DE69902772T2 - Teilchenkontaminationsschutz für lithographische komponenten - Google Patents

Teilchenkontaminationsschutz für lithographische komponenten

Info

Publication number
DE69902772T2
DE69902772T2 DE69902772T DE69902772T DE69902772T2 DE 69902772 T2 DE69902772 T2 DE 69902772T2 DE 69902772 T DE69902772 T DE 69902772T DE 69902772 T DE69902772 T DE 69902772T DE 69902772 T2 DE69902772 T2 DE 69902772T2
Authority
DE
Germany
Prior art keywords
particle contamination
contamination protection
lithographic components
lithographic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69902772T
Other languages
English (en)
Other versions
DE69902772D1 (de
Inventor
E Klebanoff
J Rader
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EUV LLC
Original Assignee
EUV LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EUV LLC filed Critical EUV LLC
Application granted granted Critical
Publication of DE69902772D1 publication Critical patent/DE69902772D1/de
Publication of DE69902772T2 publication Critical patent/DE69902772T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE69902772T 1998-04-30 1999-03-26 Teilchenkontaminationsschutz für lithographische komponenten Expired - Lifetime DE69902772T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/071,359 US6153044A (en) 1998-04-30 1998-04-30 Protection of lithographic components from particle contamination
PCT/US1999/006660 WO1999057607A1 (en) 1998-04-30 1999-03-26 Protection of lithographic components from particle contamination

Publications (2)

Publication Number Publication Date
DE69902772D1 DE69902772D1 (de) 2002-10-10
DE69902772T2 true DE69902772T2 (de) 2003-05-28

Family

ID=22100815

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69902772T Expired - Lifetime DE69902772T2 (de) 1998-04-30 1999-03-26 Teilchenkontaminationsschutz für lithographische komponenten
DE1075672T Pending DE1075672T1 (de) 1998-04-30 1999-03-26 Teilchenkontaminationsschutz für lithographische komponenten

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE1075672T Pending DE1075672T1 (de) 1998-04-30 1999-03-26 Teilchenkontaminationsschutz für lithographische komponenten

Country Status (7)

Country Link
US (2) US6153044A (de)
EP (1) EP1075672B1 (de)
JP (1) JP2003522400A (de)
KR (1) KR100618138B1 (de)
AU (1) AU3208899A (de)
DE (2) DE69902772T2 (de)
WO (1) WO1999057607A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019203138A1 (de) * 2019-03-07 2020-03-26 Carl Zeiss Smt Gmbh Vorrichtung und Verfahren zum Verändern einer Position zumindest eines Partikels auf zumindest einem optischen Element eines optischen Systems

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2325900A (en) * 1999-03-12 2000-10-04 Nikon Corporation Exposure device, exposure method, and device manufacturing method
EP1229573A4 (de) * 1999-07-16 2006-11-08 Nikon Corp Belichtungsverfahren und -system
EP1098225A3 (de) * 1999-11-05 2002-04-10 Asm Lithography B.V. Lithographischer Projektionsapparat mit Spülgassystem und Verfahren unter Verwendung desselben
TW480372B (en) * 1999-11-05 2002-03-21 Asm Lithography Bv Lithographic projection apparatus, method of manufacturing a device using the apparatus, and device manufactured according to the method
US6492067B1 (en) * 1999-12-03 2002-12-10 Euv Llc Removable pellicle for lithographic mask protection and handling
US6791661B2 (en) * 1999-12-09 2004-09-14 Nikon Corporation Gas replacement method and apparatus, and exposure method and apparatus
JP2002151400A (ja) * 2000-11-15 2002-05-24 Canon Inc 露光装置、その保守方法並びに同装置を用いた半導体デバイス製造方法及び半導体製造工場
JP2002158153A (ja) * 2000-11-16 2002-05-31 Canon Inc 露光装置およびペリクル空間内ガス置換方法
US6710845B2 (en) * 2000-12-29 2004-03-23 Intel Corporation Purging gas from a photolithography enclosure between a mask protective device and a patterned mask
DE50207927D1 (de) * 2001-01-26 2006-10-05 Zeiss Carl Smt Ag Schmalbandiger spektralfilter und seine verwendung
US6734443B2 (en) 2001-05-08 2004-05-11 Intel Corporation Apparatus and method for removing photomask contamination and controlling electrostatic discharge
EP1256847B1 (de) * 2001-05-09 2007-07-25 ASML Netherlands B.V. Lithographischer Apparat mit Spülgassystem
EP1256844A1 (de) * 2001-05-09 2002-11-13 ASML Netherlands B.V. Lithographischer Apparat
US6772776B2 (en) 2001-09-18 2004-08-10 Euv Llc Apparatus for in situ cleaning of carbon contaminated surfaces
US6968850B2 (en) * 2002-07-15 2005-11-29 Intel Corporation In-situ cleaning of light source collector optics
US7484200B2 (en) * 2002-08-14 2009-01-27 National Instruments Corporation Automatically analyzing and modifying a graphical program
KR100563102B1 (ko) * 2002-09-12 2006-03-27 에이에스엠엘 네델란즈 비.브이. 표면들로부터 입자들을 제거함으로써 세정하는 방법,세정장치 및 리소그래피투영장치
EP1411388B1 (de) * 2002-09-12 2006-12-20 ASML Netherlands B.V. Verfahren zur Reinigung durch Entfernung von Teilchen von Oberflächen, Reinigungsvorrichtung und lithographischer Projektionsapparat
US7473301B2 (en) * 2002-09-17 2009-01-06 Euv Llc Adhesive particle shielding
US6888297B2 (en) * 2002-12-19 2005-05-03 Euv Llc Method and apparatus for debris mitigation for an electrical discharge source
EP1652005B1 (de) 2003-07-29 2011-06-22 Philips Intellectual Property & Standards GmbH Verfahren und gerät zur oberflächenreinigung von einer optischen vorrichtung
US7159719B2 (en) * 2003-07-31 2007-01-09 Intel Corporation Thermophoretic protection of reticles
JP2005123292A (ja) * 2003-10-15 2005-05-12 Canon Inc 収納装置、当該収納装置を用いた露光方法
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
WO2005047981A2 (en) * 2003-11-10 2005-05-26 Nikon Corporation Thermophoretic techniques for protecting reticles from contaminants
US20050113976A1 (en) 2003-11-10 2005-05-26 Blueshift Technologies, Inc. Software controller for handling system
US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
KR101163095B1 (ko) 2003-12-23 2012-07-06 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 표면 조사 방법, 감광 층을 패터닝하는 방법, 제거가능한 보호 층의 제거 방법 및 블랭크
FR2869451B1 (fr) * 2004-04-21 2006-07-21 Alcatel Sa Enveloppe de transport a protection par effet thermophorese
FR2869452B1 (fr) * 2004-04-21 2006-09-08 Alcatel Sa Dispositif pour le transport de substrats sous atmosphere controlee
US7452637B2 (en) * 2004-06-09 2008-11-18 Intel Corporation Method and apparatus for clean photomask handling
JP2005353986A (ja) * 2004-06-14 2005-12-22 Canon Inc 露光装置
US20050275835A1 (en) * 2004-06-15 2005-12-15 Nikon Corporation Method and apparatus for protecting an EUV reticle from particles
US7030959B2 (en) * 2004-07-23 2006-04-18 Nikon Corporation Extreme ultraviolet reticle protection using gas flow thermophoresis
US7477358B2 (en) * 2004-09-28 2009-01-13 Nikon Corporation EUV reticle handling system and method
US7323698B2 (en) * 2004-10-19 2008-01-29 Nikon Corporation Thermally insulated thermophoretic plate
US7202934B2 (en) * 2004-12-20 2007-04-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2006067730A2 (en) * 2004-12-22 2006-06-29 Koninklijke Philips Electronics N.V. Device and method for holding a substrate
US20060162739A1 (en) * 2005-01-21 2006-07-27 Nikon Corporation Cleaning chuck in situ
US20060181689A1 (en) * 2005-02-14 2006-08-17 Nikon Corporation Lithographic-optical systems including isolatable vacuum chambers, and lithography apparatus comprising same
JP2006287003A (ja) * 2005-04-01 2006-10-19 Tohoku Univ 露光装置
US20060258214A1 (en) * 2005-05-10 2006-11-16 Nikon Corporation Seal assembly for an exposure apparatus
US7717966B2 (en) * 2005-05-10 2010-05-18 Nikon Corporation Barrier assembly for an exposure apparatus
US7909960B2 (en) * 2005-09-27 2011-03-22 Lam Research Corporation Apparatus and methods to remove films on bevel edge and backside of wafer
US20070068623A1 (en) * 2005-09-27 2007-03-29 Yunsang Kim Apparatus for the removal of a set of byproducts from a substrate edge and methods therefor
US7367138B2 (en) * 2005-10-11 2008-05-06 Nikon Corporation Devices and methods for thermophoretic and electrophoretic reduction of particulate contamination of lithographic reticles
US7554648B2 (en) * 2005-11-04 2009-06-30 Nikon Corporation Blind devices and methods for providing continuous thermophoretic protection of lithographic reticle
US7808616B2 (en) * 2005-12-28 2010-10-05 Nikon Corporation Reticle transport apparatus, exposure apparatus, reticle transport method, and reticle processing method
US7745079B2 (en) * 2006-03-09 2010-06-29 Nikon Corporation Apparatus for and method of thermophoretic protection of an object in a high-vacuum environment
US7773198B2 (en) * 2006-03-28 2010-08-10 Nikon Corporation Filtered device container assembly with shield for a reticle
US20070285632A1 (en) * 2006-06-08 2007-12-13 Nikon Corporation EUVL reticle stage and reticle protection system and method
DE102006044591A1 (de) * 2006-09-19 2008-04-03 Carl Zeiss Smt Ag Optische Anordnung, insbesondere Projektionsbelichtungsanlage für die EUV-Lithographie, sowie reflektives optisches Element mit verminderter Kontamination
US20080128303A1 (en) * 2006-12-05 2008-06-05 Nikon Corporation Device container assembly with adjustable retainers for a reticle
JP2008258477A (ja) * 2007-04-06 2008-10-23 Canon Inc 処理装置及び雰囲気置換方法
NL1036181A1 (nl) 2007-11-30 2009-06-04 Asml Netherlands Bv A lithographic apparatus, a projection system and a device manufacturing method.
DE102008028868A1 (de) * 2008-06-19 2009-12-24 Carl Zeiss Smt Ag Optische Baugruppe
NL2008345A (en) 2011-03-28 2012-10-01 Asml Holding Nv Lithographic apparatus and device manufacturing method.
WO2014005780A1 (en) * 2012-07-06 2014-01-09 Asml Netherlands B.V. A lithographic apparatus
US9389180B2 (en) 2013-02-15 2016-07-12 Kla-Tencor Corporation Methods and apparatus for use with extreme ultraviolet light having contamination protection
US9182686B2 (en) 2013-06-13 2015-11-10 Globalfoundries U.S. 2 Llc Extreme ultraviolet radiation (EUV) pellicle formation apparatus
US9057957B2 (en) 2013-06-13 2015-06-16 International Business Machines Corporation Extreme ultraviolet (EUV) radiation pellicle formation method
WO2018188828A1 (en) * 2017-04-11 2018-10-18 Asml Netherlands B.V. Lithographic apparatus and cooling method
NL2020850A (en) * 2017-05-29 2018-12-04 Asml Netherlands Bv Lithographic apparatus

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4728389A (en) * 1985-05-20 1988-03-01 Applied Materials, Inc. Particulate-free epitaxial process
US5373806A (en) * 1985-05-20 1994-12-20 Applied Materials, Inc. Particulate-free epitaxial process
US5061444A (en) * 1987-12-29 1991-10-29 California Institute Of Technology Systems for reducing deposition of fluid-borne particles
JP2731950B2 (ja) * 1989-07-13 1998-03-25 キヤノン株式会社 露光方法
US5366559A (en) * 1993-05-27 1994-11-22 Research Triangle Institute Method for protecting a substrate surface from contamination using the photophoretic effect
US5581324A (en) * 1993-06-10 1996-12-03 Nikon Corporation Thermal distortion compensated projection exposure method and apparatus for manufacturing semiconductors
JP3365571B2 (ja) * 1993-11-10 2003-01-14 株式会社ニコン 光学式計測装置及び露光装置
DE69535412D1 (de) * 1994-04-08 2007-04-12 Canon Kk Verarbeitungssystem zur Herstellung von Halbleiterbauelementen
US5888579A (en) * 1996-07-29 1999-03-30 Texas Instruments-Acer Incorporated Method and apparatus for preventing particle contamination in a process chamber
US6161311A (en) * 1998-07-10 2000-12-19 Asm America, Inc. System and method for reducing particles in epitaxial reactors
US6106634A (en) * 1999-02-11 2000-08-22 Applied Materials, Inc. Methods and apparatus for reducing particle contamination during wafer transport

