DE69807447D1 - Einrichtung zur montage von elektronischen bauteilen - Google Patents

Einrichtung zur montage von elektronischen bauteilen

Info

Publication number
DE69807447D1
DE69807447D1 DE69807447T DE69807447T DE69807447D1 DE 69807447 D1 DE69807447 D1 DE 69807447D1 DE 69807447 T DE69807447 T DE 69807447T DE 69807447 T DE69807447 T DE 69807447T DE 69807447 D1 DE69807447 D1 DE 69807447D1
Authority
DE
Germany
Prior art keywords
electronic components
assembling electronic
assembling
components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69807447T
Other languages
English (en)
Other versions
DE69807447T2 (de
Inventor
Eiichi Hachiya
Akira Noudo
Atsushi Tanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69807447D1 publication Critical patent/DE69807447D1/de
Publication of DE69807447T2 publication Critical patent/DE69807447T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part
DE69807447T 1997-03-12 1998-03-11 Einrichtung zur montage von elektronischen bauteilen Expired - Lifetime DE69807447T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP05742197A JP3893184B2 (ja) 1997-03-12 1997-03-12 電子部品実装装置
PCT/JP1998/001035 WO1998041078A1 (en) 1997-03-12 1998-03-11 Electronic component mounting apparatus

Publications (2)

Publication Number Publication Date
DE69807447D1 true DE69807447D1 (de) 2002-10-02
DE69807447T2 DE69807447T2 (de) 2003-04-24

Family

ID=13055197

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69807447T Expired - Lifetime DE69807447T2 (de) 1997-03-12 1998-03-11 Einrichtung zur montage von elektronischen bauteilen

Country Status (7)

Country Link
US (1) US6211958B1 (de)
EP (1) EP0966871B1 (de)
JP (1) JP3893184B2 (de)
KR (1) KR100497636B1 (de)
CN (1) CN1112091C (de)
DE (1) DE69807447T2 (de)
WO (1) WO1998041078A1 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001053496A (ja) * 1999-08-06 2001-02-23 Matsushita Electric Ind Co Ltd 電子部品実装方法
JP2001094300A (ja) * 1999-08-18 2001-04-06 Universal Instruments Corp ミラーを使用して部品の画像を採取する方法及び装置
JP4031645B2 (ja) * 2002-01-09 2008-01-09 松下電器産業株式会社 部品装着装置及び部品装着方法
JP4041768B2 (ja) * 2002-09-12 2008-01-30 松下電器産業株式会社 部品装着ヘッド
JP2004186175A (ja) * 2002-11-29 2004-07-02 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置及び電子部品装着方法
JP4147923B2 (ja) * 2002-12-03 2008-09-10 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
JP4244696B2 (ja) * 2003-05-13 2009-03-25 パナソニック株式会社 部品実装機
WO2004103053A1 (ja) * 2003-05-13 2004-11-25 Matsushita Electric Industrial Co., Ltd. 部品実装機
JP4387745B2 (ja) * 2003-09-30 2009-12-24 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
KR100552884B1 (ko) * 2003-11-04 2006-02-20 티디케이가부시기가이샤 전자 부품을 장착하기 위한 장치 및 방법
DE102004052884B4 (de) * 2004-11-02 2010-05-20 Siemens Electronics Assembly Systems Gmbh & Co. Kg Beleuchtungsanordnung und optisches Meßsystem zum Erfassen von Objekten
CN100559927C (zh) 2005-03-10 2009-11-11 松下电器产业株式会社 元件贴装方法和贴装器
EP1864563B1 (de) * 2005-03-29 2013-07-24 Panasonic Corporation Verfahren zur erkennung der bauelementform und verfahren zur bauelementbestückung
JP4722714B2 (ja) * 2006-01-27 2011-07-13 Ｊｕｋｉ株式会社 電子部品実装機
DE102006027663A1 (de) * 2006-06-14 2008-01-03 Siemens Ag Optisches Inspektionssystem zur Vermessung von elektronischen Bauelementen
JP5027058B2 (ja) * 2008-06-10 2012-09-19 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP5561056B2 (ja) * 2010-09-15 2014-07-30 ソニー株式会社 光照射装置、部品撮像装置及び部品実装装置
JP5854501B2 (ja) * 2011-11-17 2016-02-09 東レエンジニアリング株式会社 自動外観検査装置
CN102628966B (zh) * 2012-04-14 2014-06-11 河北德泽泰尔电子科技有限公司 膨胀螺栓的膨胀管开口端识别传感器
US9015928B2 (en) 2013-07-25 2015-04-28 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting apparatus
US9491411B2 (en) 2013-07-25 2016-11-08 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
US9332230B2 (en) 2013-07-25 2016-05-03 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
US20150029330A1 (en) * 2013-07-25 2015-01-29 Panasonic Corporation Electronic component mounting apparatus and electronic component mounting method
JP6466960B2 (ja) * 2014-11-13 2019-02-06 株式会社Ｆｕｊｉ 装着機及び装着機を用いた電子部品の吸着姿勢検査方法
DE102014117369B3 (de) * 2014-11-26 2016-02-11 Asm Assembly Systems Gmbh & Co. Kg Datenaustausch an einem Bestückkopf eines Bestückautomaten
KR102464227B1 (ko) * 2016-03-02 2022-11-09 주식회사 탑 엔지니어링 카메라 모듈 검사 장치
CN108243602A (zh) * 2017-01-06 2018-07-03 广东华志珹智能科技有限公司 一种屏蔽盖贴片机图像识别系统及方法
US10620608B2 (en) * 2017-03-07 2020-04-14 Raytheon Company Collet contrast disk
CN111133851B (zh) 2017-09-28 2022-03-04 环球仪器公司 拾放机器、视觉系统和对元件进行照明的方法
CN109874235B (zh) * 2017-12-01 2020-09-08 台达电子工业股份有限公司 电子元件组装系统和方法
KR102350544B1 (ko) * 2020-10-14 2022-01-17 주식회사 지엠지 반도체 패키징 검사공정용 광학모듈

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628464A (en) * 1983-10-07 1986-12-09 Westinghouse Electric Corp. Robotic system for mounting electrical components
US4812666A (en) * 1987-09-17 1989-03-14 Universal Instruments Corporation Position feedback enhancement over a limited repositioning area for a moveable member
JPH0824234B2 (ja) * 1990-01-24 1996-03-06 松下電器産業株式会社 電子部品の吸着装置
EP0449481B1 (de) * 1990-03-19 1996-01-31 Hitachi, Ltd. Vorrichtung und Verfahren zum Transport von Bauteilen
US5420691A (en) * 1991-03-15 1995-05-30 Matsushita Electric Industrial Co., Ltd. Electric component observation system
US5260779A (en) * 1992-02-21 1993-11-09 Control Automation, Inc. Method and apparatus for inspecting a printed circuit board
US5741114A (en) * 1992-08-07 1998-04-21 Yamaha Hatsudoki Kabushiki Kaisha Method for mounting components and apparatus therefor
JP2554431B2 (ja) * 1992-11-05 1996-11-13 ヤマハ発動機株式会社 実装機の部品吸着状態検出装置
JP3186387B2 (ja) * 1993-12-17 2001-07-11 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
JPH08205004A (ja) * 1995-01-27 1996-08-09 Copal Co Ltd 撮像装置

Also Published As

Publication number Publication date
CN1250589A (zh) 2000-04-12
JP3893184B2 (ja) 2007-03-14
WO1998041078A1 (en) 1998-09-17
EP0966871B1 (de) 2002-08-28
EP0966871A1 (de) 1999-12-29
DE69807447T2 (de) 2003-04-24
CN1112091C (zh) 2003-06-18
KR100497636B1 (ko) 2005-07-01
US6211958B1 (en) 2001-04-03
JPH10256790A (ja) 1998-09-25
KR20000075886A (ko) 2000-12-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)