SG11202001912YA - Improved lead tip illumination device, system, and method - Google Patents

Improved lead tip illumination device, system, and method

Info

Publication number
SG11202001912YA
SG11202001912YA SG11202001912YA SG11202001912YA SG11202001912YA SG 11202001912Y A SG11202001912Y A SG 11202001912YA SG 11202001912Y A SG11202001912Y A SG 11202001912YA SG 11202001912Y A SG11202001912Y A SG 11202001912YA SG 11202001912Y A SG11202001912Y A SG 11202001912YA
Authority
SG
Singapore
Prior art keywords
illumination device
lead tip
improved lead
tip illumination
improved
Prior art date
Application number
SG11202001912YA
Inventor
George Eck
Original Assignee
Universal Instruments Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universal Instruments Corp filed Critical Universal Instruments Corp
Publication of SG11202001912YA publication Critical patent/SG11202001912YA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
SG11202001912YA 2017-09-28 2018-09-27 Improved lead tip illumination device, system, and method SG11202001912YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762564516P 2017-09-28 2017-09-28
PCT/US2018/053011 WO2019067657A1 (en) 2017-09-28 2018-09-27 Improved lead tip illumination device, system, and method

Publications (1)

Publication Number Publication Date
SG11202001912YA true SG11202001912YA (en) 2020-04-29

Family

ID=65902024

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202001912YA SG11202001912YA (en) 2017-09-28 2018-09-27 Improved lead tip illumination device, system, and method

Country Status (6)

Country Link
US (1) US11412650B2 (en)
JP (1) JP7265531B2 (en)
KR (1) KR102514685B1 (en)
CN (1) CN111133851B (en)
SG (1) SG11202001912YA (en)
WO (1) WO2019067657A1 (en)

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CN1008003B (en) * 1985-04-01 1990-05-16 欧文斯-伊利诺衣公司 System for detecting selective refractive defects in transparent articles
JPH0810795B2 (en) * 1989-09-06 1996-01-31 松下電器産業株式会社 Electronic component mounting apparatus and mounting method
US5200799A (en) * 1989-09-12 1993-04-06 Matsushita Electric Industrial Co., Ltd. System for optically inspecting conditions of parts packaged on substrate
US5420691A (en) * 1991-03-15 1995-05-30 Matsushita Electric Industrial Co., Ltd. Electric component observation system
JP2682292B2 (en) * 1991-09-12 1997-11-26 松下電器産業株式会社 Parts insertion device
JPH05114798A (en) * 1991-10-24 1993-05-07 Fujitsu Ltd Automatic lsi mounting device and detection method of mounted lsi
US5347431A (en) 1991-12-20 1994-09-13 Blackwell Ray A Lighting system and camera for operating room
JP2918776B2 (en) 1993-05-19 1999-07-12 ライトコミュニケーション株式会社 Automatic writing apparatus and lighting method using the same
US5697699A (en) 1993-09-09 1997-12-16 Asahi Kogaku Kogyo Kabushiki Kaisha Lighting apparatus
US5515253A (en) 1995-05-30 1996-05-07 Sjobom; Fritz C. L.E.D. light assembly
US5690417A (en) 1996-05-13 1997-11-25 Optical Gaging Products, Inc. Surface illuminator with means for adjusting orientation and inclination of incident illumination
US6106124A (en) 1996-06-20 2000-08-22 Tarsia; Joseph Self-contained photo studio lighting apparatus
JP3893184B2 (en) 1997-03-12 2007-03-14 松下電器産業株式会社 Electronic component mounting equipment
US5897195A (en) 1997-12-09 1999-04-27 Optical Gaging, Products, Inc. Oblique led illuminator device
US6031242A (en) * 1998-01-23 2000-02-29 Zevatech, Inc. Semiconductor die in-flight registration and orientation method and apparatus
US20010048469A1 (en) * 1998-03-18 2001-12-06 George D. Eck Method and apparatus for illuminating downwardly extending features on electronic components or mechanical devices
US6160906A (en) * 1998-06-01 2000-12-12 Motorola, Inc. Method and apparatus for visually inspecting an object
JP2000121338A (en) * 1998-10-13 2000-04-28 Yamagata Casio Co Ltd Electronic component inspecting device
US6582090B1 (en) * 1999-08-27 2003-06-24 Delaware Capital Formation Method and apparatus for illuminating leads of a component
US6352349B1 (en) 2000-03-24 2002-03-05 United Parcel Services Of America, Inc. Illumination system for use in imaging moving articles
JP4041768B2 (en) * 2002-09-12 2008-01-30 松下電器産業株式会社 Component mounting head
EP1612569A3 (en) * 2004-06-30 2006-02-08 Omron Corporation Method and apparatus for substrate surface inspection using multi-color light emission system
US20060075631A1 (en) * 2004-10-05 2006-04-13 Case Steven K Pick and place machine with improved component pick up inspection
JP4896136B2 (en) * 2005-09-14 2012-03-14 サイバーオプティクス コーポレーション Pick and place machine with improved component pick image processing
WO2008124397A1 (en) * 2007-04-03 2008-10-16 David Fishbaine Inspection system and method
NO328737B1 (en) * 2007-08-31 2010-05-03 Tordivel Solar As Method and apparatus for inspecting objects
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US20130094215A1 (en) 2011-04-04 2013-04-18 Robe Lighting S.R.O. Light collection system for a luminaire
JP5830644B2 (en) * 2011-12-06 2015-12-09 パナソニックＩｐマネジメント株式会社 Underpinning pin arrangement determination device and underpinning pin arrangement determination method
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WO2015071929A1 (en) * 2013-11-13 2015-05-21 ヤマハ発動機株式会社 Component image pickup apparatus and surface-mounting apparatus using same

Also Published As

Publication number Publication date
JP7265531B2 (en) 2023-04-26
KR102514685B1 (en) 2023-03-27
WO2019067657A1 (en) 2019-04-04
CN111133851A (en) 2020-05-08
JP2020536371A (en) 2020-12-10
CN111133851B (en) 2022-03-04
KR20200074133A (en) 2020-06-24
US20200260620A1 (en) 2020-08-13
US11412650B2 (en) 2022-08-09

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