DE69831394D1 - Ic-karte - Google Patents

Ic-karte

Info

Publication number
DE69831394D1
DE69831394D1 DE69831394T DE69831394T DE69831394D1 DE 69831394 D1 DE69831394 D1 DE 69831394D1 DE 69831394 T DE69831394 T DE 69831394T DE 69831394 T DE69831394 T DE 69831394T DE 69831394 D1 DE69831394 D1 DE 69831394D1
Authority
DE
Germany
Prior art keywords
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69831394T
Other languages
English (en)
Other versions
DE69831394T2 (de
Inventor
Satoru Sugiyama
Toyoji Kanazawa
Tetsuo Satoh
Mikio Yamaguchi
Masahi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Publication of DE69831394D1 publication Critical patent/DE69831394D1/de
Application granted granted Critical
Publication of DE69831394T2 publication Critical patent/DE69831394T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
DE69831394T 1997-10-16 1998-10-15 Ic-karte Expired - Fee Related DE69831394T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP28408797A JP3914620B2 (ja) 1997-10-16 1997-10-16 Ｉｃカード
JP28408797 1997-10-16
PCT/JP1998/004668 WO1999021132A1 (en) 1997-10-16 1998-10-15 Ic card

Publications (2)

Publication Number Publication Date
DE69831394D1 true DE69831394D1 (de) 2005-10-06
DE69831394T2 DE69831394T2 (de) 2006-06-01

Family

ID=17674081

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69831394T Expired - Fee Related DE69831394T2 (de) 1997-10-16 1998-10-15 Ic-karte

Country Status (5)

Country Link
US (1) US6166914A (de)
EP (1) EP0952545B1 (de)
JP (1) JP3914620B2 (de)
DE (1) DE69831394T2 (de)
WO (1) WO1999021132A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG80077A1 (en) * 1998-10-19 2001-04-17 Sony Corp Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card
FR2799857A1 (fr) * 1999-10-14 2001-04-20 Gemplus Card Int Procede pour le renforcement d'un module de circuit integre de carte a puce
FR2806189B1 (fr) * 2000-03-10 2002-05-31 Schlumberger Systems & Service Circuit integre renforce et procede de renforcement de circuits integres
US20050145609A1 (en) * 2001-02-26 2005-07-07 John Gregory Method of forming an opening or cavity in a substrate for receiving an electronic component
JP4802398B2 (ja) * 2001-06-08 2011-10-26 凸版印刷株式会社 非接触ｉｃカード
JP2003058853A (ja) * 2001-08-17 2003-02-28 Toppan Forms Co Ltd 非接触型ｉｃカード及びその製造方法
DE10200382B4 (de) * 2002-01-08 2006-05-04 Infineon Technologies Ag Chipmodul für Chipkarten
FR2838850B1 (fr) * 2002-04-18 2005-08-05 Framatome Connectors Int Procede de conditionnement de microcircuits electroniques pour carte a puce et microcircuit electronique ainsi obtenu
TWI299559B (en) * 2002-06-19 2008-08-01 Inpaq Technology Co Ltd Ic substrate with over voltage protection function and method for manufacturing the same
MY148205A (en) * 2003-05-13 2013-03-15 Nagraid Sa Process for assembling an electronic component on a substrate
JP2005122678A (ja) * 2003-09-26 2005-05-12 Toshiba Corp 携帯可能電子装置
TWI249232B (en) * 2004-10-20 2006-02-11 Siliconware Precision Industries Co Ltd Heat dissipating package structure and method for fabricating the same
WO2007056503A2 (en) * 2005-11-08 2007-05-18 Macsema, Inc. Information devices
US7680625B2 (en) * 2005-11-14 2010-03-16 Macsema, Inc. Systems and methods for monitoring system performance
US7908118B2 (en) * 2005-11-14 2011-03-15 Macsema, Inc. System and methods for testing, monitoring, and replacing equipment
US20080106415A1 (en) * 2006-11-08 2008-05-08 Macsema, Inc. Information tag
JP4883175B2 (ja) * 2007-03-23 2012-02-22 富士通株式会社 電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法
EP2420960A1 (de) * 2010-08-17 2012-02-22 Gemalto SA Verfahren zur Herstellung einer elektronischen Vorrichtung, die ein nicht demontierbares Modul umfasst, und so erhaltene Vorrichtung
JP2013206122A (ja) * 2012-03-28 2013-10-07 Toppan Printing Co Ltd Ｉｃモジュールとこれを搭載したｉｃカード
EP2731058A1 (de) * 2012-11-13 2014-05-14 Gemalto SA Verfahren zur Herstellung eines elektronischen Chip-Moduls gegen elektrostatische Entladungen
EP3836010A1 (de) 2019-12-12 2021-06-16 Fingerprint Cards AB Biometrisches sensormodul zur integration von karten

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62201295A (ja) * 1986-02-28 1987-09-04 松下電器産業株式会社 Ｉｃカ−ドおよびその製造方法
US4803546A (en) * 1986-09-17 1989-02-07 Fujitsu Limited Heatsink package for flip-chip IC
JPS6440397A (en) * 1987-08-07 1989-02-10 Dainippon Printing Co Ltd Portable electronic device
JPH01184193A (ja) * 1988-01-19 1989-07-21 Mitsubishi Electric Corp 薄型半導体カード
DE69018846T2 (de) * 1989-02-10 1995-08-24 Fujitsu Ltd Keramische Packung vom Halbleiteranordnungstyp und Verfahren zum Zusammensetzen derselben.
JP2772739B2 (ja) * 1991-06-20 1998-07-09 いわき電子株式会社 リードレスパッケージの外部電極構造及びその製造方法
US5581445A (en) * 1994-02-14 1996-12-03 Us3, Inc. Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module
JPH08267973A (ja) * 1995-03-30 1996-10-15 Toppan Printing Co Ltd Ｉｃカード
AU704645B2 (en) * 1995-04-13 1999-04-29 Dainippon Printing Co. Ltd. IC card and IC module
DE19640466B4 (de) * 1996-09-30 2006-06-14 Robert Bosch Gmbh Metallisches Trägerteil für elektronische Bauelemente oder Schaltungsträger und Verfahren zur Herstellung desselben

Also Published As

Publication number Publication date
WO1999021132A1 (en) 1999-04-29
US6166914A (en) 2000-12-26
EP0952545B1 (de) 2005-08-31
JPH11115356A (ja) 1999-04-27
EP0952545A1 (de) 1999-10-27
EP0952545A4 (de) 2001-04-18
DE69831394T2 (de) 2006-06-01
JP3914620B2 (ja) 2007-05-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee