DE69930649D1 - Abstimmung eines substrattemperaturmesssystems - Google Patents

Abstimmung eines substrattemperaturmesssystems

Info

Publication number
DE69930649D1
DE69930649D1 DE69930649T DE69930649T DE69930649D1 DE 69930649 D1 DE69930649 D1 DE 69930649D1 DE 69930649 T DE69930649 T DE 69930649T DE 69930649 T DE69930649 T DE 69930649T DE 69930649 D1 DE69930649 D1 DE 69930649D1
Authority
DE
Germany
Prior art keywords
temperature
temperature profile
substrate
correction value
profile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69930649T
Other languages
English (en)
Other versions
DE69930649T2 (de
Inventor
Wolfgang Aderhold
J Mayur
A Knoot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of DE69930649D1 publication Critical patent/DE69930649D1/de
Application granted granted Critical
Publication of DE69930649T2 publication Critical patent/DE69930649T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/28—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using photoemissive or photovoltaic cells
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
    • G01J5/0007—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0806—Focusing or collimating elements, e.g. lenses or concave mirrors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0875—Windows; Arrangements for fastening thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/80—Calibration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/28—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using photoemissive or photovoltaic cells
    • G01J2005/283—Array

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Radiation Pyrometers (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Physical Vapour Deposition (AREA)
  • Control Of Temperature (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
DE69930649T 1998-08-14 1999-08-13 Abstimmung eines substrattemperaturmesssystems Expired - Fee Related DE69930649T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US133993 1998-08-14
US09/133,993 US6164816A (en) 1998-08-14 1998-08-14 Tuning a substrate temperature measurement system
PCT/US1999/018537 WO2000009976A1 (en) 1998-08-14 1999-08-13 Tuning a substrate temperature measurement system

Publications (2)

Publication Number Publication Date
DE69930649D1 true DE69930649D1 (de) 2006-05-18
DE69930649T2 DE69930649T2 (de) 2006-12-28

Family

ID=22461270

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69930649T Expired - Fee Related DE69930649T2 (de) 1998-08-14 1999-08-13 Abstimmung eines substrattemperaturmesssystems

Country Status (8)

Country Link
US (1) US6164816A (de)
EP (1) EP1116011B1 (de)
JP (1) JP2002522912A (de)
KR (1) KR100564788B1 (de)
AT (1) ATE321999T1 (de)
DE (1) DE69930649T2 (de)
TW (1) TW440685B (de)
WO (1) WO2000009976A1 (de)

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US20040105485A1 (en) * 2002-07-29 2004-06-03 Unaxis Usa, Inc. Temperature compensation for acousto-optc devices
KR100491131B1 (ko) * 2002-09-17 2005-05-27 (주)세미뱅크 반도체 소자 테스트 장치
US6916744B2 (en) * 2002-12-19 2005-07-12 Applied Materials, Inc. Method and apparatus for planarization of a material by growing a sacrificial film with customized thickness profile
US6993446B2 (en) * 2003-03-17 2006-01-31 Schlumberger Technology Corporation Method and apparatus for predicting the time to failure of electronic devices at high temperatures
US7857510B2 (en) * 2003-11-08 2010-12-28 Carl F Liepold Temperature sensing circuit
US7147359B2 (en) * 2004-06-25 2006-12-12 Applied Materials, Inc. Lamp assembly having flexibly positioned rigid plug
US7493242B1 (en) 2004-11-10 2009-02-17 The United States Of America As Represented By The Secretary Of The Navy Mathematical model for predicting the thermal behavior of an item
JP4978001B2 (ja) * 2005-01-17 2012-07-18 オムロン株式会社 温度制御方法、温度制御装置および熱処理装置
WO2006098443A1 (ja) * 2005-03-17 2006-09-21 Hamamatsu Photonics K.K. 顕微鏡画像撮像装置
US7195934B2 (en) * 2005-07-11 2007-03-27 Applied Materials, Inc. Method and system for deposition tuning in an epitaxial film growth apparatus
JP5017950B2 (ja) * 2005-09-21 2012-09-05 株式会社Ｓｕｍｃｏ エピタキシャル成長装置の温度管理方法
JP2007123643A (ja) 2005-10-31 2007-05-17 Matsushita Electric Ind Co Ltd 成膜装置、成膜方法、成膜装置のモニタリングプログラムおよびその記録媒体
US7951616B2 (en) * 2006-03-28 2011-05-31 Lam Research Corporation Process for wafer temperature verification in etch tools
US8206996B2 (en) * 2006-03-28 2012-06-26 Lam Research Corporation Etch tool process indicator method and apparatus
US7549795B2 (en) * 2006-06-30 2009-06-23 Intel Corporation Analog thermal sensor array
DE102008026002B9 (de) * 2008-05-29 2013-05-16 Von Ardenne Anlagentechnik Gmbh Verfahren zur Temperaturmessung an Substraten und Vakuumbeschichtungsanlage
US8109669B2 (en) * 2008-11-19 2012-02-07 Applied Materials, Inc. Temperature uniformity measurement during thermal processing
TWI394941B (zh) * 2009-04-03 2013-05-01 China Steel Corp Method of processing temperature measurement data
KR101031226B1 (ko) * 2009-08-21 2011-04-29 에이피시스템 주식회사 급속열처리 장치의 히터블록
JP5640894B2 (ja) * 2011-05-26 2014-12-17 東京エレクトロン株式会社 温度測定装置、温度測定方法、記憶媒体及び熱処理装置
US9245768B2 (en) * 2013-12-17 2016-01-26 Applied Materials, Inc. Method of improving substrate uniformity during rapid thermal processing
DE102013114412A1 (de) * 2013-12-18 2015-06-18 Aixtron Se Vorrichtung und Verfahren zur Regelung der Temperatur in einer Prozesskammer eines CVD-Reaktors unter Verwendung zweier Temperatursensoreinrichtungen
US9435692B2 (en) * 2014-02-05 2016-09-06 Lam Research Corporation Calculating power input to an array of thermal control elements to achieve a two-dimensional temperature output
JP6479525B2 (ja) * 2015-03-27 2019-03-06 株式会社ニューフレアテクノロジー 成膜装置及び温度測定方法
CN106556462B (zh) * 2016-12-06 2018-06-12 清华大学 一种基于多光谱测量的亚像元温度分布测量装置及方法
US20180217005A1 (en) * 2017-02-02 2018-08-02 Pervacio Inc Device and components overheating evaluation
WO2019147405A1 (en) 2018-01-23 2019-08-01 Applied Materials, Inc. Methods and apparatus for wafer temperature measurement
US10760976B2 (en) * 2018-04-12 2020-09-01 Mattson Technology, Inc. Thermal imaging of heat sources in thermal processing systems
WO2020163173A1 (en) * 2019-02-04 2020-08-13 Applied Materials, Inc. Temperature offset and zone control tuning
CN110220602B (zh) * 2019-06-24 2020-08-25 广西电网有限责任公司电力科学研究院 一种开关柜过热故障识别方法
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Also Published As

Publication number Publication date
ATE321999T1 (de) 2006-04-15
DE69930649T2 (de) 2006-12-28
WO2000009976A1 (en) 2000-02-24
US6164816A (en) 2000-12-26
EP1116011B1 (de) 2006-03-29
WO2000009976A9 (en) 2005-07-07
EP1116011A1 (de) 2001-07-18
KR20010090716A (ko) 2001-10-19
KR100564788B1 (ko) 2006-03-28
JP2002522912A (ja) 2002-07-23
TW440685B (en) 2001-06-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee