksensors und eine Auswerteschaltung zur Durchführung des Verfahrens
DE102012200191A1 (de) * 2012-01-09 2013-07-11 Ifm Electronic Gmbh Kapazitiver Drucksensor
JP2013156066A (ja) 2012-01-27 2013-08-15 Wacom Co Ltd 静電容量方式圧力センシング半導体デバイス
JP5892595B2 (ja) 2012-02-06 2016-03-23 株式会社ワコム 位置指示器
US8752433B2 (en) 2012-06-19 2014-06-17 Rosemount Inc. Differential pressure transmitter with pressure sensor
US9200973B2 (en) 2012-06-28 2015-12-01 Intel Corporation Semiconductor package with air pressure sensor
US9429427B2 (en) 2012-12-19 2016-08-30 Intel Corporation Inductive inertial sensor architecture and fabrication in packaging build-up layers
DE102013217726B4 (de) * 2013-09-05 2021-07-29 Robert Bosch Gmbh Mikromechanisches Bauteil für eine kapazitive Sensorvorrichtung und Herstellungsverfahren für ein mikromechanisches Bauteil für eine kapazitive Sensorvorrichtung
JP6119615B2 (ja) 2014-01-08 2017-04-26 三菱電機株式会社 半導体装置の製造方法
US9505607B2 (en) * 2015-03-27 2016-11-29 Intel Corporation Methods of forming sensor integrated packages and structures formed thereby
US10358340B2 (en) * 2016-04-28 2019-07-23 Globalfoundries Singapore Pte. Ltd. Integrated circuits having shielded MEMS devices and methods for fabricating shielded MEMS devices
JP7176986B2 (ja) * 2018-03-29 2022-11-22 旭化成株式会社 表面応力センサ、表面応力センサの検査方法、表面応力センサの製造方法
RU2745007C2 (ru) * 2020-03-16 2021-03-18 Общество С Ограниченной Ответственностью "Оптосенс" Мембранный датчик давления
DE102020113760B3 (de) 2020-05-20 2021-11-04 Infineon Technologies Ag MEMS-Vorrichtungen mit Stützstrukturen und zugehörige Herstellungsverfahren
DE102020214757A1 (de) * 2020-11-25 2022-05-25 Robert Bosch Gesellschaft mit beschränkter Haftung Sensorvorrichtung und Verfahren zum Detektieren eines Innendrucks und/oder einer Änderung des Innendrucks in einem gasdicht abgeschlossenen Innenvolumen einer Gehäusekomponente
US20230067539A1 (en) * 2021-08-27 2023-03-02 Taiwan Semiconductor Manufacturing Company Limited Semiconductor structure and formation thereof

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US4665610A (en) * 1985-04-22 1987-05-19 Stanford University Method of making a semiconductor transducer having multiple level diaphragm structure
WO1994017383A1 (de) 1993-01-19 1994-08-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Drucksensor
JP2991014B2 (ja) * 1993-10-08 1999-12-20 三菱電機株式会社 圧力センサ
JPH09257618A (ja) 1996-03-26 1997-10-03 Toyota Central Res & Dev Lab Inc 静電容量型圧力センサおよびその製造方法
JP3314631B2 (ja) 1996-10-09 2002-08-12 横河電機株式会社 振動式トランスデューサとその製造方法
FR2762389B1 (fr) 1997-04-17 1999-05-21 Commissariat Energie Atomique Microsysteme a membrane souple pour capteur de pression et procede de realisation
JPH1131825A (ja) * 1997-07-10 1999-02-02 Denso Corp 半導体力学量センサの製造方法
US6388279B1 (en) * 1997-06-11 2002-05-14 Denso Corporation Semiconductor substrate manufacturing method, semiconductor pressure sensor and manufacturing method thereof
JP3386336B2 (ja) 1997-06-24 2003-03-17 株式会社日立製作所 静電容量式圧力センサ及びその製造方法
US6167761B1 (en) * 1998-03-31 2001-01-02 Hitachi, Ltd. And Hitachi Car Engineering Co., Ltd. Capacitance type pressure sensor with capacitive elements actuated by a diaphragm

Also Published As

Publication number Publication date
EP1207378A1 (de) 2002-05-22
US6892582B1 (en) 2005-05-17
EP1207378A4 (de) 2002-11-13
EP1207378B1 (de) 2007-08-08
WO2001014842A1 (fr) 2001-03-01
US20050132814A1 (en) 2005-06-23
DE69936794T2 (de) 2008-04-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee