DE69839520D1 - Temperaturregelvorrichtung fuer ein elektronisches bauelement - Google Patents

Temperaturregelvorrichtung fuer ein elektronisches bauelement

Info

Publication number
DE69839520D1
DE69839520D1 DE69839520T DE69839520T DE69839520D1 DE 69839520 D1 DE69839520 D1 DE 69839520D1 DE 69839520 T DE69839520 T DE 69839520T DE 69839520 T DE69839520 T DE 69839520T DE 69839520 D1 DE69839520 D1 DE 69839520D1
Authority
DE
Germany
Prior art keywords
control device
electronic component
temperature control
electronic
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69839520T
Other languages
German (de)
English (en)
Inventor
James Wittman Babcock
Jerry Ihor Tustaniwskyj
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delta Design Inc
Original Assignee
Delta Design Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/833,273 external-priority patent/US5864176A/en
Priority claimed from US08/833,369 external-priority patent/US5821505A/en
Priority claimed from US08/833,368 external-priority patent/US5844208A/en
Application filed by Delta Design Inc filed Critical Delta Design Inc
Application granted granted Critical
Publication of DE69839520D1 publication Critical patent/DE69839520D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1919—Control of temperature characterised by the use of electric means characterised by the type of controller
    • G05D23/192—Control of temperature characterised by the use of electric means characterised by the type of controller using a modification of the thermal impedance between a source and the load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01065—Terbium [Tb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01076—Osmium [Os]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10156—Shape being other than a cuboid at the periphery
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10157—Shape being other than a cuboid at the active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Automation & Control Theory (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Control Of Temperature (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE69839520T 1997-04-04 1998-04-03 Temperaturregelvorrichtung fuer ein elektronisches bauelement Expired - Lifetime DE69839520D1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US08/833,273 US5864176A (en) 1997-04-04 1997-04-04 Electro-mechnical subassembly having a greatly reduced thermal resistance between two mating faces by including a film of liquid, that evaporates without leaving any residue, between the faces
US08/833,369 US5821505A (en) 1997-04-04 1997-04-04 Temperature control system for an electronic device which achieves a quick response by interposing a heater between the device and a heat sink
US08/833,368 US5844208A (en) 1997-04-04 1997-04-04 Temperature control system for an electronic device in which device temperature is estimated from heater temperature and heat sink temperature
PCT/US1998/006701 WO1998046059A1 (en) 1997-04-04 1998-04-03 Temperature control system for an electronic device

Publications (1)

Publication Number Publication Date
DE69839520D1 true DE69839520D1 (de) 2008-07-03

Family

ID=27420238

Family Applications (3)

Application Number Title Priority Date Filing Date
DE69839520T Expired - Lifetime DE69839520D1 (de) 1997-04-04 1998-04-03 Temperaturregelvorrichtung fuer ein elektronisches bauelement
DE69818468T Expired - Lifetime DE69818468T2 (de) 1997-04-04 1998-04-03 Temperatur-Regelungssystem für eine elektronische Schaltung bei welcher die Temperatur über die Temperaturen einer Wärmequelle und einer Wärmesenke geschätzt wird
DE69822158T Expired - Lifetime DE69822158T2 (de) 1997-04-04 1998-04-03 Methode und Vorrichtung zum wärmeleitenden Verbinden einer elektronischen Schaltung mit einem Wärmetauscher

Family Applications After (2)

Application Number Title Priority Date Filing Date
DE69818468T Expired - Lifetime DE69818468T2 (de) 1997-04-04 1998-04-03 Temperatur-Regelungssystem für eine elektronische Schaltung bei welcher die Temperatur über die Temperaturen einer Wärmequelle und einer Wärmesenke geschätzt wird
DE69822158T Expired - Lifetime DE69822158T2 (de) 1997-04-04 1998-04-03 Methode und Vorrichtung zum wärmeleitenden Verbinden einer elektronischen Schaltung mit einem Wärmetauscher

Country Status (4)

Country Link
EP (4) EP0993243B1 (enExample)
JP (3) JP4077523B2 (enExample)
DE (3) DE69839520D1 (enExample)
WO (1) WO1998046059A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6668570B2 (en) 2001-05-31 2003-12-30 Kryotech, Inc. Apparatus and method for controlling the temperature of an electronic device under test
US6658736B1 (en) * 2002-08-09 2003-12-09 Unisys Corporation Method of fabricating a heat exchanger, for regulating the temperature of multiple integrated circuit modules, having a face of a solid malleable metal coated with a release agent
US6975028B1 (en) 2003-03-19 2005-12-13 Delta Design, Inc. Thermal apparatus for engaging electronic device
US6995980B2 (en) * 2003-08-21 2006-02-07 Unisys Corporation Temperature control system which sprays liquid coolant droplets against an IC-module and directs radiation against the IC-module
US7199597B2 (en) * 2004-02-16 2007-04-03 Delta Design, Inc. Dual feedback control system for maintaining the temperature of an IC-chip near a set-point
DE102004042075A1 (de) * 2004-08-31 2005-10-20 Infineon Technologies Ag Schaltungsanordnung mit temperaturgesteuerter Schaltungseinheit und Verfahren zur Temperatursteuerung
DE102005001163B3 (de) * 2005-01-10 2006-05-18 Erich Reitinger Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer temperierbaren Aufspanneinrichtung
JP4418772B2 (ja) 2005-04-28 2010-02-24 富士通マイクロエレクトロニクス株式会社 温度制御装置
JP4315141B2 (ja) 2005-09-09 2009-08-19 セイコーエプソン株式会社 電子部品の温度制御装置並びにハンドラ装置
JP5552452B2 (ja) * 2011-03-04 2014-07-16 パナソニック株式会社 加熱冷却試験方法および加熱冷却試験装置
EP2782666B1 (de) 2011-11-24 2016-02-03 Wintershall Holding GmbH Derivate von tris(2-hydroxyphenyl)methanen, deren herstellung und verwendung für die erdölförderung
GB2507732A (en) * 2012-11-07 2014-05-14 Oclaro Technology Ltd Laser temperature control
DE102013010088A1 (de) 2013-06-18 2014-12-18 VENSYS Elektrotechnik GmbH Kühlvorrichtung für ein Stromumrichtermodul
JP2018523122A (ja) * 2015-07-21 2018-08-16 デルタ・デザイン・インコーポレイテッドＤｅｌｔａ Ｄｅｓｉｇｎ， Ｉｎｃ． 連続的な流体熱界面材料の分配
KR200494784Y1 (ko) * 2018-11-06 2021-12-28 김진국 세정기
CN113412031A (zh) * 2021-06-21 2021-09-17 合肥联宝信息技术有限公司 一种升温模组及电子设备
AU2022204614A1 (en) * 2021-08-27 2023-03-16 Ametek, Inc. Temperature dependent electronic component heating system

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3979671A (en) * 1975-03-06 1976-09-07 International Business Machines Corporation Test fixture for use in a high speed electronic semiconductor chip test system
JPS5961027A (ja) * 1982-09-29 1984-04-07 Toshiba Corp 半導体基板加熱装置
JPS5986235A (ja) * 1982-11-09 1984-05-18 Shimada Phys & Chem Ind Co Ltd 半導体基板の電気的特性測定方法
US4567505A (en) * 1983-10-27 1986-01-28 The Board Of Trustees Of The Leland Stanford Junior University Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
US4854726A (en) * 1986-05-29 1989-08-08 Hughes Aircraft Company Thermal stress screening system
JPH07105422B2 (ja) * 1987-03-16 1995-11-13 東京エレクトロン株式会社 半導体ウエハ載置台
BE1000697A6 (fr) * 1987-10-28 1989-03-14 Irish Transformers Ltd Appareil pour tester des circuits electriques integres.
JPH01152639A (ja) * 1987-12-10 1989-06-15 Canon Inc 吸着保持装置
US4848090A (en) * 1988-01-27 1989-07-18 Texas Instruments Incorporated Apparatus for controlling the temperature of an integrated circuit package
US4962416A (en) * 1988-04-18 1990-10-09 International Business Machines Corporation Electronic package with a device positioned above a substrate by suction force between the device and heat sink
US4975766A (en) * 1988-08-26 1990-12-04 Nec Corporation Structure for temperature detection in a package
US4975803A (en) * 1988-12-07 1990-12-04 Sundstrand Corporation Cold plane system for cooling electronic circuit components
JP3201868B2 (ja) * 1992-03-20 2001-08-27 アジレント・テクノロジーズ・インク 導電性熱インターフェース及びその方法
JPH05267200A (ja) * 1992-03-24 1993-10-15 Hitachi Ltd 半導体熱処理装置
US5448147A (en) * 1992-05-08 1995-09-05 Tel-Varian Limited Selectable feedback control system
US5420521A (en) 1992-10-27 1995-05-30 Ej Systems, Inc. Burn-in module
JP3067480B2 (ja) * 1993-08-26 2000-07-17 三菱自動車工業株式会社 レーザ焼入れ用レーザ吸収剤
JPH08286551A (ja) * 1995-04-12 1996-11-01 Ricoh Co Ltd 温度制御装置
GB9610663D0 (en) * 1996-05-22 1996-07-31 Univ Paisley Temperature control apparatus and methods

Also Published As

Publication number Publication date
JP4077523B2 (ja) 2008-04-16
WO1998046059A1 (en) 1998-10-15
EP2086306A1 (en) 2009-08-05
DE69818468D1 (de) 2003-10-30
EP2086306B1 (en) 2013-06-05
EP1016337A1 (en) 2000-07-05
DE69822158T2 (de) 2005-02-17
EP0994645A3 (en) 2000-07-12
EP1016337B1 (en) 2008-05-21
JP2005249798A (ja) 2005-09-15
EP0994645A2 (en) 2000-04-19
EP0993243B1 (en) 2004-03-03
JP2008118149A (ja) 2008-05-22
EP0993243A2 (en) 2000-04-12
DE69818468T2 (de) 2004-07-22
JP4122009B2 (ja) 2008-07-23
EP0993243A3 (en) 2000-07-12
EP0994645B1 (en) 2003-09-24
DE69822158D1 (de) 2004-04-08
JP2001526837A (ja) 2001-12-18

Similar Documents

Publication Publication Date Title
DE59802499D1 (de) Hitzeschutzmantel für ein elektronisches Gerät
DE69839520D1 (de) Temperaturregelvorrichtung fuer ein elektronisches bauelement
DE60045500D1 (de) Anzeigesteuerung für ein elektronisches Gerät
DE69728004D1 (de) Temperaturregelung für elektronische Schaltkreise
DE69841264D1 (de) Elektronisches Gerät
GB2335079B (en) Switch assembly for an electronic device
DE69807447D1 (de) Einrichtung zur montage von elektronischen bauteilen
DE69710714D1 (de) Elektronische bauteile bestückungsvorrichtung
DE69837571D1 (de) Batterieeinheit für ein elektronisches Gerät
DE69832954D1 (de) Temperaturmessschaltung
NO972555L (no) Anordning for innstallering av et langstrakt element
DE69822927D1 (de) Einrichtung zur montage von elektronischen bauteilen
DE69818335D1 (de) Regelvorrichtung für Heizelement
DE59814138D1 (de) Elektronisches steuergerät
DE69839037D1 (de) Elektronisches Kamerasystem
DE69724972D1 (de) Elektronisches Gerät
DE59806127D1 (de) Elektronisches steuergerät
DE69835583D1 (de) Zuführungseinrichtung von elektronischen bauteilen
DE69841091D1 (de) Steuervorrichtung für selbstlöschendes leistungselement
DE69805134D1 (de) Steuerungsschaltung für ein elektrolumineszentes Element
DE69924550D1 (de) Transfervorrichtung für ein elektrisches Bauteil
DE59809822D1 (de) Bedienelement für elektronische geräte
DK0907231T3 (da) Anordning til fastgørelse af elektriske eller elektroniske komponenter
ATA96199A (de) Steuereinrichtung für ein elektronisches installationsgerät
FI973731L (fi) Lämpötilakompensointi elektroniikkalaitteissa

Legal Events

Date Code Title Description
8364 No opposition during term of opposition