DE69837308D1 - Verfahren zur Herstellung eines Durchgangslochs und Siliziumsubstrat mit einem solchen Durchgangsloch - Google Patents

Verfahren zur Herstellung eines Durchgangslochs und Siliziumsubstrat mit einem solchen Durchgangsloch

Info

Publication number
DE69837308D1
DE69837308D1 DE69837308T DE69837308T DE69837308D1 DE 69837308 D1 DE69837308 D1 DE 69837308D1 DE 69837308 T DE69837308 T DE 69837308T DE 69837308 T DE69837308 T DE 69837308T DE 69837308 D1 DE69837308 D1 DE 69837308D1
Authority
DE
Germany
Prior art keywords
making
silicon substrate
silicon
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69837308T
Other languages
English (en)
Other versions
DE69837308T2 (de
Inventor
Norio Ohkuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69837308D1 publication Critical patent/DE69837308D1/de
Publication of DE69837308T2 publication Critical patent/DE69837308T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00087—Holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/052—Ink-jet print cartridges

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Weting (AREA)
DE69837308T 1997-06-20 1998-06-18 Verfahren zur Herstellung eines Durchgangslochs und Siliziumsubstrat mit einem solchen Durchgangsloch Expired - Lifetime DE69837308T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16449997A JP3416468B2 (ja) 1997-06-20 1997-06-20 Ｓｉ異方性エッチング方法、インクジェットヘッド、及びその製造方法
JP16449997 1997-06-20

Publications (2)

Publication Number Publication Date
DE69837308D1 true DE69837308D1 (de) 2007-04-26
DE69837308T2 DE69837308T2 (de) 2007-12-20

Family

ID=15794329

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69837308T Expired - Lifetime DE69837308T2 (de) 1997-06-20 1998-06-18 Verfahren zur Herstellung eines Durchgangslochs und Siliziumsubstrat mit einem solchen Durchgangsloch

Country Status (4)

Country Link
US (1) US6107209A (de)
EP (1) EP0886307B1 (de)
JP (1) JP3416468B2 (de)
DE (1) DE69837308T2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6273557B1 (en) * 1998-03-02 2001-08-14 Hewlett-Packard Company Micromachined ink feed channels for an inkjet printhead
CN1314246A (zh) * 2000-03-21 2001-09-26 日本电气株式会社 喷墨头及其制造方法
US6555480B2 (en) * 2001-07-31 2003-04-29 Hewlett-Packard Development Company, L.P. Substrate with fluidic channel and method of manufacturing
DE60222969T2 (de) 2001-08-10 2008-07-24 Canon K.K. Verfahren zur Herstellung eines Flüssigkeitsausstosskopfes, Substrat für einen Flüssigkeitsausstosskopf und dazugehöriges Herstellungsverfahren
US7105097B2 (en) * 2002-01-31 2006-09-12 Hewlett-Packard Development Company, L.P. Substrate and method of forming substrate for fluid ejection device
US6554403B1 (en) 2002-04-30 2003-04-29 Hewlett-Packard Development Company, L.P. Substrate for fluid ejection device
US6981759B2 (en) 2002-04-30 2006-01-03 Hewlett-Packard Development Company, Lp. Substrate and method forming substrate for fluid ejection device
US6648454B1 (en) 2002-10-30 2003-11-18 Hewlett-Packard Development Company, L.P. Slotted substrate and method of making
US6880926B2 (en) * 2002-10-31 2005-04-19 Hewlett-Packard Development Company, L.P. Circulation through compound slots
US6821450B2 (en) * 2003-01-21 2004-11-23 Hewlett-Packard Development Company, L.P. Substrate and method of forming substrate for fluid ejection device
US6910758B2 (en) 2003-07-15 2005-06-28 Hewlett-Packard Development Company, L.P. Substrate and method of forming substrate for fluid ejection device
US7429335B2 (en) * 2004-04-29 2008-09-30 Shen Buswell Substrate passage formation
JP4617751B2 (ja) * 2004-07-22 2011-01-26 株式会社Ｓｕｍｃｏ シリコンウェーハおよびその製造方法
US7214324B2 (en) * 2005-04-15 2007-05-08 Delphi Technologies, Inc. Technique for manufacturing micro-electro mechanical structures
US7824560B2 (en) 2006-03-07 2010-11-02 Canon Kabushiki Kaisha Manufacturing method for ink jet recording head chip, and manufacturing method for ink jet recording head
JP4854336B2 (ja) * 2006-03-07 2012-01-18 キヤノン株式会社 インクジェットヘッド用基板の製造方法
JP4480182B2 (ja) * 2007-09-06 2010-06-16 キヤノン株式会社 インクジェット記録ヘッド用基板及びインクジェット記録ヘッドの製造方法
WO2010044741A1 (en) * 2008-10-15 2010-04-22 ÅAC Microtec AB Method for making via interconnection
KR101518733B1 (ko) 2008-11-27 2015-05-11 삼성전자주식회사 노즐 플레이트 및 그 제조방법
US20110020966A1 (en) * 2009-07-23 2011-01-27 Canon Kabushiki Kaisha Method for processing silicon substrate and method for producing substrate for liquid ejecting head
JP5814654B2 (ja) * 2010-07-27 2015-11-17 キヤノン株式会社 シリコン基板の加工方法及び液体吐出ヘッドの製造方法
CN104599964B (zh) * 2015-01-22 2017-06-23 清华大学 体硅湿法深刻蚀的保护方法
CN110501365A (zh) * 2019-03-12 2019-11-26 厦门超新芯科技有限公司 一种原位加热芯片及其制作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4007484A (en) * 1973-07-31 1977-02-08 Sony Corporation Magnetic recording and/or reproducing apparatus with chrominance crosstalk elimination
US4007464A (en) * 1975-01-23 1977-02-08 International Business Machines Corporation Ink jet nozzle
US4312008A (en) * 1979-11-02 1982-01-19 Dataproducts Corporation Impulse jet head using etched silicon
US4277884A (en) * 1980-08-04 1981-07-14 Rca Corporation Method for forming an improved gate member utilizing special masking and oxidation to eliminate projecting points on silicon islands
US4961821A (en) * 1989-11-22 1990-10-09 Xerox Corporation Ode through holes and butt edges without edge dicing
US5141596A (en) * 1991-07-29 1992-08-25 Xerox Corporation Method of fabricating an ink jet printhead having integral silicon filter

Also Published As

Publication number Publication date
EP0886307A2 (de) 1998-12-23
US6107209A (en) 2000-08-22
JPH1110896A (ja) 1999-01-19
JP3416468B2 (ja) 2003-06-16
EP0886307A3 (de) 1999-10-27
DE69837308T2 (de) 2007-12-20
EP0886307B1 (de) 2007-03-14

Similar Documents

Publication Publication Date Title
DE69837308D1 (de) Verfahren zur Herstellung eines Durchgangslochs und Siliziumsubstrat mit einem solchen Durchgangsloch
DE69631233D1 (de) Verfahren zur Herstellung eines Halbleitersubstrats
DE69528611D1 (de) Verfahren zur Herstellung eines Halbleitersubstrates
DE69733393D1 (de) Übertragungsschicht und Verfahren zur Herstellung eines Musters
DE69636618D1 (de) Verfahren zur behandlung einer substratoberfläche und behandlungsmittel hierfür
DE69627215D1 (de) Verfahren zur Herstellung eines Halbleiterbauelements
DE59403587D1 (de) Beschichtungsmaterial und Verfahren zur Herstellung funktioneller Beschichtungen
DE69515189D1 (de) SOI-Substrat und Verfahren zur Herstellung
DE69333152D1 (de) Verfahren zur Herstellung eines Halbleitersubstrates
DE69331815D1 (de) Verfahren zur Herstellung eines Halbleitersubstrates
DE69713013D1 (de) Gegossener Flächenhaftverschluss und Verfahren zur Herstellung solch eines Verschlusses
DE69331816D1 (de) Verfahren zur Herstellung eines Halbleitersubstrats
DE69727039D1 (de) Verfahren zur Isolierung einer Proteinzusammensetzung aus einem Muskelsubstrat und Proteinzusammensetzung
DE69514201D1 (de) Verfahren zur Herstellung eines Halbleiterbauelements
DE69503285D1 (de) Diamantwafer und Verfahren zur Herstellung eines Diamantwafers
DE69635445T2 (de) Alkalialuminiumhydroxycarbonatzusammensetzung und verfahren zur herstellung
DE69821429D1 (de) Vorrichtung und Verfahren zur Herstellung einer Dünnschicht einer Verbindung
DE69630924D1 (de) Flüssige Zusammensetzung und Verfahren zur Bildung einer rostsicheren Schicht
DE69305939D1 (de) Verfahren zur Herstellung eines keramischen Schaltungssubstrates
DE69631579D1 (de) Nichtflüchtige Halbleiteranordnung und Verfahren zur Herstellung
DE69811658D1 (de) Aus quanteninseln gemachte anordnung und verfahren zur herstellung
DE69702825D1 (de) Verfahren und Vorrichtung zur Fotolackbeschichtung eines Substrats
DE59812923D1 (de) Vorrichtung und verfahren zur herstellung einer chip-substrat-verbindung
DE69309358D1 (de) Verfahren zur Herstellung eines Schaltungssubstrats
DE69837232D1 (de) Belichtungsverfahren und Verfahren zur Herstellung einer Vorrichtung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition