JP2001522541A - 集積回路の製造方法 - Google Patents

集積回路の製造方法

Info

Publication number
JP2001522541A
JP2001522541A JP54124599A JP54124599A JP2001522541A JP 2001522541 A JP2001522541 A JP 2001522541A JP 54124599 A JP54124599 A JP 54124599A JP 54124599 A JP54124599 A JP 54124599A JP 2001522541 A JP2001522541 A JP 2001522541A
Authority
JP
Japan
Prior art keywords
defects
wafer
class
stage
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP54124599A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001522541A5 (enExample
Inventor
フェンカト エル ナガスワミ
ヘッセル ヨハネス ヘー ファン
ウェゼプ ドリース アー ファン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics NV filed Critical Philips Electronics NV
Publication of JP2001522541A publication Critical patent/JP2001522541A/ja
Publication of JP2001522541A5 publication Critical patent/JP2001522541A5/ja
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP54124599A 1998-02-10 1999-01-28 集積回路の製造方法 Ceased JP2001522541A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP98200413 1998-02-10
EP98200413.7 1998-02-10
PCT/IB1999/000157 WO1999041774A2 (en) 1998-02-10 1999-01-28 Method of manufacturing integrated circuits in which malfunctioning apparatuses are detected

Publications (2)

Publication Number Publication Date
JP2001522541A true JP2001522541A (ja) 2001-11-13
JP2001522541A5 JP2001522541A5 (enExample) 2006-06-22

Family

ID=8233378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54124599A Ceased JP2001522541A (ja) 1998-02-10 1999-01-28 集積回路の製造方法

Country Status (5)

Country Link
US (1) US6242270B1 (enExample)
EP (1) EP0972300B1 (enExample)
JP (1) JP2001522541A (enExample)
DE (1) DE69930102T2 (enExample)
WO (1) WO1999041774A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020179000A1 (ja) * 2019-03-06 2020-09-10 株式会社日立ハイテク 欠陥検査装置、欠陥検査プログラム

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6560504B1 (en) * 1999-09-29 2003-05-06 Advanced Micro Devices, Inc. Use of contamination-free manufacturing data in fault detection and classification as well as in run-to-run control
JP2002270667A (ja) * 2001-03-12 2002-09-20 Sony Corp 半導体製造方法及び半導体製造装置
US6749720B2 (en) * 2001-03-21 2004-06-15 Owens Corning Fiberglas Technology, Inc. Wet-formed mat applications for cement backerboards
JP2003022945A (ja) * 2001-07-06 2003-01-24 Mitsubishi Electric Corp 工程管理装置、工程管理方法および工程を管理するためのプログラム
US7194366B2 (en) * 2001-10-19 2007-03-20 Auburn University System and method for estimating reliability of components for testing and quality optimization
JP3699960B2 (ja) * 2003-03-14 2005-09-28 株式会社東芝 検査レシピ作成システム、欠陥レビューシステム、検査レシピ作成方法及び欠陥レビュー方法
WO2005096688A1 (en) * 2004-04-02 2005-10-13 Original Solutions Inc. System and method for defect detection and process improvement for printed circuit board assemblies
US8108805B2 (en) * 2010-03-26 2012-01-31 Tokyo Electron Limited Simplified micro-bridging and roughness analysis
US9639774B2 (en) * 2012-12-07 2017-05-02 Taiwan Semiconductor Manufacturing Co., Ltd. Method for determining applicabilty of a processing device, a processing path and a processing pattern

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4144493A (en) * 1976-06-30 1979-03-13 International Business Machines Corporation Integrated circuit test structure
US5495417A (en) * 1990-08-14 1996-02-27 Kabushiki Kaisha Toshiba System for automatically producing different semiconductor products in different quantities through a plurality of processes along a production line
JPH05259015A (ja) 1991-04-19 1993-10-08 Matsushita Electron Corp 半導体装置の製造方法
JPH05121521A (ja) * 1991-10-29 1993-05-18 Komatsu Electron Metals Co Ltd 半導体ウエハ製造装置および製造方法
US5544256A (en) * 1993-10-22 1996-08-06 International Business Machines Corporation Automated defect classification system
JPH07201946A (ja) * 1993-12-28 1995-08-04 Hitachi Ltd 半導体装置等の製造方法及びその装置並びに検査方法及びその装置
US5787190A (en) * 1995-06-07 1998-07-28 Advanced Micro Devices, Inc. Method and apparatus for pattern recognition of wafer test bins
US5726920A (en) * 1995-09-29 1998-03-10 Advanced Micro Devices, Inc. Watchdog system having data differentiating means for use in monitoring of semiconductor wafer testing line
US6091846A (en) * 1996-05-31 2000-07-18 Texas Instruments Incorporated Method and system for anomaly detection
US6021380A (en) * 1996-07-09 2000-02-01 Scanis, Inc. Automatic semiconductor wafer sorter/prober with extended optical inspection
JPH10123202A (ja) * 1996-10-21 1998-05-15 Nec Ic Microcomput Syst Ltd 半導体集積回路装置
US6072574A (en) * 1997-01-30 2000-06-06 Micron Technology, Inc. Integrated circuit defect review and classification process
US5862055A (en) * 1997-07-18 1999-01-19 Advanced Micro Devices, Inc. Automatic defect classification individual defect predicate value retention
US6084420A (en) * 1998-11-25 2000-07-04 Chee; Wan Soo Probe assembly for testing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020179000A1 (ja) * 2019-03-06 2020-09-10 株式会社日立ハイテク 欠陥検査装置、欠陥検査プログラム
US12112963B2 (en) 2019-03-06 2024-10-08 Hitachi High-Tech Corporation Defect inspection apparatus and defect inspection program

Also Published As

Publication number Publication date
EP0972300B1 (en) 2006-03-01
DE69930102T2 (de) 2006-08-31
DE69930102D1 (de) 2006-04-27
US6242270B1 (en) 2001-06-05
WO1999041774A3 (en) 1999-10-28
WO1999041774A2 (en) 1999-08-19
EP0972300A2 (en) 2000-01-19

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