DE69913574D1 - Ferromagnetische Tunneleffektanordnung - Google Patents
Ferromagnetische TunneleffektanordnungInfo
- Publication number
- DE69913574D1 DE69913574D1 DE69913574T DE69913574T DE69913574D1 DE 69913574 D1 DE69913574 D1 DE 69913574D1 DE 69913574 T DE69913574 T DE 69913574T DE 69913574 T DE69913574 T DE 69913574T DE 69913574 D1 DE69913574 D1 DE 69913574D1
- Authority
- DE
- Germany
- Prior art keywords
- tunnel effect
- ferromagnetic tunnel
- effect arrangement
- arrangement
- ferromagnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3254—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/12917—Next to Fe-base component
- Y10T428/12924—Fe-base has 0.01-1.7% carbon [i.e., steel]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12931—Co-, Fe-, or Ni-base components, alternative to each other
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/003,320 US6169303B1 (en) | 1998-01-06 | 1998-01-06 | Ferromagnetic tunnel junctions with enhanced magneto-resistance |
US3320 | 1998-01-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69913574D1 true DE69913574D1 (de) | 2004-01-29 |
DE69913574T2 DE69913574T2 (de) | 2004-09-30 |
Family
ID=21705248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69913574T Expired - Lifetime DE69913574T2 (de) | 1998-01-06 | 1999-01-04 | Ferromagnetische Tunneleffektanordnung |
Country Status (5)
Country | Link |
---|---|
US (2) | US6169303B1 (de) |
EP (1) | EP0929110B1 (de) |
JP (1) | JP2000012365A (de) |
CN (1) | CN1179424C (de) |
DE (1) | DE69913574T2 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19949713C2 (de) * | 1999-10-15 | 2001-08-16 | Bosch Gmbh Robert | Magnetoresistives Schichtsystem |
US6727105B1 (en) | 2000-02-28 | 2004-04-27 | Hewlett-Packard Development Company, L.P. | Method of fabricating an MRAM device including spin dependent tunneling junction memory cells |
US6544801B1 (en) * | 2000-08-21 | 2003-04-08 | Motorola, Inc. | Method of fabricating thermally stable MTJ cell and apparatus |
US6515341B2 (en) | 2001-02-26 | 2003-02-04 | Motorola, Inc. | Magnetoelectronics element having a stressed over-layer configured for alteration of the switching energy barrier |
TWI222630B (en) * | 2001-04-24 | 2004-10-21 | Matsushita Electric Ind Co Ltd | Magnetoresistive element and magnetoresistive memory device using the same |
US6781801B2 (en) | 2001-08-10 | 2004-08-24 | Seagate Technology Llc | Tunneling magnetoresistive sensor with spin polarized current injection |
JPWO2003092084A1 (ja) * | 2002-04-23 | 2005-09-02 | 松下電器産業株式会社 | 磁気抵抗効果素子とその製造方法ならびにこれを用いた磁気ヘッド、磁気メモリおよび磁気記録装置 |
US7189583B2 (en) * | 2003-07-02 | 2007-03-13 | Micron Technology, Inc. | Method for production of MRAM elements |
US6961263B2 (en) * | 2003-09-08 | 2005-11-01 | Hewlett-Packard Development Company, L.P. | Memory device with a thermally assisted write |
JP5095076B2 (ja) * | 2004-11-09 | 2012-12-12 | 株式会社東芝 | 磁気抵抗効果素子 |
US7460343B2 (en) * | 2005-03-31 | 2008-12-02 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic read sensor employing oblique etched underlayers for inducing uniaxial magnetic anisotropy in a hard magnetic in-stack bias layer |
US7457085B2 (en) | 2005-03-31 | 2008-11-25 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic read sensor employing oblique etched underlayers for inducing uniaxial magnetic anisotropy in hard magnetic bias layers |
US7382586B2 (en) * | 2005-03-31 | 2008-06-03 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic read sensor employing oblique etched underlayers for inducing uniaxial magnetic anisotropy in a self biased free layer |
US7360300B2 (en) * | 2005-03-31 | 2008-04-22 | Hitachi Global Storage Technologies Netherlands B.V. | Method for manufacturing a magnetic read sensor employing oblique etched underlayers for inducing uniaxial magnetic anisotropy in a hard magnetic pinning layer |
US7360299B2 (en) * | 2005-03-31 | 2008-04-22 | Hitachi Global Storage Technologies Netherlands B. V. | Method for manufacturing a magnetic read sensor employing oblique etched underlayers for inducing uniaxial magnetic anisotropy in a hard magnetic in-stack bias layer |
US7363699B2 (en) * | 2005-03-31 | 2008-04-29 | Hitachi Global Storage Technologies Netherlands B. V. | Method for manufacturing a magnetic read sensor employing oblique etched underlayers for inducing uniaxial magnetic anisotropy in hard magnetic bias layers |
US7672090B2 (en) * | 2005-03-31 | 2010-03-02 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic read sensor employing oblique etched underlayers for inducing uniaxial magnetic anisotropy in a hard magnetic pinning layer |
JP2007096105A (ja) | 2005-09-29 | 2007-04-12 | Toshiba Corp | 磁気抵抗効果素子、磁気抵抗効果ヘッド、磁気記憶装置、および磁気メモリ |
US8004374B2 (en) * | 2005-12-14 | 2011-08-23 | Hitachi Global Storage Technologies Netherlands B.V. | Increased anisotropy induced by direct ion etch for telecommunications/electronics devices |
JP4768488B2 (ja) | 2006-03-27 | 2011-09-07 | 株式会社東芝 | 磁気抵抗効果素子,磁気ヘッド,および磁気ディスク装置 |
JP4537981B2 (ja) * | 2006-07-11 | 2010-09-08 | 株式会社東芝 | 磁気記憶装置 |
US7900342B2 (en) * | 2007-02-23 | 2011-03-08 | Hitachi Global Storage Technologies Netherlands, B.V. | Methods of fabricating magnetoresistance sensors pinned by an etch induced magnetic anisotropy |
FR2972077B1 (fr) * | 2011-02-24 | 2013-08-30 | Thales Sa | Composant electronique, procede de fabrication et utilisation de graphene dans un composant electronique |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1252739B (de) * | 1964-03-17 | 1967-10-26 | Siemens Aktiengesellschaft, Berlin und München, München | Speicherelement mit gestapelten magnetischen Schichten |
US4806202A (en) * | 1987-10-05 | 1989-02-21 | Intel Corporation | Field enhanced tunnel oxide on treated substrates |
US5390061A (en) * | 1990-06-08 | 1995-02-14 | Hitachi, Ltd. | Multilayer magnetoresistance effect-type magnetic head |
JP2815495B2 (ja) * | 1991-07-08 | 1998-10-27 | ローム株式会社 | 半導体記憶装置 |
JPH06204494A (ja) * | 1993-01-07 | 1994-07-22 | Fujitsu Ltd | 絶縁膜の形成方法および半導体素子の製造方法 |
US5585198A (en) * | 1993-10-20 | 1996-12-17 | Sanyo Electric Co., Ltd. | Magnetorsistance effect element |
DE69513630T2 (de) * | 1994-10-05 | 2000-06-21 | Koninkl Philips Electronics Nv | Magnetische mehrlagenanordnung, die eine doppelbarrierenstruktur mit resonantem tunneleffekt enthält |
US5629922A (en) * | 1995-02-22 | 1997-05-13 | Massachusetts Institute Of Technology | Electron tunneling device using ferromagnetic thin films |
US5731598A (en) * | 1995-06-23 | 1998-03-24 | Matsushita Electric Industrial Co. Ltd. | Single electron tunnel device and method for fabricating the same |
