DE69930102T2 - Verfahren zur herstellung von integrierten schaltungen - Google Patents
Verfahren zur herstellung von integrierten schaltungen Download PDFInfo
- Publication number
- DE69930102T2 DE69930102T2 DE69930102T DE69930102T DE69930102T2 DE 69930102 T2 DE69930102 T2 DE 69930102T2 DE 69930102 T DE69930102 T DE 69930102T DE 69930102 T DE69930102 T DE 69930102T DE 69930102 T2 DE69930102 T2 DE 69930102T2
- Authority
- DE
- Germany
- Prior art keywords
- defects
- wafer
- stage
- processing
- class
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 230000007547 defect Effects 0.000 claims description 123
- 238000012545 processing Methods 0.000 claims description 79
- 238000000034 method Methods 0.000 claims description 31
- 230000000007 visual effect Effects 0.000 claims description 14
- 230000002950 deficient Effects 0.000 claims description 5
- 238000011835 investigation Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 51
- 238000005530 etching Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 230000005856 abnormality Effects 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 239000010749 BS 2869 Class C1 Substances 0.000 description 1
- 239000010750 BS 2869 Class C2 Substances 0.000 description 1
- 230000001594 aberrant effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- -1 vapors Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP98200413 | 1998-02-10 | ||
| EP98200413 | 1998-02-10 | ||
| PCT/IB1999/000157 WO1999041774A2 (en) | 1998-02-10 | 1999-01-28 | Method of manufacturing integrated circuits in which malfunctioning apparatuses are detected |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69930102D1 DE69930102D1 (de) | 2006-04-27 |
| DE69930102T2 true DE69930102T2 (de) | 2006-08-31 |
Family
ID=8233378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69930102T Expired - Lifetime DE69930102T2 (de) | 1998-02-10 | 1999-01-28 | Verfahren zur herstellung von integrierten schaltungen |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6242270B1 (enExample) |
| EP (1) | EP0972300B1 (enExample) |
| JP (1) | JP2001522541A (enExample) |
| DE (1) | DE69930102T2 (enExample) |
| WO (1) | WO1999041774A2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6560504B1 (en) * | 1999-09-29 | 2003-05-06 | Advanced Micro Devices, Inc. | Use of contamination-free manufacturing data in fault detection and classification as well as in run-to-run control |
| JP2002270667A (ja) * | 2001-03-12 | 2002-09-20 | Sony Corp | 半導体製造方法及び半導体製造装置 |
| US6749720B2 (en) * | 2001-03-21 | 2004-06-15 | Owens Corning Fiberglas Technology, Inc. | Wet-formed mat applications for cement backerboards |
| JP2003022945A (ja) * | 2001-07-06 | 2003-01-24 | Mitsubishi Electric Corp | 工程管理装置、工程管理方法および工程を管理するためのプログラム |
| US7194366B2 (en) * | 2001-10-19 | 2007-03-20 | Auburn University | System and method for estimating reliability of components for testing and quality optimization |
| JP3699960B2 (ja) * | 2003-03-14 | 2005-09-28 | 株式会社東芝 | 検査レシピ作成システム、欠陥レビューシステム、検査レシピ作成方法及び欠陥レビュー方法 |
| WO2005096688A1 (en) * | 2004-04-02 | 2005-10-13 | Original Solutions Inc. | System and method for defect detection and process improvement for printed circuit board assemblies |
| US8108805B2 (en) * | 2010-03-26 | 2012-01-31 | Tokyo Electron Limited | Simplified micro-bridging and roughness analysis |
| US9639774B2 (en) * | 2012-12-07 | 2017-05-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for determining applicabilty of a processing device, a processing path and a processing pattern |
| WO2020179000A1 (ja) * | 2019-03-06 | 2020-09-10 | 株式会社日立ハイテク | 欠陥検査装置、欠陥検査プログラム |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4144493A (en) * | 1976-06-30 | 1979-03-13 | International Business Machines Corporation | Integrated circuit test structure |
| US5495417A (en) * | 1990-08-14 | 1996-02-27 | Kabushiki Kaisha Toshiba | System for automatically producing different semiconductor products in different quantities through a plurality of processes along a production line |
| JPH05259015A (ja) | 1991-04-19 | 1993-10-08 | Matsushita Electron Corp | 半導体装置の製造方法 |
| JPH05121521A (ja) * | 1991-10-29 | 1993-05-18 | Komatsu Electron Metals Co Ltd | 半導体ウエハ製造装置および製造方法 |
| US5544256A (en) * | 1993-10-22 | 1996-08-06 | International Business Machines Corporation | Automated defect classification system |
| JPH07201946A (ja) * | 1993-12-28 | 1995-08-04 | Hitachi Ltd | 半導体装置等の製造方法及びその装置並びに検査方法及びその装置 |
| US5787190A (en) * | 1995-06-07 | 1998-07-28 | Advanced Micro Devices, Inc. | Method and apparatus for pattern recognition of wafer test bins |
| US5726920A (en) * | 1995-09-29 | 1998-03-10 | Advanced Micro Devices, Inc. | Watchdog system having data differentiating means for use in monitoring of semiconductor wafer testing line |
| US6091846A (en) * | 1996-05-31 | 2000-07-18 | Texas Instruments Incorporated | Method and system for anomaly detection |
| US6021380A (en) * | 1996-07-09 | 2000-02-01 | Scanis, Inc. | Automatic semiconductor wafer sorter/prober with extended optical inspection |
| JPH10123202A (ja) * | 1996-10-21 | 1998-05-15 | Nec Ic Microcomput Syst Ltd | 半導体集積回路装置 |
| US6072574A (en) * | 1997-01-30 | 2000-06-06 | Micron Technology, Inc. | Integrated circuit defect review and classification process |
| US5862055A (en) * | 1997-07-18 | 1999-01-19 | Advanced Micro Devices, Inc. | Automatic defect classification individual defect predicate value retention |
| US6084420A (en) * | 1998-11-25 | 2000-07-04 | Chee; Wan Soo | Probe assembly for testing |
-
1999
- 1999-01-28 WO PCT/IB1999/000157 patent/WO1999041774A2/en not_active Ceased
- 1999-01-28 JP JP54124599A patent/JP2001522541A/ja not_active Ceased
- 1999-01-28 EP EP99900602A patent/EP0972300B1/en not_active Expired - Lifetime
- 1999-01-28 DE DE69930102T patent/DE69930102T2/de not_active Expired - Lifetime
- 1999-02-09 US US09/247,783 patent/US6242270B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001522541A (ja) | 2001-11-13 |
| EP0972300B1 (en) | 2006-03-01 |
| DE69930102D1 (de) | 2006-04-27 |
| US6242270B1 (en) | 2001-06-05 |
| WO1999041774A3 (en) | 1999-10-28 |
| WO1999041774A2 (en) | 1999-08-19 |
| EP0972300A2 (en) | 2000-01-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8320 | Willingness to grant licences declared (paragraph 23) | ||
| 8364 | No opposition during term of opposition | ||
| 8328 | Change in the person/name/address of the agent |
Representative=s name: EISENFUEHR, SPEISER & PARTNER, 10178 BERLIN |
|
| 8327 | Change in the person/name/address of the patent owner |
Owner name: NXP B.V., EINDHOVEN, NL |