JPH05114798A - Automatic lsi mounting device and detection method of mounted lsi - Google Patents

Abstract

PURPOSE:To provide a PGA type LSI automatic mounting device and a method of detecting an LSI loaded on the mounting device, whereby an LSI of PGA type can be automatically mounted and an automatic mounting device can be enhanced in reliability. CONSTITUTION:A suction hand 6 is made to move right and left by a robot unit 7. The deviation of an LSI sucked to the suction hand 6 in both position and attitude is detected by a first optical unit 12 while the LSI moves. The first optical unit 12 is equipped with a light source which illuminates the tips of a signal pin and an index pin from the side of the LSI and an image sensing device and takes advantage of the reflected light of illuminating light. Illuminating light is turned into slits to irradiate only the tip of the pin at the detection of the signal pin and the index pin, small windows arrayed in matrix are utilized, and the position of the center of gravity the deviation of the LSI in center position is corrected by rectilinear recursion basing on the center of gravity of a pin tip image.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for automatically mounting a PGA (pinglit array) type LSI on a substrate,
The present invention relates to a method of detecting a mounted LSI in the device.

[0002]

2. Description of the Related Art FIG. 15 is an external view of an LSI.
Are side and bottom views of a QFP type LSI, and (c) and (d) are side and bottom views of a PGA type LSI. QFP
The lead terminal 2 of the type LSI 1 is L-shaped and protrudes to the side of the package. The signal pin 4 and the index pin 4a of the PGA type LSI 3 are aligned with and protrude from the lower surface of the package. However, the index pin 4a for recognizing the attitude (orientation) of the LSI 3 is discriminated from the array of the signal pins 4.

Conventionally, a device for automatically mounting a QFA type LSI 1 has already been used. LS in that device
I1 is a method of illuminating the lead terminals 2 from above and recognizing the arrangement of the lead terminals 2 from below by the imaging device.

Therefore, even if an attempt is made to recognize the PGA type LSI 3 in the same manner as the QFA type LSI 1, the arrangement of the pins 4 and 4a cannot be detected. Therefore, PG
There was no device for automatically mounting the A type LSI3.

[0005]

However, recently, as the performance of integrated circuit devices has increased, PGA type LSIs have been developed.
As the number of pins has increased and the pin arrangement has become higher in density and the number of pins has increased, there has been a strong demand for solving the non-productivity of the work of manually mounting the PGA type LSI.

[0006]

According to FIG. 1, an apparatus of the present invention for solving the above problems is taken out from an LSI stocker unit 8 for storing a plurality of PGA type LSIs by type and a stocker unit 8. A suction hand 6 that sucks the upper surface of a predetermined LSI, a robot unit 7 that moves the suction hand 6 in three directions of left, right, front and back, and up and down, and that rotates the suction hand 6 around its vertical axis. A first optical system unit for detecting a signal pin and an index pin of the suction LSI of the suction hand 6 at an intermediate portion for moving 6 in the left-right direction.
12, a board holder unit 11 for fixing the LSI mounting board,
The first optical system unit 12 is provided with the second optical system unit 13 for detecting the LSI mounting position mark provided on the substrate.
Includes a light source for laterally illuminating the tip of the signal pin and the index pin protruding from the lower surface of the LSI, and the LS.
The robot unit 7 is provided with an image pickup device for picking up images of the signal pins and the index pins protruding on the lower surface of I, and the robot unit 7 includes the signal pin arrangement information detected by the first optical system unit 12 and the index pin position information. , Second
And a control unit 64 for operating the robot unit 7 according to the displacement with respect to the mounting position mark detected by the optical system unit 13, and the substrate holder unit 7 is provided with a support for supporting the back surface peripheral end portions on two sides of the mounting substrate. It is characterized in that it is provided with a table, a clamp for pressing the other peripheral edge of the other surface of the mounting board from above, and a plurality of backup pins which are in contact with the back surface of the mounting board and are detachable.

According to FIG. 8 showing an embodiment of the detection method according to the present invention, in the first optical system unit 12,
A laser device 61 is used as a light source, and a laser beam 62 emitted from the laser device 61 is formed in a slit shape that is inclined at an appropriate angle with respect to the lower surface of the LSI 3 adsorbed by the adsorption hand 6,
Pin 4 and index pin derived from the bottom surface of 3
It is characterized in that only the tip of 4a is illuminated. Furthermore, the figure
As shown in FIG. 12, an index pin image detection window is set by using the image processing device of the first optical system unit 12, and the window is composed of a plurality of small windows centering on the small window X where the index pin image should be located. A ~ H
Are arranged in a matrix, and when the index pin image is deviated from the small window X and detected, the window is moved in the deviated direction to detect the deviating direction of the index pin. Further, the correct position of the center of the LSI sucked by the suction hand 6 is taught to the image processing device 63 in advance, and the first optical system unit 12 and the image processing device 63 are taught.
Is used to detect the arrangement of the signal pins of the LSI, calculate the actual position of the center of the LSI from the detection information, and operate the robot unit so that the actual position overlaps the pre-instructed central position. It is what

[0008]

According to the above means, the signal pin and the index pin of the LSI sucked by the suction hand 6 can be imaged by illuminating from the side, and only the tip of the pin is illuminated, and The detection accuracy is improved by imaging only the part. In addition, the board holder unit is configured to backup the back surface of the LSI mounting board at a plurality of points with backup pins, so that the LSI can be automatically mounted on the board on which components are mounted on the back surface and the board having low mechanical strength. Become.

[0009]

1 is a perspective view showing the entire structure of an automatic LSI mounting machine according to an embodiment of the present invention, 5 is an automatic LSI mounting machine, 6 is a suction hand for sucking a PGA type LSI to be mounted, and 7 is Robot unit for driving the suction hand, 8 is an LSI stocker unit that accommodates a large number of LSIs of a plurality of types, 9 is an LSI pallet that accommodates (mounts) a large number of LSIs of the same type and is accommodated in the stocker unit 8, and 10 is a A pallet supply unit that draws out a desired pallet 9 from the stocker unit 8, 11 is a substrate holder unit that clamps a substrate on which an LSI is to be mounted, 12 is a first optical system unit that recognizes the LSI adsorbed by the adsorption hand 2, and 13 is LS
Second optical system unit for detecting the LSI mounting position of the substrate on which I is to be mounted, 14 is a vibration isolation unit, 15 is a table unit on which the substrate holder unit 11 is mounted, and 16 is a driver for moving the table unit 15 back and forth. Unit, 17
Is a sequencer unit, and 37 is a light source device of the second optical system unit 13.

The suction hand 6 for sucking the upper surface of the LSI for transporting a predetermined LSI to the LSI mounting substrate is moved in three axial directions of left, right, front and back, and up and down by operating the robot unit 7, and the suction hand 6 moves. Rotate around a vertical axis.

The stocker unit 8 accommodates a plurality of pallets 9 on which a plurality of types and a large number of LSIs are mounted by type, and moves up and down so that the pallet supply unit 5 can pull out the required pallets 9.

FIG. 2 is a detailed view of the optical system unit 12,
3 is a PGA type LSI sucked by the suction hand 6,
4 is a large number of signal pins protruding from the bottom surface of the LSI 3, 19
Is a holder for holding the laser light source device 18, 20 is a screw for adjusting the inclination of the holder 19 with respect to a vertical plane, 21 is a stage on which the holder 17 is mounted and rotatable in a horizontal plane, and 22 is an image pickup device (CCD
Camera), 23 is a lens system of the imaging device 22, 63 is the imaging device 22
It is a processing device for the image captured in.

Laser light 24 emitted from the pair of laser light source devices 18 is applied obliquely downward to the lower surface of the LSI 3. The tip surface image of the pin 4 illuminated by the laser beam 24 is a lens system.
When the image is picked up by the image pickup device 22 via the image pickup device 22, the position of the index pin 4a (see FIG. 15) is detected by the image pickup processing device 63, and the suction state (position of the index pin 4a) of the LSI 3 is not correct, the suction hand 6 moves. It rotates to correct the suction posture.

FIG. 3 is a perspective view of the suction hand moving robot unit. The robot unit 7 that moves the suction hand 6 in the three axial directions and rotates the suction hand 6 around its vertical axis is the suction hand 6. , Rotation unit 25
Is equipped with a Z-axis unit 26 that moves the Z-axis unit 26 in the vertical direction. The Z-axis unit 26 is attached to a Y-axis unit 27 that moves the Z-axis unit 26 in the front-back direction.
Is attached to the X-axis unit 28 that moves the right and left.

FIG. 4 is an explanatory view of the mounting structure of the suction hand, in which a rotary member 30 which rotates together with the rotary shaft 29 is mounted on the rotary shaft 29 of the rotary unit 25, and the suction hand 6 has three units. One guide shaft 31, one compression coil spring 32, one disc 33
By this, for example, it is attached to a suction hand holder 34 that can move up and down by about 10 mm. An intake hole is opened in the center of the suction hand 6, and the intake hole communicates with an intake air tube 36 connected to an intake pump (not shown) through an L-shaped joint 35.

FIG. 5 is an explanatory view of the mounting structure of the second optical system unit, which includes an image pickup device (CCD camera) 38 and an optical system 3.
9. The optical system unit 13 including the annular illuminator 40 and the like is mounted on the Y-axis unit 27, and the optical system unit 13 and the Z-axis unit 26 face each other in the left-right direction with the Y-axis unit 27 interposed therebetween.

FIG. 6 is a perspective view of the substrate holder unit, and FIG.
[Fig. 4] is a side view (a) in which the LSI mounting board is fixed to the board holder unit and an explanatory view (b) of the backup pin insertion structure. 6 and 7, the substrate holder unit 11 mounts the substrate mounting base plate 41 on the table unit 15 which is movable in the front-rear direction. On the upper surface of the base plate 41, a stopper 43 with which the front end surface of the LSI mounting board 42 abuts, a base 44 for supporting the lower surface of the right end portion of the board 42, and a pin protruding from the lower surface of the board 46 in which the backup pin 45 is vertically inserted. Hole 4 for 47
8, a groove 49 extending in the left-right direction, and a pair of L-shaped metal fittings 50 located at both ends of the base 44 in the length direction.

A sliding plate 51, which is guided by the pair of grooves 49 and is slidable in the left-right direction and fixed, is provided with a base 52 for supporting the lower surface of the left end portion of the substrate 42, and at both end portions in the longitudinal direction of the base 52. A pair of L-shaped metal fittings 53 are attached.

One of the L-shaped metal fittings 50 and 53 (front one)
Is equipped with a rotary actuator 54, and the rotary actuator 54 is mounted on a pair of L-shaped metal fittings 50 or 53.
The clamp plate 55, which can be rotated by the rotary actuator 54, presses the left and right ends of the substrate 42 against the upper surfaces of the bases 44 and 52 as shown in FIG.
Fix 42.

A vertically movable clamp 56 is provided at the rear end of the base plate 41 so that the rear end of the substrate 42 mounted on the bases 44 and 52 can be pushed down. The backup plate 46 inserted in the upper surface of the base plate 41 and the backup pin 45 inserted in the backup plate 46 are both removable, and when the substrate 42 is fixed to the bases 44 and 52, the backup pin The tip of 45 is almost in contact with the back surface of the substrate 42, and the substrate 42 is pressed against the pressing force for mounting the LSI 3 on the substrate 42.
Back up.

Automatic LSI mounting machine 5 configured as described above
Is a control device (personal computer) in which the pallet 9 into which the required LSI is inserted is stored in the stocker unit 8 and the type, number, mounting position and mounting orientation (direction) of the LSI to be mounted on the board 42, and the mounting sequence are not shown. Type in
After fixing the substrate 42 to the substrate holder unit 6, LS
When the I mounting work is started, the operations are performed in the following order.

First, the stocker unit 8 moves up and down, the required pallet 9 is pulled out by the pallet supply unit 10, and the LSI to be mounted is positioned at a predetermined position. Almost at the same time, the suction hand 6 is positioned above the LSI to be mounted by the operation of the robot unit 7.

Next, the suction hand 6 descends to a predetermined L
After SI is adsorbed, it rises and conveys the adsorbed LSI to the optical unit 12. Then, the optical unit 12 determines whether the LSI sucked by the suction hand 6 is a predetermined one,
Posture (whether the index pin is in place)
Etc. are detected via the image pickup device 22, and the robot unit 7 is operated as necessary to correct the posture and the like of the suction LSI. At that time, if there is an abnormality in the pin arrangement of the LSI (bending of the signal pin 4, etc.), the suction LSI is returned to the original pallet 9 and the new LSI is suctioned.

Next, when the suction hand 6 moves to a position above the substrate holder unit 11, the optical unit 13 detects the LSI mounting position (mounting position mark) of the substrate 42 and operates the robot unit 7 to mount the LSI on the substrate 42. Mount. At this time, if the suction LSI is displaced from the LSI mounting position on the substrate 42, the robot unit 7 is operated so as to correct the displacement.

Hereinafter, the substrate 42 is repeated by repeating the above operation.
A plurality of necessary LSIs will be mounted in sequence. FIG. 8 is an explanatory diagram of a method for recognizing an adsorption LSI according to the present invention, and FIG. 9 is an explanatory diagram of the laser light source shown in FIG.

In FIG. 8, 60 is a cooling fin joined to the upper surface of the LSI 3, 61 is a laser light source for emitting a laser beam 62 having a spread in the thickness direction of the drawing sheet, and 63 is an image captured by the image pickup device 22. An image processing device 64 and a robot unit controller 64, and the suction hand 6 sucks the upper surface of the cooling fin 60.

As shown in FIG. 9, a laser light source 61 for irradiating the tip ends of a plurality of pins 4 protruding from the lower surface of the LSI 3 and not irradiating the lower surface of the package of the LSI 3 includes a semiconductor laser device 71, a convex lens 72, and a convex lens 72. Cylindrical lens
73 is housed in a housing 74, and the semiconductor laser device 71 is connected to a semiconductor laser drive power source (not shown).

The elliptical laser light 62 emitted from the laser light source 61 is converted into a point light by using the lens 72 so that only the tip portion of the pin 4 is irradiated, and then the cylindrical lens 73 is used. Irradiation is performed obliquely from below at an appropriate inclination angle with respect to the horizontal plane, for example, an angle of about 1 to 3 °, which is a slit shape that spreads only in one direction.

FIG. 10 is a plan view of an embodiment in which the LSI is irradiated with laser light from four directions. When laser light 62 is irradiated from the laser light sources 61 arranged on four sides of the LSI3 to the tip portion of the pin 4 of the LSI3, The image of the tip portion of the pin 4 becomes clearer than that obtained by irradiating the laser beam 62 from two sides.

The tip portion image of the pin 4 obtained as described above is captured by the image pickup device 22 and taken into the image processing device 63, and the image processing device 63 displays the tip portion image of the pin 4 and the background portion image. Is binarized to separate the two. that time,
Since the brightness of the picked-up image is different every time due to the change of the light amount of the laser light 62 and the like, it is necessary to set the binarization threshold to a value for extracting only the tip end image of the pin 4.

Therefore, in the embodiment of the present invention, the binarization level automatic setting method using the grayscale histogram is used. Figure 11
Is a grayscale histogram of the pin tip image, where the horizontal axis is the grayscale level and the vertical axis is the frequency. In Fig. 11, the brightness at which the frequency peak of the dark background portion (package surface) is PL is BL, and the bright pin is When the brightness at which the frequency peak at the tip portion becomes PH is BH, the binarization level B is defined as B = BL + (BH-BL) * P / 100, and the frequency P between the bright / dark histogram peaks is P. (%)
Is designated, the binarization level B for separating the pin tip portion image from the background portion image, for example, P = (%) is set to 2
The value level B is determined.

Further, the image pickup device 22 and the image processing device 63 are
The presence or absence of the index pin 4a provided at one corner of SI3 is discriminated to detect in what attitude the suction hand 6 is sucking the LSI3.

Therefore, the position of the index pin 4a within the field of view of the image pickup device 22 has been taught to the image processing device 63 in advance. If the index pin 4a is not present at that position, the position of the index pin 4a is controlled via the control device 64 and the robot unit 7. The LSI 3 (suction hand 6) is rotated by 90 °, and if it still does not appear, it is further rotated by 90 °, 180 ° so that the image of the index pin 4a appears at the taught position.

In detecting the position of the index pin 4a, if all the signal pins 4 are placed in the visual field of the image pickup device 22, the resolution of the image processing is lowered.
As shown in (a), the imaging visual field 75 captures one corner of the lower surface of the LSI 3, thereby preventing the detection resolution from deteriorating. In this case, the image of the index pin 4a may not be included in the visual field 75.

Therefore, for example, when the index pin 4a is not detected by the first imaging, the LSI 3 is
Rotate by 90 ° so that the index pin 4a is captured within the field of view 75.

Further, due to the variation between the central axis of the suction hand 6 and the center of the LSI 3 sucked by the suction hand 6,
The position of the index pin 4a is displaced from the teaching position.
Therefore, it is necessary to detect and correct the shift amount. Next, the recognition algorithm of the index pin 4a will be described.

(1) In order to recognize the index pin 4a, a movable window (index pin detection zone) is set within the imaging visual field using the image processing device 63.
Many signal pins 4 and index pins 4 of LSI3
When the arrangement interval of a is 1.27 mm, the window is shown in Fig. 12 (b).
As shown in, small windows A to H, X measuring 1.27mm x 1.27mm
Is a matrix in which three windows are vertically and horizontally arranged and the windows A to H surround the central window X where the index pin 4a should be located.

Furthermore, 1 is in the same row as the index pin 4a.
The signal pin 4 is located at a pitch, for example, there is an index pin 4a corresponding to the window X, and the window E
LS having no signal pin 4 corresponding to G and having signal pin 4 outside window E or outside window G
For I3, windows (hatched portions) E'and G'corresponding to a part of the windows D to F and F to H are set.

(2) The image detection range in a window is a rectangular area including window boundaries such as windows B, C, D or B, A, H, and images on adjacent window boundaries are both Enabled in windows.

(3) Since the image of the index pin 4a protruding from the window X is detected, the boundary positions a to h of the windows A to H with respect to the window X are detected as shown in FIG.
To set.

Therefore, the flow of detecting the index pin 4a is as follows. (1) The detection process is performed on the binarized imaging in each of the windows A to H, X. (2) If the imaging does not exist in the window X, the process ends with an error without the index pin 4a. (3) There is imaging within the area judgment value in the window X that does not include the window boundary, and the window E,
If there is no image pickup in F and G, the image pickup detection ends with the center of gravity in the window X as the index pin 4a. Otherwise, (4) the image pickup in the window X covers only the boundary a, and If there are no images in windows F and G,
Move the entire processing window by 1/2 pitch (0.635 mm) in the direction of a and return to 1), otherwise (5) Imaging in window X is limited to boundary c, and windows E and F
If there is no imaging in, the entire processing window will be 1/2 in the c direction
Move pitch (0.635mm) and go back to 1), otherwise
(6) If the image pickup in the window X overlaps the boundary e, does not overlap the boundary g, and there is no image pickup in the window F, the entire processing window is ½ pitch (0.635 m) in the e direction.
m) Move to return to (1), otherwise (7) If the image pickup in the window X falls on the boundary g, does not fall on the boundary e, and there is no image pickup in the window F, the processing window Move the whole unit by 1/2 pitch (0.635mm) in g direction
Return to (1). Otherwise, (8) If the image pickup in window X is only on the boundary b and there is no image pickup in window F, the entire processing window is 1/2 pitch in the b direction.
Move (0.635mm) back to (1), else (9)
If the image pickup in the window X is on the boundary d or h, there is no image pickup in the window F, and there is an image pickup in E ′ and no image pickup in G ′, the entire processing window is ½ pitch (in the d direction). 0.635 mm) move back to (1), otherwise (10) the image pickup in the window X is on the boundary d or h, and there is no image pickup in the window F, and E ′
If there is no image in G'and there is an image in G ', move the entire processing window by 1/2 pitch (0.635 mm) in the h direction and return to (1).
If not, (11) the index pin 4a cannot be detected, and the process ends as an error.

In the recognition processing of the index pin 4a, since the periphery of the index pin 4a is used as the detection processing field of view, the resolution at the time of processing is improved and the processing position is improved as compared with the method of using many signal pins 4 as the field of view. Since the LSI 3 rotates and moves, the index pin 4a can be recognized by the same recognition algorithm.

FIG. 13 shows the suction of the suction hand according to the method of the present invention.
FIG. 9 is an explanatory diagram of a method of correcting the attitude (orientation) of the LSI,
LS from the pin tip image of the LSI 3 sucked by the suction hand 6.
To detect the posture of I3, the imaging field of view (memory frame
2) The binarized image of pin 4 in
Within each of the multiple windows 76 that divide the
Obtain the XY coordinates of the center of gravity 77 of the image and
Coordinate O with corner O as origin O _xyIt is represented by.

From the XY coordinate values of the plurality of center of gravity points 77, the X axis
Direction and Y axis direction straight line L_-1And L _-2And by linear regression
Find, straight line L_-1And L_-2The intersection point P of the
With the origin as the straight line L_-1And L_-2Is the x-axis and y-axis, and LSI
The xy coordinates lx and ly of the center point Q of 3 are obtained.

The X-axis and the Y-axis are orthogonal to each other, but the straight lines L _-1 and L _-2 are not necessarily orthogonal to each other. Therefore, the straight line L _{-1 is used.}
An allowable error is set in advance at the intersection angle between L ₋₂ and L ₋₂ , and the LSI 3 deviating from the allowable error is treated as a defective product.

Therefore, when the center point Q on the xy coordinates with the intersection point P as the origin is replaced with the XY coordinates with the origin O, when the intersection angle between the X axis and the x axis is θ,

[0047]

[Equation 1]

It becomes Therefore, when the detected center position of the LSI 3 is d, the deviation of the center point Q deviated from the reference position S when the X axis coincides with the x axis,

[0049]

[Equation 2]

Is calculated by Therefore, in order to correct the deviation d of the LSI 3 by the robot unit 7, the LSI 3 (suction hand 6) is rotated about the reference position S by −θ. Then, d moves to d'and its correction amount d '
Is

[0051]

[Equation 3]

It becomes The correction amounts θ and d ′ are transferred to the robot unit controller 64, and the controller 64 operates the suction hand 6 to correct the attitude of the LSI 3.

FIG. 14 is an explanatory diagram of a second embodiment of the attitude correction of the LSI. After detecting the first positional deviation d in the upper right corner of the LSI 3, the LSI 3 is detected based on the detected information.
The misregistration is corrected, and the second misregistration is detected for the position (for example, the lower left corner of the LSI 3) where the misregistration is detected for the second time.

As described above, the LSI according to the present invention
The positional deviation correction of 3 does not need to detect all the signal pins 4 protruding from the LSI 3, which allows the imaging field of view to be narrowed (magnification can be increased), thus enabling detection (recognition) with high resolution. ..

[0055]

As described above, the automatic LSI of the present invention
The mounting machine enables automatic mounting of a PGA type LSI, and the LSI detection method according to the method of the present invention is a PG
Accurate mounting of type A LSI ensures high reliability. Furthermore, by backing up the backside of the LSI mounting board at multiple points using backup pins, the effect that the LSI can be automatically mounted on the board on which components are mounted on the backside and the board with low mechanical strength is achieved. is there.

[Brief description of drawings]

FIG. 1 is a perspective view showing an overall configuration of an automatic LSI mounting machine according to an embodiment of the present invention.

FIG. 2 is a detailed view of the first optical system unit shown in FIG.

3 is a perspective view of the suction hand moving robot unit shown in FIG. 1. FIG.

4 is an explanatory diagram of a mounting configuration of the suction hand shown in FIG.

5 is an explanatory diagram of a mounting configuration of a second optical system unit shown in FIG.

6 is a perspective view of the substrate holder unit shown in FIG.

7 is an explanatory diagram of a configuration for fixing an LSI mounting substrate to the substrate holder unit of FIG.

FIG. 8 is an explanatory diagram of a method of recognizing an adsorption LSI according to the method of the present invention.

9 is an explanatory diagram of the laser light source shown in FIG.

FIG. 10 is a plan view of an example in which laser light is irradiated onto the LSI from four directions.

FIG. 11 is a grayscale histogram of the pin tip portion image.

FIG. 12 is an explanatory diagram of an index pin image detection window.

FIG. 13 is an explanatory diagram of attitude correction of an LSI according to an embodiment of the method of the present invention.

FIG. 14 is an explanatory diagram of a second embodiment of attitude correction of an LSI.

FIG. 15 is an external view of an LSI.

[Explanation of symbols]

3 is a PGA type LSI 4 is a signal pin 4a is an index pin 6 is a suction hand 7 is a robot unit 8 is an LSI stocker unit 11 is a substrate holder unit 12 is a first optical system unit 13 is a second optical system unit 22 The image pickup device 42 of the first optical system unit is a substrate 44, 52 on which an LSI is mounted, a base 45 for supporting the LSI mounting substrate, a pin 61 for backing up the LSI mounting substrate, a laser device 62, a slit-shaped laser beam 63 Image processing device A of optical system unit A to H, X are small windows for detecting the position of the index pin

Front page continuation (72) Inventor Hitoshi Kataoka 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa, Fujitsu Limited ) Inventor Satoshi Emoto 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited

Claims (4)

[Claims] 1. A plurality of PGAs (pinglit array)
An LSI stocker unit (8) for storing type LSIs (3) by type, and a suction hand for sucking the upper surface of one predetermined LSI (3) taken out from the stocker unit (8)
(6), a robot unit (7) for moving the suction hand (6) in three directions of left, right, front and back, and up and down, and rotating the suction hand (6) around its vertical axis, the robot unit (7) The array of signal pins (4) protruding from the lower surface of the suction LSI (3) of the suction hand (6) and the index pin (4
The first optical system unit (12) for detecting the position of a), LS
A substrate holder unit (11) for fixing the I mounting board (42) and a second optical system unit (13) for detecting an LSI mounting position mark provided on the mounting board (42) are provided. The system unit (12) includes a light source that laterally illuminates the tip of the signal pin (4) and the index pin (4a), and a signal pin (4) and an index pin (4a) of the LSI (3). An image pickup device (22) for picking up an image, and the robot unit (7) includes the first optical system unit.
By the arrangement information of the signal pin (4) detected by (12) and the position information of the index pin (4a) and the position mark detected by the second optical system unit (13),
A control unit (64) for operating the robot unit (7), and the substrate holder unit (7) is provided with a support table (44, 44) for supporting the two peripheral edges of the mounting substrate (42). 52) and the mounting board
A clamp (56) for pressing the other peripheral end of the other side of the (42) from above is provided, and a plurality of backup pins (45) with which the back surface of the mounting substrate (42) is in contact and which is detachable. An automatic LSI mounting device characterized by the above. 2. The first optical system unit (1) according to claim 1.
In 2), a laser device (61) is used as the light source, and a laser beam (62) emitted from the laser device (61) is appropriately applied to the lower surface of the LSI (3) adsorbed by the adsorption hand (6). Detecting the mounted LSI in an automatic LSI mounting device, characterized in that it has a slit shape inclined at various angles and illuminates only the tip of the pin (4) and index pin (4a) derived from the lower surface of the LSI (3). Method. 3. The LSI sucked by the suction hand (6)
When detecting the position of the index pin (4a) of (3) using the first optical system unit (12) according to claim 2, an index pin image detection window is provided in the first optical system unit (12). ) Image processing device (63), the window has a configuration in which a plurality of small windows (A to H) surround the small window (X) where the index pin image should be located in a matrix, 3. The method of detecting a mounted LSI in an automatic LSI mounting apparatus according to claim 2, wherein when the index pin image is displaced with respect to the central small window (X), the window is moved in the displaced direction. 4. The LSI sucked by the suction hand (6)
The correct position of the center of (3) is taught to the image processing device (63) in advance, and the signal of the LSI (3) is output by using the first optical system unit (12) and the image processing device (63). The arrangement of the pins (4) is detected, the actual position of the center of the LSI (3) is calculated from the detection information, and the robot unit (7) is arranged so that the actual position of the center overlaps with the accurate position of the center. 3. The method for detecting an on-board LSI in an automatic LSI on-board device according to claim 2, wherein the control section is operated.