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019203138A1 (de) * 2019-03-07 2020-03-26 Carl Zeiss Smt Gmbh Vorrichtung und Verfahren zum Verändern einer Position zumindest eines Partikels auf zumindest einem optischen Element eines optischen Systems

Also Published As

Publication number Publication date
EP1075672A1 (de) 2001-02-14
KR20010061934A (ko) 2001-07-07
KR100618138B1 (ko) 2006-08-31
US6153044A (en) 2000-11-28
US6253464B1 (en) 2001-07-03
JP2003522400A (ja) 2003-07-22
WO1999057607A1 (en) 1999-11-11
DE1075672T1 (de) 2001-08-23
AU3208899A (en) 1999-11-23
EP1075672B1 (de) 2002-09-04
DE69902772D1 (de) 2002-10-10

Similar Documents

Publication Publication Date Title
DE69902772D1 (de) Teilchenkontaminationsschutz für lithographische komponenten
DE69927498D1 (de) Pektine aus aloe
DE69913562D1 (de) Positioniermittel für handdrucker
SE9900562L (sv) Inneslutningssystem
ID22562A (id) Komposisi untuk pembasmi artropoda berbahaya
DE69933918D1 (de) Lithographischer Projektionsapparat
PT1078349E (pt) Dispositivo de exposicao
DE69904598D1 (de) Lösungsmittel für amorfe fluoropolymere
ID21804A (id) Peralatan reproduksi
DE69925789D1 (de) Bauteil für Bremsen
ID30516A (id) Senyawa-senyawa (aminoiminometil atau aminometil) benzoheteroaril tersubstitusi
DE69822004D1 (de) Belichtungsvorrichtung
DE69901370D1 (de) Teilchenförmige Zusammensetzungen
DE69928328D1 (de) Lithographischer Projektionsapparat
DE19983048T1 (de) Schutzvorrichtung für Meßgerät
DE69922742D1 (de) Partikelfalle für Turbomaschinen
ID23196A (id) Gandaran untuk lampuflouresen
DE69804161T2 (de) Bauteil für Halbleiterapparatur
DE59907864D1 (de) Werkstückbestrahlungsanlage
DE69529386T2 (de) Verbesserungen für Halbleiteranordnungen
DE29814293U1 (de) Entstaubungsanlage
DE9409045U1 (de) Kühlkörper für Mikroprozessoren
DE29805102U1 (de) Schutzvorrichtung für Flansche
DE29710341U1 (de) Tragevorrichtung für Werkzeuge
DE9417497U1 (de) Kühlkörper für Mikroprozessoren

Legal Events

Date Code Title Description
8364 No opposition during term of opposition