DE69834785D1 - Elektrolytisches Verfahren zum Aufbringen einer stabilisierenden Zink-Crom-Schicht - Google Patents

Elektrolytisches Verfahren zum Aufbringen einer stabilisierenden Zink-Crom-Schicht

Info

Publication number
DE69834785D1
DE69834785D1 DE69834785T DE69834785T DE69834785D1 DE 69834785 D1 DE69834785 D1 DE 69834785D1 DE 69834785 T DE69834785 T DE 69834785T DE 69834785 T DE69834785 T DE 69834785T DE 69834785 D1 DE69834785 D1 DE 69834785D1
Authority
DE
Germany
Prior art keywords
crom
applying
layer
electrolytic process
stabilizing zinc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69834785T
Other languages
English (en)
Other versions
DE69834785T8 (de
DE69834785T2 (de
Inventor
Chin-Ho Lee
Edward Czapor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Electronics Inc
Original Assignee
Gould Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Electronics Inc filed Critical Gould Electronics Inc
Application granted granted Critical
Publication of DE69834785D1 publication Critical patent/DE69834785D1/de
Publication of DE69834785T2 publication Critical patent/DE69834785T2/de
Publication of DE69834785T8 publication Critical patent/DE69834785T8/de
Active legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/38—Chromatising
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/04—Electrolytic coating other than with metals with inorganic materials
    • C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Push-Button Switches (AREA)
  • Laminated Bodies (AREA)
DE69834785T 1997-09-04 1998-08-19 Elektrolytisches Verfahren zum Aufbringen einer stabilisierenden Zink-Crom-Schicht Active DE69834785T8 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US923566 1997-09-04
US08/923,566 US5908544A (en) 1997-09-04 1997-09-04 Zinc-chromium stabilizer containing a hydrogen inhibiting additive

Publications (3)

Publication Number Publication Date
DE69834785D1 true DE69834785D1 (de) 2006-07-20
DE69834785T2 DE69834785T2 (de) 2007-05-16
DE69834785T8 DE69834785T8 (de) 2007-09-13

Family

ID=25448891

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69834785T Active DE69834785T8 (de) 1997-09-04 1998-08-19 Elektrolytisches Verfahren zum Aufbringen einer stabilisierenden Zink-Crom-Schicht

Country Status (7)

Country Link
US (2) US5908544A (de)
EP (1) EP0903426B1 (de)
JP (1) JP3072839B2 (de)
KR (1) KR100325989B1 (de)
CN (1) CN1234915C (de)
DE (1) DE69834785T8 (de)
TW (1) TW432126B (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6132589A (en) * 1998-09-10 2000-10-17 Ga-Tek Inc. Treated copper foil and process for making treated copper foil
US6299721B1 (en) * 1998-12-14 2001-10-09 Gould Electronics Incl Coatings for improved resin dust resistance
DE19944185A1 (de) * 1999-09-15 2001-03-29 Xcellsis Gmbh Vorrichtung zur Durchführung einer heterogen katalysierten Reaktion und Verfahren zu deren Herstellung
US6489034B1 (en) * 2000-02-08 2002-12-03 Gould Electronics Inc. Method of forming chromium coated copper for printed circuit boards
US6489035B1 (en) 2000-02-08 2002-12-03 Gould Electronics Inc. Applying resistive layer onto copper
US20020182432A1 (en) * 2000-04-05 2002-12-05 Masaru Sakamoto Laser hole drilling copper foil
WO2001095683A1 (en) * 2000-06-08 2001-12-13 World Properties Inc. Method of manufacturing circuit laminates
WO2002049405A2 (en) 2000-08-15 2002-06-20 World Properties, Inc. Multi-layer circuits and methods of manufacture thereof
US6622374B1 (en) 2000-09-22 2003-09-23 Gould Electronics Inc. Resistor component with multiple layers of resistive material
US6929826B1 (en) * 2002-02-19 2005-08-16 The United States Of America As Represented By The Secretary Of The Air Force Self-assembled nano-phase particle surface treatments for corrosion protection
US20040108211A1 (en) * 2002-12-06 2004-06-10 Industrial Technology Research Institute Surface treatment for a wrought copper foil for use on a flexible printed circuit board (FPCB)
US7655126B2 (en) * 2006-03-27 2010-02-02 Federal Mogul World Wide, Inc. Fabrication of topical stopper on MLS gasket by active matrix electrochemical deposition
US9138964B2 (en) * 2010-11-22 2015-09-22 Mitsui Mining & Smelting Co., Ltd Surface-treated copper foil
WO2012132593A1 (ja) 2011-03-31 2012-10-04 Jx日鉱日石金属株式会社 電気抵抗層を備えた金属箔及び同金属箔を用いたプリント回路用基板
CN104779367A (zh) * 2014-01-15 2015-07-15 金居开发铜箔股份有限公司 耐热性锂电池用铜箔及其制造方法
JP6357336B2 (ja) * 2014-03-31 2018-07-11 三井金属鉱業株式会社 電解銅箔、キャリア箔付電解銅箔及びプリント配線板
CN110318076A (zh) * 2019-07-17 2019-10-11 安徽启明表面技术有限公司 镀锌光亮剂的制备方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587077B2 (ja) 1979-12-19 1983-02-08 日本鉱業株式会社 印刷回路用銅箔およびその製造方法
US4387006A (en) * 1981-07-08 1983-06-07 Fukuda Metal Foil & Powder Co., Ltd. Method of treating the surface of the copper foil used in printed wire boards
JPS6167796A (ja) 1984-09-07 1986-04-07 Nippon Denkai Kk プリント回路用銅箔およびその製造方法
US4572768A (en) 1985-06-28 1986-02-25 Square D Company Treatment for copper foil
EP0285931B1 (de) 1987-03-31 1993-08-04 Nippon Steel Corporation Korrosionsbeständiges plattiertes Stahlband und Verfahren zu seiner Herstellung
US5098796A (en) * 1989-10-13 1992-03-24 Olin Corporation Chromium-zinc anti-tarnish coating on copper foil
US5071520A (en) * 1989-10-30 1991-12-10 Olin Corporation Method of treating metal foil to improve peel strength
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
WO1991019024A1 (en) * 1990-05-30 1991-12-12 Gould, Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
KR100297179B1 (ko) 1990-07-02 2002-12-26 올린 코포레이션 구리또는구리계합금호일을크롬-아년이온으로전착처리하여당해호일에내변색성을부여하는방법및구리또는구리계합금호일에변색방지막을전착시키기위한염기성전해질수용액
US5017271A (en) * 1990-08-24 1991-05-21 Gould Inc. Method for printed circuit board pattern making using selectively etchable metal layers
US5338619A (en) 1991-05-16 1994-08-16 Fukuda Metal Foil And Powder Co., Ltd. Copper foil for printed circuits and method of producing same
TW230290B (de) * 1991-11-15 1994-09-11 Nikko Guruder Foreer Kk
JPH05299834A (ja) * 1992-04-22 1993-11-12 Furukawa Saakitsuto Foil Kk プリント配線板用銅箔
JP2717911B2 (ja) * 1992-11-19 1998-02-25 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
US5332486A (en) * 1993-01-29 1994-07-26 Gould Electronics Inc. Anti-oxidant coatings for copper foils
US5552234A (en) 1993-03-29 1996-09-03 Japan Energy Corporation Copper foil for printed circuits
US5447619A (en) * 1993-11-24 1995-09-05 Circuit Foil Usa, Inc. Copper foil for the manufacture of printed circuit boards and method of producing the same
US6086743A (en) * 1997-08-06 2000-07-11 Gould Electronics, Inc. Adhesion enhancement for metal foil
JPH1154884A (ja) 1997-08-06 1999-02-26 Nec Corp 半導体装置の実装構造

Also Published As

Publication number Publication date
DE69834785T8 (de) 2007-09-13
DE69834785T2 (de) 2007-05-16
CN1213713A (zh) 1999-04-14
KR19990029505A (ko) 1999-04-26
CN1234915C (zh) 2006-01-04
EP0903426B1 (de) 2006-06-07
JPH11140683A (ja) 1999-05-25
EP0903426A3 (de) 2000-07-19
JP3072839B2 (ja) 2000-08-07
EP0903426A2 (de) 1999-03-24
TW432126B (en) 2001-05-01
US6168703B1 (en) 2001-01-02
US5908544A (en) 1999-06-01
KR100325989B1 (ko) 2002-09-09

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Legal Events

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8364 No opposition during term of opposition