DE69826941D1 - Bonddrahtspindelbehälter - Google Patents

Bonddrahtspindelbehälter

Info

Publication number
DE69826941D1
DE69826941D1 DE1998626941 DE69826941T DE69826941D1 DE 69826941 D1 DE69826941 D1 DE 69826941D1 DE 1998626941 DE1998626941 DE 1998626941 DE 69826941 T DE69826941 T DE 69826941T DE 69826941 D1 DE69826941 D1 DE 69826941D1
Authority
DE
Germany
Prior art keywords
bonding wire
wire spool
spool case
case
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1998626941
Other languages
English (en)
Other versions
DE69826941T2 (de
Inventor
Tadao Anjo
Osamu Sato
Toshio Kaji
Keiichi Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Publication of DE69826941D1 publication Critical patent/DE69826941D1/de
Application granted granted Critical
Publication of DE69826941T2 publication Critical patent/DE69826941T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C47/00—Winding-up, coiling or winding-off metal wire, metal band or other flexible metal material characterised by features relevant to metal processing only
    • B21C47/28—Drums or other coil-holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/02—Containers, packaging elements or packages, specially adapted for particular articles or materials for annular articles
    • B65D85/04—Containers, packaging elements or packages, specially adapted for particular articles or materials for annular articles for coils of wire, rope or hose
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H49/00—Unwinding or paying-out filamentary material; Supporting, storing or transporting packages from which filamentary material is to be withdrawn or paid-out
    • B65H49/38—Skips, cages, racks, or containers, adapted solely for the transport or storage of bobbins, cops, or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H67/00—Replacing or removing cores, receptacles, or completed packages at paying-out, winding, or depositing stations
    • B65H67/06—Supplying cores, receptacles, or packages to, or transporting from, winding or depositing stations
    • B65H67/064—Supplying or transporting cross-wound packages, also combined with transporting the empty core
    • B65H67/065—Manipulators with gripping or holding means for transferring the packages from one station to another, e.g. from a conveyor to a creel trolley
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04—Kinds or types
    • B65H75/08—Kinds or types of circular or polygonal cross-section
    • B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
    • B65H75/141—Kinds or types of circular or polygonal cross-section with two end flanges covers therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2402/00—Constructional details of the handling apparatus
    • B65H2402/40—Details of frames, housings or mountings of the whole handling apparatus
    • B65H2402/41—Portable or hand-held apparatus
    • B65H2402/414—Manual tools for filamentary material, e.g. for mounting or removing a bobbin, measuring tension or splicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/30—Handled filamentary material
    • B65H2701/36—Wires
    • B65H2701/361—Semiconductor bonding wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Wire Bonding (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
DE1998626941 1997-08-08 1998-08-10 Bonddrahtspindelbehälter Expired - Lifetime DE69826941T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP21478397 1997-08-08
JP21478397A JP2826307B1 (ja) 1997-08-08 1997-08-08 ボンディングワイヤ用スプールケース

Publications (2)

Publication Number Publication Date
DE69826941D1 true DE69826941D1 (de) 2004-11-18
DE69826941T2 DE69826941T2 (de) 2005-07-21

Family

ID=16661474

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1998626941 Expired - Lifetime DE69826941T2 (de) 1997-08-08 1998-08-10 Bonddrahtspindelbehälter

Country Status (8)

Country Link
US (1) US6241094B1 (de)
JP (1) JP2826307B1 (de)
KR (1) KR100301092B1 (de)
CN (1) CN1185699C (de)
DE (1) DE69826941T2 (de)
MY (1) MY124645A (de)
SG (1) SG73542A1 (de)
TW (1) TW411542B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100398831B1 (ko) * 2001-10-12 2003-09-19 헤라우스오리엔탈하이텍 주식회사 본딩 와이어용 스풀 케이스 및 이 케이스를 사용한 스풀취급 방법
KR100398832B1 (ko) * 2001-10-31 2003-09-19 헤라우스오리엔탈하이텍 주식회사 본딩 와이어용 스풀 케이스 및 이 케이스를 사용한 스풀취급 방법
KR100431472B1 (ko) * 2001-11-27 2004-05-22 헤라우스오리엔탈하이텍 주식회사 스풀용 그립퍼, 이 그립퍼를 갖는 스풀 취급 수단 및 이를 이용한 스풀 취급 방법
CA2435015A1 (en) * 2003-07-11 2005-01-11 Keith Thiessen Storage device for coiled articles
US7275708B2 (en) * 2004-06-30 2007-10-02 Richard Paul Lewis Dispenser for rolled sheet material
US10541160B2 (en) * 2009-12-29 2020-01-21 Nikon Corporation Substrate case and substrate accommodation apparatus
CN105314261B (zh) * 2015-11-17 2018-10-02 武汉汉麻生物科技有限公司 一种纱线筒包装

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1640368A (en) * 1926-12-13 1927-08-30 Us Asbestos Company Asbestos rope or wick package
US2867319A (en) * 1955-10-06 1959-01-06 Continental Can Co Strand packaging method and means
US3552551A (en) * 1969-03-05 1971-01-05 Goldberg Brothers Inc Film reel shipping case
US3612233A (en) * 1969-07-24 1971-10-12 Memorex Corp Injection-molded one-piece plastic carrying case with integral hinge and dust seal
US3693905A (en) * 1971-07-26 1972-09-26 Berkley & Co Inc Display for filamentary product with mutually adjacent segments having contrasting colors
JPS6043519B2 (ja) 1981-09-02 1985-09-28 発研株式会社 トンネル内壁の如き曲面を做い切削する方法と、做い案内装置
US4903833A (en) * 1988-10-17 1990-02-27 The Mead Corporation Cartridge for web-type media material
DE4038011A1 (de) * 1990-11-29 1992-06-04 Du Pont Deutschland Verpackung fuer einzelne gegenstaende
US5205412A (en) * 1992-04-08 1993-04-27 Aurex, S.A. De C.V. Recyclable package for a stack of rolls of magnetic tape
JP2985598B2 (ja) 1993-09-10 1999-12-06 住友金属鉱山株式会社 半導体ボンディングワイヤー用スプールケース
JPH07161754A (ja) 1993-12-06 1995-06-23 Mitsubishi Materials Corp 半導体ボンディングワイヤーのスプール収納ケース
JP2679697B2 (ja) 1995-11-29 1997-11-19 株式会社日鉄マイクロメタル スプールケース
JPH10142743A (ja) * 1996-11-11 1998-05-29 Fuji Photo Film Co Ltd 写真フイルムパトローネ
JPH10326804A (ja) 1997-05-26 1998-12-08 Mitsubishi Materials Corp 半導体装置用ボンディングワイヤーのスプールケース

Also Published As

Publication number Publication date
TW411542B (en) 2000-11-11
JP2826307B1 (ja) 1998-11-18
KR19990023481A (ko) 1999-03-25
MY124645A (en) 2006-06-30
CN1208320A (zh) 1999-02-17
KR100301092B1 (ko) 2001-11-30
US6241094B1 (en) 2001-06-05
CN1185699C (zh) 2005-01-19
DE69826941T2 (de) 2005-07-21
SG73542A1 (en) 2000-06-20
JPH1167814A (ja) 1999-03-09

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