US5569617A (en) * | 1995-12-21 | 1996-10-29 | Honeywell Inc. | Method of making integrated spacer for magnetoresistive RAM |
US5712612A (en) * | 1996-01-02 | 1998-01-27 | Hewlett-Packard Company | Tunneling ferrimagnetic magnetoresistive sensor |
JP3540083B2 (ja) * | 1996-02-23 | 2004-07-07 | 富士通株式会社 | 磁気センサ |
US5650958A (en) | 1996-03-18 | 1997-07-22 | International Business Machines Corporation | Magnetic tunnel junctions with controlled magnetic response |
US5764567A (en) | 1996-11-27 | 1998-06-09 | International Business Machines Corporation | Magnetic tunnel junction device with nonferromagnetic interface layer for improved magnetic field response |
US5879783A (en) * | 1996-08-05 | 1999-03-09 | Seagate Technology, Inc. | Low noise magnetic recording medium and method of manufacturing |
US5768181A (en) * | 1997-04-07 | 1998-06-16 | Motorola, Inc. | Magnetic device having multi-layer with insulating and conductive layers |
US5966012A (en) * | 1997-10-07 | 1999-10-12 | International Business Machines Corporation | Magnetic tunnel junction device with improved fixed and free ferromagnetic layers |
US5898548A (en) * | 1997-10-24 | 1999-04-27 | International Business Machines Corporation | Shielded magnetic tunnel junction magnetoresistive read head |
-
1998
- 1998-01-06 US US09/003,320 patent/US6169303B1/en not_active Expired - Lifetime
- 1998-11-25 CN CNB981225896A patent/CN1179424C/zh not_active Expired - Lifetime
- 1998-12-09 JP JP10349432A patent/JP2000012365A/ja active Pending
-
1999
- 1999-01-04 DE DE69913574T patent/DE69913574T2/de not_active Expired - Lifetime
- 1999-01-04 EP EP99300005A patent/EP0929110B1/de not_active Expired - Lifetime
-
2000
- 2000-02-11 US US09/672,794 patent/US6511855B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69913574T2 (de) | 2004-09-30 |
EP0929110B1 (de) | 2003-12-17 |
JP2000012365A (ja) | 2000-01-14 |
CN1222771A (zh) | 1999-07-14 |
US20020114972A1 (en) | 2002-08-22 |
EP0929110A1 (de) | 1999-07-14 |
US6169303B1 (en) | 2001-01-02 |
US6511855B2 (en) | 2003-01-28 |
CN1179424C (zh) | 2004-12-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69924655D1 (de) | Magnetische Tunnelübergangsvorrichtungen | |
DE69913574D1 (de) | Ferromagnetische Tunneleffektanordnung | |
ATE341990T1 (de) | Sigmidoskop | |
DE69904211T2 (de) | Polyalkoxylierte naphtopyrans | |
DE69911105D1 (de) | Kurbelwellenstellungsdetektierung | |
ID23458A (id) | Bentuk sediaan nefazodon | |
DE69902762D1 (de) | Riser-spannanordnung | |
DE69902034T2 (de) | Lattenkollimator | |
DE69811890T2 (de) | Einzellenkalorimeter | |
NO20006252D0 (no) | Skinnestötte | |
ATE262513T1 (de) | Benzoylpyridazine | |
DE69827358D1 (de) | Weglenkungsverfahren | |
DE29810176U1 (de) | Tunnelfahrweg | |
NO20006616D0 (no) | Propionibacteriumvektor | |
DE1118098T1 (de) | Mehrfachflussigelektrosprühschnittstelle | |
DE19842103B4 (de) | Stanznietzuführung | |
DE29813464U1 (de) | Trageanordnung | |
DE29817549U1 (de) | Reißverschluß | |
DE69924586D1 (de) | Magnetowiderstandseffektelement | |
ATA126298A (de) | Verpuffungsklappe | |
FIU980274U0 (fi) | Esisuodatusyksikkö | |
DE29802605U1 (de) | Etagère | |
DE29809642U1 (de) | Mürbehammer | |
SE9902890D0 (sv) | Golvrelaterat arrangemang | |
DE29807112U1 (de) | Formblatt |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: SAMSUNG ELECTRONICS CO., LTD., SUWON, GYEONGGI, KR |